All Things Semiconductor!
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Lam Research (NASDAQ:LRCX) will announce its quarterly earnings on October 23, 2019, and Applied Materials (NASDAQ:AMAT) the following month on November 14, 2019. Both companies make equipment used to manufacture semiconductor devices. While private and institutional investors often own both individual stocks, this article… Read More
On June 24, 2019, Nanometrics and Rudolph Technology announced they will combine in an all-stock merger of equals transaction. The companies say the combination increases the SAM (served available market) opportunity to approximately $3B.
This article attempts to analyze the two companies in their different business segments,… Read More
Advanced IC packaging, such as fan-out WLP (Wafer Level Packaging) and 2.5D TSV (Through Silicon Via) will drive the packaging equipment market, particularly lithography. This will help specific equipment manufacturers in 2019, since the WFE (Wafer Front End) market will drop 17%. But the Back-End lithography market, led … Read More
The semiconductor equipment market grew 37.3% in 2017 on the heels of capex spend by memory companies in order to increase bit capacity and move to more sophisticated products with smaller nanometer dimensions. Unfortunately these companies overspent resulting in excessive oversupply of memory chips. As memory prices started… Read More
In January 2019, the memory market has been hit with a significant amount of negative news.
As uncertainties mount about the near-term semiconductor industry from companies in Apple’s supply chain and the significant drop in memory chip prices, the semiconductor industry has consistently grown each year since the great recession of 2009. Semiconductor revenues have consistently outpaced semiconductor equipment… Read More
Semiconductor equipment vendor ranking, which didn’t change much between 2016 and 2017, is undergoing a makeover, as Lam Research, ASML, and Tokyo Electron (TEL) are switching places and top-ranked Applied Materials is getting closer to losing its number one ranking.
Since the 1990s, Applied Materials has been the market leader… Read More
Historically, the semiconductor and semiconductor equipment industry were inextricably linked due to the cyclical nature of the chip industry. An increase in semiconductor revenues was followed within a short period with an increase in equipment revenues, as semiconductor companies purchased equipment to make more chips… Read More
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Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
Choose the Right ASIC Manufacturing Model for Your Business
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – "What a great idea! But I have no idea how I’d use it!"
REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification
REPLAY: Fabless: The Transformation of the Semiconductor Industry
REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync - Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
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REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
REPLAY: Finding Your Way Through Verification
REPLAY: Concerned about IP security threats for your SoCs?
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Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
Choose the Right ASIC Manufacturing Model for Your Business
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – “What a great idea! But I have no idea how I’d use it!”
REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification
REPLAY: Fabless: The Transformation of the Semiconductor Industry
REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync – Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
REPLAY: How ASIC/SoC Prototyping Solutions Can Help You!
REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®
REPLAY: Taiwan ESD Workshop Recording
REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
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[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
[Forum] => vw\vw\XF\Entity\Forum Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 50
[rootClass:protected] => XF\Entity\Forum
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 2
[discussion_count] => 2654
[message_count] => 13537
[last_post_id] => 42123
[last_post_date] => 1571767891
[last_post_user_id] => 5
[last_post_username] => Daniel Nenni
[last_thread_id] => 12009
[last_thread_title] => Free PDF Copy of our book Fabless: The Transformation of the Semiconductor Industry!
[last_thread_prefix_id] => 0
[moderate_threads] => 0
[moderate_replies] => 0
[allow_posting] => 1
[allow_poll] => 1
[count_messages] => 1
[find_new] => 1
[field_cache] => []
[prefix_cache] => []
[prompt_cache] => []
[default_prefix_id] => 0
[default_sort_order] => last_post_date
[default_sort_direction] => desc
[list_date_limit_days] => 0
[require_prefix] => 0
[allowed_watch_notifications] => all
[min_tags] => 0
[vw_options] => 0
[vw_autolink] => 0
)
[_relations:protected] => Array
(
[Node] => XF\Entity\Node Object
(
[_uniqueEntityId:XF\Mvc\Entity\Entity:private] => 49
[rootClass:protected] => XF\Entity\Node
[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
)
[_values:protected] => Array
(
[node_id] => 2
[title] => SemiWiki Main Forum ( Ask the Experts! )
[description] => Post your questions to the experts here!
[node_name] =>
[node_type_id] => Forum
[parent_node_id] => 1
[display_order] => 1
[display_in_list] => 1
[lft] => 2
[rgt] => 3
[depth] => 1
[style_id] => 0
[effective_style_id] => 0
[breadcrumb_data] => {"1":{"node_id":1,"title":"Main Category","depth":0,"lft":1,"node_name":null,"node_type_id":"Category"}}
[navigation_id] =>
[effective_navigation_id] =>
)
[_relations:protected] => Array
(
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)
better_recent_comments-2
Widget_Better_Recent_Comments Instance: 2Array
(
[title] => Recent Article Comments
[number] => 10
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
(
[widget_select] => 1
[others_front_page] => 1
)
[rw_opt_exclude] => Array
(
[pageid_274493] => 1
)
)
Widget_Better_Recent_Comments
Safety and Platform-Based Design