The ESD Alliance Honors Mary Jane Irwin

The ESD Alliance Honors Mary Jane Irwin
by Randy Smith on 12-10-2019 at 10:00 am

The Phil Kaufman Award has been given annually since 1994 to individuals who have had a significant impact on Electronic System Design. I have attended several of the award dinners during that time. Most of the time (roughly 70%), the award recipients were either people I knew or people whose textbooks I had read. The award goes to… Read More


WEBINAR REPLAY: AWS (Amazon) and ClioSoft Describe Best Cloud Practices

WEBINAR REPLAY: AWS (Amazon) and ClioSoft Describe Best Cloud Practices
by Randy Smith on 11-20-2019 at 10:00 am

ClioSoft has been working with the leading cloud computing providers running experiments on various EDA cloud architectures for a while now. One example of that was a project with Google I previously wrote a blog about, For EDA Users: The Cloud Should Not Be Just a Compute Farm. Since then, ClioSoft has also teamed up with Amazon … Read More


Cadence Dives Deeper at Linley Fall Processor Conference

Cadence Dives Deeper at Linley Fall Processor Conference
by Randy Smith on 11-05-2019 at 10:00 am

I wrote about Cadence AI IP not long ago when I covered the Cadence Automotive Summit at the end of July (Tensilica DNA 100 Brings the AI Inference Solution for Level 2 ADAS ECUs and Level 4 Autonomous Driving, Tensilica HiFi DSPs for What I Want to Hear, and What I Don’t Want to Hear). One of those two blogs remains one of my most widely … Read More


Achronix Announces New Accelerator Card at Linley Fall Processor Conference – VectorPath

Achronix Announces New Accelerator Card at Linley Fall Processor Conference – VectorPath
by Randy Smith on 11-04-2019 at 10:00 am

This blog is my second blog from this year’s Linley Fall Processor Conference. The first two blogs focused on edge inference solutions. Achronix’s discussion was much broader than just AI/ML; it was about where FPGA’s have been going and culminated with a product announcement preview. I’ll get to the announcement in a moment, … Read More


Efficiency – Flex Logix’s Update on InferX™ X1 Edge Inference Co-Processor

Efficiency – Flex Logix’s Update on InferX™ X1 Edge Inference Co-Processor
by Randy Smith on 10-30-2019 at 10:00 am

Last week I attended the Linley Fall Processor Conference held in Santa Clara, CA. This blog is the first of three blogs I will be writing based on things I saw and heard at the event.

In April, Flex Logix announced its InferX X1 edge inference co-processor. At that time, Flex Logix announced that the IP would be available and that a chip,… Read More


Synopsys’ New Die-to-Die PHY IP – What It Means

Synopsys’ New Die-to-Die PHY IP – What It Means
by Randy Smith on 10-29-2019 at 10:00 am

This morning, Synopsys announced its new Die-to-Die PHY IP. This announcement is critically important as it addresses two major market drivers – the growing need for faster connectivity in the datacenter and similar markets, and a path to better exploit the latest processes by dealing with yield issues for larger dies in a different… Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More


GLOBALFOUNDRIES and Arm Showcase Broad Range of Partnership

GLOBALFOUNDRIES and Arm Showcase Broad Range of Partnership
by Randy Smith on 10-21-2019 at 10:00 am

I previously blogged on the GLOBALFOUNDRIES (GF) Technology Conference (GTC) held in Santa Clara, CA. The main takeaway that I shared in that blog was that GF’s announced “pivot” to a specialty foundry announced over a year ago, including its decision not to pursue 7nm and smaller nodes, appears to be working and GF is gaining momentum.… Read More


eSilicon White Paper on Chiplets – Good Read

eSilicon White Paper on Chiplets – Good Read
by Randy Smith on 10-17-2019 at 10:00 am

eSilicon recently released a paper detailing its experiences and its thoughts on the future of chiplets. The author of the white paper is Dr. Carlos Macián. I have also covered a presentation given by Carlos recently at the AI Hardware Summit, and he is well-spoken and quite knowledgeable. To get the white paper, go to the eSiliconRead More


Cadence and Green Hills Share More Security Thoughts at ARM Techcon

Cadence and Green Hills Share More Security Thoughts at ARM Techcon
by Randy Smith on 10-15-2019 at 10:00 am

On Wednesday, October 9, 2019, I had the pleasure of spending the day at ARM Techcon at the San Jose Convention Center. In the morning, in addition to getting some sneak peeks into the exhibitor area, I attended some of the morning keynote presentations, which focused on artificial intelligence (AI) and machine learning (ML) topics.… Read More