When I first saw emerging semiconductor IP company Flex Logix actively involved with TSMC I knew something big was coming and boy was I right. DARPA announced today that an agreement is in place with Flex Logix to develop EFLX eFPGA technology on TSMC 16FFC for use by companies or Government agencies designing chips for the US Government.… Read More
Author: Daniel Nenni
Technology Update With Andrew Faulkner and Jim Lipman of Sidense
Sidense is an interesting company in a very important market segment. Sidense was founded in 2004 and their 1T-OTP memory macros are now used in hundreds of chips from 180nm to 16nm for code storage, secure encryption keys, analog and sensor trimming and calibration, ID tags, and chip and processor configuration.
If you are designing… Read More
Another Interesting Thing From TSMC!
As I mentioned in my previous post, the TSMC investor call this month was very interesting and Morris Chang was in fine form during the Q&A. As a semiconductor professional I think some of the questions are ridiculous but maybe they have value to the financial people. This one question from Randy, who I think is very astute, is … Read More
DesignCon 2017 and Mentor Graphics
It’s hard to believe but this is DesignCon #22 and being a Silicon Valley conference I have attended my fair share of them. This year it seems like high speed communications will take the lead followed by the latest on PCB design tools, power and signal integrity, jitter and crosstalk, test and measurement tools, parallel … Read More
CEO Interview: Toshio Nakama of S2C
I haven’t sat down to speak with S2C since we collaborated on the book, PROTOTYPICAL, published just before DAC 2016 and even then, I hadn’t spoken to Toshio Nakama, their CEO. Toshio splits his time between the San Jose headquarters and the Shanghai headquarters so getting time to meet face-to-face has been challenging. I was finally… Read More
Three Interesting Things from TSMC!
First, the TSMC Museum of Innovation is now open and it’s quite impressive. Located right below Fab 12, it is definitely worth an hour of your time. Second, Morris Chang was on the investor call which made it much more interesting, especially his comments on the recent Report to the President on U.S. semiconductor leadership. Third,… Read More
Making the Move from 28nm to FinFET!
If you click FinFET in the SemiWiki.com Latest News: navigation bar at the top of this page you will get a list of 86 blogs that have been viewed more than 600,000 times. If you go to the last blogs on the list, meaning the first blogs to be published, you will see a three part series, “Introduction to FinFET Technology” written by Tom Dillinger… Read More
Analog Bits and TSMC!
As a long time semiconductor IP professional I can tell you for a fact that it is one of the most challenging segments of semiconductor design. Given the growing criticality of semiconductor IP, the challenges of being a leading edge IP provider are increasing and may be at a breaking point. The question now is: What does it take to … Read More
2017 Semiconductor Dead Pool
In 2015 we saw $85B in semiconductor acquisition activity and in 2016 there was more than $110B. Given 2015 and 2016 were relatively flat years for the $335B semiconductor industry and 2017 looks like more of the same we should expect consolidation to continue, absolutely.
So, let’s come up with a list of companies that may fall in… Read More
Executive Interview: Joe Rowlands, Chief Architect at NetSpeed Systems
Joe has devoted his career to understanding and designing cache coherent systems and has been granted over 95 patents on the subject. For the past four years, he has been Chief Architect at NetSpeed, a developer of network-on-chip SoC interconnect.… Read More
Weebit Nano Reports on 2025 Targets