FEB 1–3, 2021 VIRTUAL EVENT Security and Privacy Ideas That Matter Grant applications due Tuesday, January 19, 2021 REGISTER NOW Enigma centers on a single track of engaging talks covering a wide range of topics in security and privacy. Our goal is to clearly explain emerging threats and defenses in the growing intersection of society …
Learn about new features in Ansys SIwave, including a DDR Wizard for automated PCB design, support for the Ansys Granta material library and differential net time domain crosstalk scan. Ansys Prime meshing is now available in Ansys Q3D, along with the breakthrough Ansys HFSS Mesh Fusion technology in 3D Layout. February 2, 2021 11 AM …
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This webinar showcases the latest release of Ansys Motor-CAD in Ansys 2021 R1, delivering a detailed look at its many new capabilities for multiphysics electric motor design. We will spotlight Motor-CAD’s powerful new features for design optimization, multiphysics analysis and system modeling for electric motors. February 3, 2021 11 AM EST / 4 PM GMT …
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Overview If you are working on creating and delivering innovative 5G communication systems, learn how to overcome the challenges to successfully design across chip, module, and board levels. This includes the design and analysis of gallium nitride (GaN)-based RF and microwave products from chip / module / PCB levels to take full advantage of GaN …
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Monarch has been the leader in self-service data preparation for over 30 years. With our newest release, Monarch 2020.1, we’ve added a variety of advanced analytics and reporting features, including a new native data connector to simplify your most difficult database workflow challenges. In continuing with our popular Monarch Spotlight Series, we will be covering …
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Ansys 2021 R1: What’s New For Granta Selector | First Session In this webinar, we highlight the new tools, features and data in our latest release of Ansys Granta Selector, to help you make smarter materials choices. Live demonstrations and case studies highlight the value this software can bring to your organization. February 4, 2021 …
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Thu, Feb 4, 2021 9:00 AM - 10:00 AM MST Random vibration is a significant contributor to fatigue failure mode of solder joints and leads in electronics. A considerable amount of time and effort has been devoted to predicting and preventing electronics failures due to vibration loads. This webinar will explore the various parameters that …
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Join your embedded community on the 4th of February for Embedded DevOps Summit, the first Perforce virtual user conference for the embedded software industry. View all tracks | View all presenters This one-day event is free for all attendees. Choose from a number of sessions on relevant categories, such as: Plan: Explore methodologies, tools, and practices that can help …
Theme: Cut Costs, Save Time, Reduce Risk Description: Choose sessions from experts around the globe — who will share their insights on how to improve the plan, create, and verify phases of embedded development. Visit our event page to see all the sessions and register! Join your embedded community on the 4th of February for Embedded DevOps Summit, the …
Learn about the latest innovations in Ansys Cloud in our most recent release, Ansys 2021 R1, including new hardware HPC configurations having up to 960 cores, interactive sessions with a supporting Nvidia GPU and new in-browser interactive access. February 9, 2021 11 AM EST / 4 PM GMT / 9:30 PM IST Venue: Online
As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be …
Wednesday, February 10, 2021 | 10:30 a.m. NYC | 3:30 p.m. London Mortgage Servicers using Black Knight face significant challenges around quickly and cost-effectively accessing lending and pre-payment risk. Mortgage Servicers rely on client and transactional data to evaluate pre-payment risk and execute on investor reporting, loss analysis, and servicing transfers. On platforms like Black …
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Profiling software on remote systems can be difficult. Discover how the Intel® VTune™ Profiler Server can simplify profiling of HPC clusters over low-bandwidth connections, making it easier to collect, analyze and share performance data. Read More Profiling software on remote systems, especially transient and cloud systems, can be difficult. Installation of drivers and collectors, low-bandwidth …
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Join us to build apps, hardware, and community as we bring the magic of TreeHacks to your doorstep! TreeHacks 2021 will be the 7th-ever iteration of TreeHacks. Our theme this year is hacking for the future: addressing deeply impactful problems and building creative, unique solutions. We’ve identified five global and technological challenges that we think …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts… What's New ISSCC 2021 is Going …
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3rd Annual Automotive Safety Online Summit 16th – 17thFebruary 2021 Zoom flagZoom ONLINE International automotive safety experts are here to discuss the latest innovations in automotive safety of the future mobility. The 3rd Annual Automotive Safety Online Summit brings industry leaders together to share their experiences, discuss emerging trends and technologies. Network with automotive industry …
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Mixed-signal simulations have unique challenges whether you're running from the command line or within the Cadence® Virtuoso® platform. Where are the interfaces between logic and electrical and are they behaving correctly? How do you visualize the analog and digital blocks of the design? Are the models and testbench components incorporated correctly in the simulation? How …
Continue reading "Improved Debug and Package Handling for Mixed-Signal Verification"
If you want to improve your MPI application performance, this webinar is for you. Find out how a cross-architecture, multi-fabric, message-passing library can help your apps perform better on HPC clusters. Read More Message Passing Interface (MPI) is a powerful library standard that allows for the parallel execution of applications across multiple processors on a …
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Date: February 17, 2021 Time: 10:00 AM PST The next generation of processor cores such as the latest Arm® cores continue to get larger and more complex with challenging power targets. To achieve these targets, addressing power integrity at the very end of the place & route step can result in late-stage ECOs and/or change …
Time: 11:00 AM – 12:00 PM (PT) Abstract: ALINT-PRO provides powerful means for static analysis and validation of clock domain crossings(CDC). It extracts and validates clock trees, and clock domains, applying topological pattern-matching methods to validate the correctness of design structures on the clock domain boundaries. However, static CDC verification has to be augmented with the …
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SPIE Advanced Lithography is a Digital Forum in 2021 We look forward to you joining us 22 - 26 February 2021 Attend the Advanced Lithography Digital Forum, the leading event for the lithography community and where leaders come to solve challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent …
AI Business Week 2021 – Register Now! – On-Demand Thought Leadership with No Distractions AI Business week will take a unique look at the opportunities afforded by effective AI implementation across a number of sectors. Running Monday, February 22 – Thursday, February 25, each day will feature two 90-minute sessions presenting a unique look at opportunities …
February 23-February 25, 2021 Join the CEVA team to experience the smart sensing and wireless connectivity technologies that will shape our future. Visit us for a connected, interactive, and fully immersive experience in our Executive Meeting Room N5.EMRD01, Located Near Entrance #3 (North-East) where we will feature our complete IP solutions portfolio. Home - MWC Shanghai …
Learn from leaders in the IoT and cybersecurity ecosystem about how to protect your IoT devices, applications and data. With two days of live talks, the expert speakers will take you through the IoT security lifecycle journey, preparing you and your teams for the reality of IoT security now and what’s coming in the future. …
There’s no doubt about it. Photonics is rapidly gaining importance thanks to its proven potential for many diverse application areas & industries. Imec Technology Forum Photonics is your No. 1 occasion to gain insights on – pioneering R&D in silicon photonics, opto-electronics, photonics-based sensors and imaging, optical beamforming, etc application potential for manufacturing, automotive, medicine, connectivity and …
Produce Secure, High-quality Code Discover how you can easily produce secure, high-quality code with Klocwork. Klocwork is a static code analysis tool. It checks your code against coding rules. You can filter results, so you can find and fix the most critical errors first. What’s more, using Klocwork ensures secure, compliant, and reliable code. See …
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System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC multiphysics simulations for prototyping and signoff offer a complete methodology for analyzing …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC multiphysics simulations for prototyping and signoff offer a complete methodology for analyzing …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
Date: February 23, 2021 Time: 9:00 PM PST *This event will be broadcasted at 9:00 p.m. PT. To attend at 10:00 a.m. PT, please register here The next generation of processor cores such as the latest Arm® cores continue to get larger and more complex with challenging power targets. To achieve these targets, addressing power integrity …
February 24, 2021 9 AM EST / 2 PM GMT / 7:30 PM IST Venue: Online Ansys Minerva, powered by Aras, is the next generation simulation process and data management solution, fusing simulation and optimization to product lifecycle processes across the enterprise. Minerva boosts engineering productivity by democratizing simulation and enhancing collaboration between designers and …
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Traditional FPGA programming models and hardware description languages are not intuitive to many software developers. And even if they are, using them for iterative algorithm development is time consuming. This webinar demonstrates how to streamline the process. Read More If you develop for field-programmable gate arrays (FPGAs), you’re likely familiar with the hours-long experience of …
Digital event | February 24, 2021 | 10:00 AM PST Synopsys is the world's leading provider of solutions for designing and verifying advanced semiconductor products. Accelerating Semiconductor Design & Verification on Azure Cloud presents a unique opportunity to accelerate the design and verification process of silicon chips using cloud computing. Learn how to bring your …
Overview Your designs are getting bigger and your embedded software is growing exponentially. Yet, your development schedules are shrinking, and you must complete your projects earlier. Consequently, new tools are needed to address these ever-growing challenges. Although widely used for early software development, FPGA-based prototyping has the reputation of being difficult to do. The Cadence® …
Continue reading "FPGA-Based Prototyping Made Easy with Protium X1 Platform"
February 25, 2021 1 AM EST / 6 AM GMT / 11:30 AM IST Venue: Online Traction motor design is a key component in the electric vehicle/hybrid electric vehicle (EV/HEV) development process. Designing a highly efficient and cost-effective traction motor is challenging. It is a true multiphysics problem, requiring precise attribute balancing across all the …
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Time: 11:00 AM – 12:00 PM (PT) Abstract: Riviera-PRO™ Advanced Verification Platform addresses the verification needs of engineers crafting tomorrow’s cutting-edge FPGA and SoC devices. Riviera-PRO enables the ultimate testbench productivity, reusability, and automation by combining the high-performance simulation engine, advanced debugging capabilities at different levels of abstraction, and support for the latest Language and Verification …
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Join us: BLT is co-organizing this free, live online training event with Xilinx Customer Training and other Xilinx Authorized Training Providers. The two day event includes live instruction, optional labs, and a drawing for a grand prize. Course: Designing with the Versal ACAP: Architecture & Methodology In this virtual, special event, you will be introduced …
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Managing the relationship between hardware and software during system design is challenging. Complexities in both the hardware domain and software domain mask configuration issues and unfortunately do not get caught — until it is too late. Join me and Vishal Moondhra, VP of Solutions, for our webinar tomorrow as we discuss: How you can improve …
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Managing the relationship between hardware and software during system design is challenging. Complexities in both the hardware domain and software domain mask configuration issues and unfortunately do not get caught — until it is too late. The hardware register definition has dependencies for embedded software designers. As a result, the software team must wait for …
Overview: Join this webinar to learn how Visual Design Diff helps analog/mixed-signal designers using the Cadence Virtuoso platform to manage ECO’s & conduct design reviews more efficiently. VDD gives design and layout engineers the power to quickly compare two versions of a schematic or layout by graphically highlighting the differences directly in the design editor. …
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February 27, 2021 1 AM EST / 6 AM GMT / 11:30 AM IST Venue: Online The potential hazard resulting from uncontained turbine engine rotor blade failure has always been the long-term concern of each aero engine manufacturer, and to fully contain the failed blades under critical operating conditions is also one of the most …
Continue reading "Accurate Blade Containment Simulation With Ansys LS-DYNA"
Join the webinars with our experts and get to know all the updates for Ansys 2021 R1, the version that brings more agility to workflows and greater reliability to products. The novelties in Ansys 2021 R1 help engineering teams of all sizes to save time in development, improving decision making early in the project and …
The Design and Verification Conference & Exhibition Welcome to the DVCon U.S. 2021 Virtual Conference! The Design and Verification Conference (DVCon) is the leading event covering the application of languages, tools and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative™, DVCon brings chip architects, design …
Monday, March 1 Virtual Conference Accellera invites you to join us as we open DVCon U.S. with a day focused on standards development and technologies that you can apply immediately and those that will help to shape future activity. Accellera Day consists of a tutorial, five short workshops, and a UVM Birds of a Feather …
The embedded world 2021 DIGITAL of the trade fair pairing will thus carry over key aspects of the familiar in-person event and the accompanying lecture programme as well as the two conferences into the digital world. Industry representatives can look forward to five full days of company and product presentations, knowledge sharing, matchmaking and networking, in which participants will experience …
This webinar will showcase how engineering analysis can help optimize the design and operation of ventilation systems for the transportation industry. March 2, 2021 10 AM EST / 3 PM GMT / 8:30 PM IST Venue: Online Amid the global pandemic, many industries have been limited due to transmission risks. This is particularly important for …
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This webinar highlights new enhancements in Ansys Chemkin-Pro, enabling you to run large parameter studies and perform optimization through Ansys Workbench. We will also spotlight how you can simulate valve motions with the new fluid-structure interaction (FSI) models in Ansys Forte and perform automatic meshing. March 3, 2021 11 AM EST / 4 PM GMT …
Wednesday, March 3, 2021 | 10:30 a.m. NYC | 3:30 p.m. London Empower your analysts and organization to optimize the audit preparation process with Monarch. Preparing for and conducting an audit can be a labor intensive, cumbersome, and error prone process. However it doesn’t need to be that way. By leveraging Monarch, analysts and organizations …
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Increase your machine learning model accuracy and performance with Intel-optimized XGBoost algorithms found in the Intel® AI Analytics Toolkit. Read More Gradient boosting has many real-world applications as a general-purpose machine learning technique for regression, classification, and page ranking problems. It’s a common choice for large problem sizes, yet training implementation of this method is …
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The 14th annual Oil and Gas High Performance Computing (OG-HPC) Conference, hosted annually at Rice University by the Ken Kennedy Institute, is the premier meeting place for the energy industry to engage in conversations about challenges and opportunities in high performance computing, computational science and engineering, machine learning, and data science. Attended by more than 500 …
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This virtual event, March 6 – 11, 2021, will highlight Palomar’s solutions for advanced photonics packaging. Learn about the Palomar 3880 Die Bonder, the new Palomar 8100 Wire Bonder and the new SST 8300 Automated Vacuum Pressure Soldering System. Palomar's Product Marketing Manager, Kyle Schaefer, will be presenting a video product demo: Demo Title: 3880 Die Bonder – Unparalleled flexibility …
