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How to Create and Deliver the Best Innovations in 5G Wireless Communication
February 3, 2021
If you are working on creating and delivering innovative 5G communication systems, learn how to overcome the challenges to successfully design across chip, module, and board levels. This includes the design and analysis of gallium nitride (GaN)-based RF and microwave products from chip / module / PCB levels to take full advantage of GaN technology—offering wider band gap and higher breakdown voltage, power density, and gain compared to other technologies like gallium arsenide (GaAs), indium phosphide (InP), and silicon carbide (SiC).
Learn from Cadence® experts how to design and characterize the most innovative 5G wireless products through two different webinars: The first discusses designing with industry-proven Cadence AWR® software for high-power RF applications, and the second focuses on the Cadence EMX® Planar 3D Solver chip-level RF analysis solution, the golden reference tool for characterization of on-chip passive components at all foundries.
January 27: Design GaN Power Amplifier Solution for High-Power RF Applications Using AWR Software
February 3: Simulate and Characterize Large RF Circuit Blocks Using EMX Planar 3D Solver
*This webinar will be conducted in Mandarin.Share this post via: