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Scalability – A Looming Problem in Safety Analysis

Scalability – A Looming Problem in Safety Analysis
by Stefano Lorenzini on 07-28-2022 at 6:00 am

Figure 2 FMEDA white paper

Scalability – A Looming Problem in Safety Analysis

The boundless possibilities of automation in cars and other vehicles have captivated designers to the point that electronic content is now a stronger driver of differentiation than any other factor. It accounts for a substantial fraction of material cost in any of these vehicles. But this revolution in automotive technology comes with a caveat. In other applications, an electronics problem may be corrected with a shutdown or a reboot. The same resolution, however, does not work well for cars. Misbehavior in the electronics can lead to accidents, even fatalities.

To address this real concern, the ISO 26262 standard was crafted to set guidelines for electronics safety in cars. This context details the characterization and measurement during automotive electronics design. One of the most important analyses in the standard is Failure Modes, Effects and Diagnostic Analysis (FMEDA) for each component. It lists potential failure modes with the corresponding impact on the system’s safety and methods to mitigate such failures. These reports communicate safety characterization through the value chain, from IPs to automotive OEMs, as shown in Figure 1.

Figure 1 is an example of the FMEDA supply chain flow.

Generating FMEDA takes significant effort per automotive system-on-chip (SoC), and that task is compounded when those parts are configurable. This responsibility adds to the burden on the integrator rather than the supplier since only the designer can know which configurations are needed. As a further complication, the standard defines only intent for these analysis reports, not detailed format. Inconsistencies in these formats impede productivity in safety analysis up the value chain. This situation is not scalable and requires more standardization and intelligence.

Issues in the Current Process

Figure 2 demonstrates the multiple challenges in creating FMEDAs.

Safety evaluation starts with a Failure Mode and Effect Analysis (FMEA) based on system design experience in the potential ways, causes and effects a system might fail. This becomes the starting point for a systematic FMEDA captured in reports for each component in a design. Listed for each failure mode is the potential impact on the system’s safety along with methods to prevent, detect and correct such breakdowns. Random failures, perhaps triggered through ionization by cosmic radiation, are of particular concern. The analysis is based on lengthy simulations of faults, determining how or if those malfunctioning behaviors propagate through the circuit.

FMEDA at a given level of design demonstrates rigor in planning and testing for failure modes at a detailed level. Moving up to the next level in the system design, FMEDAs are typically abstracted for aggregation into higher levels. Abstraction trims down the failure modes to those relevant to system analysis while preserving safety analysis coverage. Each use case drives the performance and may require building different abstractions during system-level analysis.

Within SoC design, the process suffers from scalability problems in three important ways, as highlighted in Figure 2. It is not designed to deal efficiently with highly configurable IP. The network-on-chip (NoC) provides a clear example. Each NoC configuration is unique to the designated SoC in the endpoint IPs it connects and quality of service and power goals. As the design changes prior to tapeout, so must the NoC. Each instantiation requires an independent analysis performed by the SoC integrator who knows the needed NoC configuration.

A natural question is whether at least some of this analysis could be reused between different configurations. Reuse is already successful in accelerating SoC design and plays a significant role in functional verification. In contrast, FMEDA is a relatively recent addition to design requirements and has yet to evolve a reuse strategy. Every analysis at a given level must be from scratch, consuming significant time and resources. A reuse strategy could make an enormous difference to design schedules and avoid errors if a solution was available.

The lack of a standard format for FMEDA is also an efficiency drain. SoC integrators using IPs from multiple suppliers must contend with different formats, requirements and assumptions on use-case compatibility and, therefore, other ways to derive abstractions. Today, these disconnects are resolved manually between integrators and suppliers, but the process is not scalable. There are too many points at which mistakes could occur.

Aligning FMEDA With Reuse

A reuse-centric methodology cannot be based on flat analysis at each stage. The essential failure modes of a configurable IP do not vary between configurations. These should be interpretable in parametric instantiations of the RTL, allowing the generation of an FMEDA for a particular layout. In this flow, failure modes and safety mitigation would be model-oriented rather than report-oriented. A model-based approach allows for generating and delivering an FMEDA model for an IP. The significant gain is that the SoC integrator no longer needs to run a full flat analysis for each configuration change during design development.

The next logical advance would be to extend this capability to SoC FMEDA build. A generator for an SoC-level analysis could read traditional FMEDA reports for IPs and apply in-context requirements and assumptions of use. This would optimize that detail down to a few essential failure modes relevant to that purpose per IP. The generator could then build the appropriate SoC FMEDA for that use model from this input. Generating a new analysis for a different set of assumptions would require no more effort than dialing in those new parameters and re-running the generator. Since the tool used is ISO 26262 certified, additional analysis is unnecessary before tapeout because the compliance is already built-in. Figure 3 illustrates the full proposed flow, from FMEDA generation at the IP level to FMEDA generation at the SoC level.

A methodology like this could greatly simplify safety analysis for an SoC development team, even if only one IP supplier endorsed the model-based capability. If each IP supplier supported a standard for safety data interchange, such as the IEEE P2851 standard currently in development, the value to the SoC safety analysis team would be amplified even further. Encouraging tooling to aggregate and abstract IP models for the SoC might depend more on the completion and adoption of IEEE P2851. However, given there are already solutions of this nature in some automotive SoC suppliers, this goal seems very achievable.

Traceability and FMEDA

Whenever requirements must be exchanged between integrators and suppliers, traceability becomes essential. The most important requirement in design for automotive applications is safety, as documented in the FMEDA. Requirements, implementation, testing and FMEDAs are closely interlinked. Changes in any of these must be correctly tracked in the others if the integrity of the whole process is to be maintained, as illustrated in Figure 4 below.

Figure 4 highlights that traceability between requirements, implementation, test and FMEDA is closely coupled.

There is another compelling reason to consider traceability here. At each level of integration, FMEDAs are abstracted from detailed structural-level failure modes to a much smaller number of system failure modes. This abstraction is performed based on use cases and system design experience. Mistakes are possible but can be mitigated through careful traceability from system failure modes down through component failure abstractions to more detailed component analyses.

Traceability is valuable for problem diagnosis and abstraction support against different use cases. An integrator may decide for one use case that certain failure modes are more important than others. Whereas in another situation, that decision might change. Given the ability to examine the full set of failure modes, an integrator can choose what to prioritize and ignore. With the support of a generator, as described in the previous section, an integrator would enjoy more flexibility to explore options.

A Call to Action

A move to reuse practices for FMEDA seems both logical and unavoidable. Reuse practices are already amply proven in design and verification. Now it is time for safety analyses to move up to that level. It would be natural also to align these interfaces with the planned IEEE P2851 standard as that starts to emerge. In the meantime, suppliers of highly configurable IP should craft solutions to better serve integrator customers. Automotive semiconductor solutions for aggregation and abstraction can help define a more complete solution at the SoC level. That approach must recognize the need for traceability through FMEDA.

Only through advances of this nature is it possible to jump past the looming problem in safety analysis scalability.

For more information about FMEDA, click HERE.

Mr. Stefano Lorenzini has more than 25 years of safe and secure SoC design and architecture experience spanning Arteris IP, Alcatel Microelectronics, Cadence Design Systems, Ericsson, Intel, ST Microelectronics, and Yogitech. He has spent the last 18 years managing SoC functional safety applications regulated by IEC 61508 and ISO 26262 standards. He holds a master’s degree in electronic engineering from the University of Pisa, Italy.

Also read:

Scaling Safety Analysis. Reusability for FMEDA

Why Traceability Now? Blame Custom SoC Demand

Assembly Automation. Repair or Replace?


Electronics is Slowing

Electronics is Slowing
by Bill Jewell on 07-27-2022 at 2:00 pm

Electronics is Slowing 2

Key semiconductor market drivers PCs and smartphones are both showing declines in shipments in the first half of 2022. According to IDC, PC shipments in 2Q 2022 were down 15% from a year earlier. 2Q 2022 PC shipments of 71.3 million units were at the lowest level in almost three years since 70.9 million units were shipped in 3Q 2019. In June, prior to the 2Q 2022 PC shipment data, IDC forecast a decline of 8.2% in PC shipments for the year 2022. Based on the 2Q 2022 data, the forecast will probably be lowered to a double-digit decline.

Smartphone shipments 1Q 2022 were down 9% from a year ago, according to IDC. IDC’s 2Q 2022 smartphone data has not yet been released, but Canalys estimated smartphone shipments were down another 9% in 2Q 2022 versus a year ago. IDC’s June forecast called for a 3.5% decline in smartphone shipments in 2022, but based on 2Q 2022 data the decline should be at least double that rate, in the -7% to -10% range.

Electronics production in the key Asian countries is mixed. China, the largest producer, showed three-month-average change versus a year ago (3/12) of 7.7% in June, a slowing from double-digit growth from January 2021 through April 2022. Much of the slowdown in China electronics production was due to COVID-19 related shutdowns in April and May. Japan electronics production has been declining since October 2021, with May 2022 3/12 change down 13%. South Korea, Vietnam and Taiwan have shown strong growth in the last few months, with 3/12 change around 20%.

In the U.S and Europe, electronics production trends are also mixed. U.S. 3/12 change was 4.7% in May, in line with the trend over the last year. UK 3/12 change was 4.0% in May, the sixth straight positive month. UK electronics declined significantly in 2020 mostly due to production shifts from the UK to European Union (EU) countries after the UK withdrew from the EU (Brexit). The 27 countries of the EU showed healthy electronic production growth in most of 2021 due to Brexit and recovery from the COVID-19 pandemic. In the last six months, EU 27 3/12 change has been negative, with a 9% decline in May.

The bright spot for the semiconductor market is the automotive sector. LMC Automotive forecast for 2022 light vehicle production is 81.7 million units, up 6% from 2021. LMC projects growth of 5% in 2023 and 7% in 2024. However, the July numbers have been revised downward from the April forecast by 0.8 million in 2022 and 4 million in both 2023 and 2024. The downward revisions were due to continued shortages of semiconductors and other components, the China lockdown in April and May, the war in Ukraine, and worries over inflation and interest rates.


The overall outlook for electronics production is uncertain. Most countries are showing growth in production, with the exceptions of Japan and the EU. However, declines in shipments of PCs and smartphones are a cause for concern. Although automotive production is growing, growth may be limited by the factors listed above. A global recession in 2023 is increasingly likely. The International Monetary Fund (IMF) puts the chance of a recession at 15%. Citigroup and Deutsche Bank each see about a 50% chance. A Wall Street Journal survey of economists has the risk of a U.S. recession at 44%. The semiconductor industry needs to exercise caution in light of these factors.

Also Read:

Semiconductors Weakening in 2022

Semiconductor CapEx Warning

Electronics, COVID-19, and Ukraine


Axiomise at #59DAC, Formal Update

Axiomise at #59DAC, Formal Update
by Daniel Payne on 07-27-2022 at 10:00 am

Dr. Ashish Darbari min 1

Monday at DAC I was able to meet with Dr. Ashish Darbari, the CEO and founder of Axiomise. Ashish had a busy DAC, appearing as a panelist at,  “Those Darn Bugs! When Will They be Exterminated for Good?”; and then presenting,  “Taming the Beast: RISC-V Formal Verification Made Easy.”

Dr. Ashish Darbari, CEO
Axiomise

I had read a bit about Axiomise as a formal verification training and consulting services company on SemiWiki, and this was my first meeting with Dr. Darbari. With 46 patents in the field of formal verification, I knew that he was an expert in this area. Formal verification techniques have been used across many safety-critical market design segments: Automotive, security, healthcare, aerospace, ML, IoT and mobile computing.

Safety-critical design markets

I recalled that in the early days of formal verification that new users were almost required to have a PhD. in order to use and interpret the results, so I wanted to learn why formal techniques have not been widely adopted yet. Some of the larger design groups often want to become better trained in using formal tools, but may not have developed the training resources quite yet, so taking a training course from Axiomise is a quick way to get trained in the best practices.

Functional verification has been in use ever since digital simulation was invented, yet that was not sufficient to detect the famous Intel floating-point division bug back in 1994. Formal techniques would catch that bug today. Processor design companies are big adopters of formal to ensure that what is specified is what gets designed. When Ashish worked at Imagination Technologies,  a team of four formal experts supported 51 projects over a three year time span, training almost 100 engineers. Imagination Technologies is well-know for developing sophisticated IP, like: GPU, CPU, AI, and Ethernet.

What sets Axiomise apart is their training and consulting approach is tool vendor agnostic, so they don’t prefer one vendor over another one, the more formal tools to choose from the better. They basically have a very symbiotic relationship with EDA vendors. The actual training in formal can be done either in person or online, and engineers can make a class purchase using credit card. There are seven levels of online courses offered so far, including: theory, labs, demos, case studies, theorem proving, property checking, and equivalency checking.

Teams doing RISC-V designs should know that obtaining exhaustive ISA compliance is a big task, and that Axiomise has an app called formalISA to prove and cover, quite quickly, and without having to:

  • Write a test case
  • Write text sequences
  • Write a scoreboard or checkers
  • Write constraints
  • Randomize stimulus

On premise training is an option for larger clients, which makes it easier for engineers to get up to speed without taking out time to travel for training.

For modern processor designs there can be 5X more verification engineers than design engineers, as the verification challenges have become so much larger. Using a formal approach for verification to complement functional verification and hardware emulation can save time.

Summary

Dr. Ashish Darbari is outgoing, affable, confident, experienced and a formal expert with decades of experience. What sets him apart is the unique combination of industry experience and a passion for all things formal. If you attend DAC or DVCon you will likely see him on an organizing committee. I look forward to following his career, and that of Axiomise for years to come, as they make verification more manageable by working smarter.

Related Blogs


Formal at System Level. Innovation in Verification

Formal at System Level. Innovation in Verification
by Bernard Murphy on 07-27-2022 at 6:00 am

Innovation New

Formal verification at the SoC level has long seemed an unapproachable requirement. Maybe we should change our approach. Could formal be practical on a suitable abstraction of the SoC? Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome.

The Innovation

This month’s pick is Path Predicate Abstraction for Sound System-Level Models of RT-Level Circuit Designs. The paper published in the 2014 IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. The authors are from the University of Kaiserslautern in Germany.

Though the paper is old, this is a worthy goal and has a respectable number of citations. While there has been limited commercial development, the topic is still unfamiliar to most of us. The authors argue for a different kind of abstraction from familiar methods in conventional formal. They propose Path Predicate Abstraction (PPA). This centers around important states in the stage transition graph and operations which are multicycle transitions between important states.

The paper illustrates top-down construction of an example PPA as an FSM, with macros defining states and properties defining operations as sequences of transitions between states. Macros connect to the RTL implementation through signal name references. They check these formally against the RTL. Further, they show how such an PPA state machine can be proven sound and complete. They claim this demonstrates formally complete coverage on the abstract graph for the SoC.

Paul’s view

This paper is a heavy read but is an important contribution that has been well cited. The concept is easy to appreciate. First create an abstract state machine to describe design functionality at a system level and then prove that an RTL implementation of the design conforms to its abstraction. The abstract state machine is represented as a bunch of temporal logic properties, e.g. System Verilog Assertions (SVAs).

Proving that some RTL conforms to an SVA is of course not new and is not the contribution of the paper. The contribution is a method to prove the reverse: that a set of SVAs completely covers all possible behaviors of some RTL, relative to a particular level of abstraction.

This is a pretty cool concept, and the authors’ open with an elegant way to visualize their approach as a form of coloring of the states in the RTL implementation of a design. They tie off their work with two worked examples – a simple bus protocol and a serial IO data packet framer.

I would have liked to see one of the examples being a compute centric design vs. a protocol centric design. Protocol centric designs always have a clear and obvious system level state machine to verify against, and indeed at Cadence we offer a library of formal protocol proof kits very much along the lines of this paper which we refer to as Assertion-Based Verification IPs (AB-VIPs for short).

But for a compute centric design we’ve found it much harder to represent the intended behavior using assertions and state machines. A sequential equivalence checking approach – either between two versions of RTL or between a C/C++ model and RTL implementation has generally proved to be more scalable.

Raúl’s view

The core concept is to define the semantics of a system model by formulating properties in a standard property language, such as SystemVerilog assertions (SVA). If these properties can be proven using standard property checking techniques, then the system model is a sound abstraction of an RTL design. It is important to note that the objective of the paper is show a method to establish equivalence between an abstraction and the ground RTL. It does not offer innovation in arriving at a sound abstraction, for example finding optimal ways to color the graph.

The proposed methodology is applied to two designs. A flexible peripheral interconnect (FPI) bus with a total of ~16,000 Lines of Code. The number of state bits reduced from over 1500 to just 38, in 1850 lines of code (LoC). A property checker proved all properties in 90 seconds. The authors estimated effort to create a complete set of properties for SoC module verification to be around 2000 LoC per person month, meaning approx. 8-person month in total.

A second example is a SONET/SDH Framer (Table III) of about 27,000 LoC. This shows equally impressive results, reducing the number of state bits from over 47,000 to just 11. The total manual effort including formal verification of 27k LoC in VHDL was about six person months in this case. Properties checked in less than two minutes.

Establishing “sound abstractions” at levels above RTL is key to raise the level of abstraction. The paper is an important contribution in this area. Surprisingly, the cost in term of proving the soundness of these abstractions is negligible, just minutes using a model checker. What is not negligible however, is the non-automated effort of coming up with these abstractions. Many months by experts familiar with the non-trivial methodology. It is also not clear how expressive these abstractions are. The author’s touch on this, “We find this abstract graph by constructing a mapping function… In this context, we may observe that trivial coloring functions always exist that assign every node in the graph a different color or that assign the same color to all nodes (the resulting path predicate abstractions are, of course, meaningless) “. If and how this methodology makes its way into practical design tools is an interesting question.

My view

A note on how I approach math-heavy papers like this. Our primary interest is engineering value so, to first order, I focus on opening proposition, experiments and results. Dense algebraic justification I treat as an appendix, interesting maybe to read later if warranted. This makes for a much easier read!


Stand-Out Veteran Provider of FPGA Prototyping Solutions at #59DAC

Stand-Out Veteran Provider of FPGA Prototyping Solutions at #59DAC
by Steve Walters on 07-26-2022 at 10:00 am

S2C EDA Solutions 2022

S2C’s Shines at DAC 2022 with its New Prodigy Player Pro-7 Prototyping Software, Multi-FPGA Prototype Hardware Platforms, and Complete Prototyping Solutions

The 59th Design Automation Conference returned to San Francisco’s Moscone Center this year to notch almost six decades of week-long immersion in EDA technology and market trends, combining keynote presentations by industry luminaries with the “DAC Engineering Track” technical presentations and the EDA tool-provider exhibits for in-person exchanges of EDA user-needs and the latest EDA solutions.  Attendance by exhibitors, and EDA tool end-users alike, was noticeably improved from last year’s conference but still below pre-COVID levels.  The Moscone Center neighborhood provided a less than inviting convention venue as San Francisco recovers from COVID’s decimation of the convention-generated commerce around the Center marred by heavily littered streets, a very noticeable presence of “street people”, and the closure of many name-brand businesses that are normally sustained by the “collateral business” generated by convention attendees.

Despite the lower DAC attendance, S2C saw a marked improvement in the quantity and quality of visitors to the S2C booth.  S2C highlighted its latest hardware and software and provided interactive demonstrations of its Prodigy MDM Pro multi-FPGA debug tools and its Prodigy ProtoBridge high-throughput channel for the transfer of large amounts of transaction-level data between the FPGA prototype and a host computer – both demonstrations running on S2C’s Quad Logic System prototyping hardware featuring Intel’s massive Stratix GX 10M FPGAs.

S2C took the opportunity at DAC to roll out its newest version of its prototyping software Prodigy Player Pro-7.  The new software suite includes Player Pro-RunTime, for prototype platform control and hardware test; Player Pro-CompileTime, with enhanced automation of multi-FPGA partitioning and pre/post-partition timing analysis; and Player Pro-DebugTime, for multi-FPGA debug probing and trace viewing with S2C’s class-leading MDM Pro debug tools.

With an emphasis on large-scale SoC design prototyping, Player Pro-7 offers enhanced support for multi-FPGA implementations, including:

  • RTL Partitioning and Module Replication to support Parallel Design Compilation and reduce Time-to-Implementation
  • Pre/Post-Partition System-Level Timing Analysis for Increased Prototyping Productivity
  • SerDes TDM Mode for Optimal Multi-FPGA Partition Interconnect and Higher Prototype Performance

Prodigy Player Pro-7 Prototyping Software Suite

S2C displayed a number of its latest prototyping products in its DAC booth this year, including the Prodigy Logic System 10M based on the industry’s largest FPGA, Intel’s Stratix 10 GX 10M. Also on display were S2C’s Xilinx-based prototyping hardware, the Prodigy S7-19P Logic System, and the S7-9P Logic System, both getting their fair share of DAC attendee attention.

The highlight of the S2C booth was the new Prodigy Logic Matrix LX2.  Based on Xilinx’s largest Virtex Ultrascale+ FPGA, the LX2 boasts eight VU19P;for expansion beyond eight FPGAs, up to eight LX2s can be housed in a single standard server rack, extending prototyping gate-capacity up to sixty-four VU19P FPGAs. For expansion beyond eight FPGAs, the LX2 architecture is designed for prototyping with up to eight LX2’s in a single standard server rack, extending prototyping gate-capacity up to sixty-four VU19P FPGAs.  At this level of FPGA prototyping density, hardware quality and reliability become first-order considerations, and S2C’s 18+ year proven track record of delivering high-quality prototyping hardware sets a high bar for other prototyping solutions.

S2C DAC 2022 Booth at Moscone Center in San Francisco

To enable users to configure prototyping platforms quickly and reliably, S2C displayed a sampling of its Prototype Ready IP in the booth.  Prototype Ready IP are off-the-shelf daughter cards designed by S2C to plug-and-play with S2C prototyping hardware platforms.  The daughter cards are designed to attach reliably to the FPGA prototype hardware and compose a rich collection of prototyping functions, including High-Speed GT Peripherals (Ethernet, PCIe, MIPI, SATA, high-performance cables, etc.), General Peripherals (GPIO, USB, mini-SAS, JTAG, RS232, etc.), Memory Modules (EMMC, DDR, SRAM, etc.), ARM Processor Interface Modules, Embedded and Multimedia modules (DVI, HDMI, MIPI, etc.), and Expansion and Accessories modules (FMC-HPC Converters, Level Shifters, I/O Test Modules, DDR Memory Modules for user-supplied external memory, Interconnect Cables, Clock Modules, etc.).

The S2C Prodigy Multi-Debug Module Pro demonstrations at the booth showcased the implementation of S2C’s multi-FPGA debug tools for prototyping with a combination of external hardware, soft IP implemented in the FPGA, high-speed FPGA I/O, and debug configuration software (Player Pro-DebugTime)MDM Pro was designed specifically to support multi-FPGA prototype implementations – with support for high probe-counts, deep-trace debug data storage, optimization of debugging reconfiguration compiles, and with the ability to choose debug configuration tradeoffs to optimize prototype performance.  The Player Pro-DebugTime software supports user-friendly debug configuration, complex trace-data capture triggering, and single-window viewing on the user console of simultaneous streams of trace-data from multiple FPGAs.  MDM Pro hardware supports high-performance deep-trace debug data storage without consuming internal FPGA storage resources.

S2C Prodigy Multi-Debug Module (MDM)

S2C also demonstrated its Prodigy ProtoBridge in the DAC booth to showcase its off-the-shelf solution for a high-throughput channel (4GB/second) between the FPGA prototype and a host computer for the application of large amounts of transaction-level test data to the FPGA prototype – such as processor bus transactions, video data streams, communications channel transactions, etc.  ProtoBridge uses a PCI-to-AXI interface implemented in the FPGA and connected to the user’s RTL as an AXI-4 bus.  ProtoBridge includes a set of C-API function calls to perform AXI bus transactions in the FPGA prototype, a PCIe3 driver for Linux or Windows operating systems to control Logic System operations, C-API reference operations with sample access to FPGA internal memory, and an integration guide on how to connect the user’s RTL code to the ProtoBridge AXI-4 bus module.

S2C Prodigy ProtoBridge

Overall, DAC 2022 was a successful conference for S2C, firmly establishing S2C as the leading independent FPGA prototyping supplier, with the strongest track record of delivering complete prototyping solutions worldwide.

The FPGA prototyping hardware and software displayed at DAC are available now. For more information, please contact your local S2C sales representative, or visit www.s2cinc.com

Also read:

Multi-FPGA Prototyping Software – Never Enough of a Good Thing

Flexible prototyping for validation and firmware workflows

White Paper: Advanced SoC Debug with Multi-FPGA Prototyping


A Look at the PCIe Standard – the Silent Partner of Innovation

A Look at the PCIe Standard – the Silent Partner of Innovation
by Mike Gianfagna on 07-26-2022 at 6:00 am

A Look at the PCIe Standard – the Silent Partner of Innovation

Let’s face it. Standards aren’t always exciting, and the process of ratifying new versions can be time-consuming and tedious. Regardless, we all know standards are the glue that bind many ecosystems and without them the technology world would be good measure more chaotic. Standards come in many versions, with various amounts of reach and impact. In this post I will explore the Peripheral Component Interconnect Express standard, or PCIe for short. This standard has far-reaching consequences, it is truly the silent partner of innovation in our world.

What is It, Why Does It Matter?

PCIe is a high-speed serial computer expansion bus standard. Its mission is to deliver high bandwidth, low latency, and low power communication between components in a computer system. Devices that use this standard include graphics cards and GPUs, all forms of storage including SSDs, network interfaces, WiFi and Bluetooth interfaces. Essentially, many of the technologies that fuel next-generation innovation.

The PCI Special Interest Group has done a remarkable job at keeping the standard evolving and vibrant. The group has delivered a doubling of PCI Express speeds around every three years ever since the introduction of the spec in 2003.  The latest version, PCIe 6.0, overhauls the signaling technology to achieve bandwidth gains while maintaining low latency. The new architecture also maintains compatibility with all previous generations of PCIe. This is not easy to do but will certainly help with adoption for existing designs.

Each generation of the standard also supports multiple data lanes, from 1 to 16. This allows the standard to be used in all kinds of applications, from hand-held devices to server-class computing. Data Center, Artificial Intelligence/Machine Learning, HPC, Automotive, IoT, and Military/Aerospace are all markets that have benefitted from the PCIe standard.

And How Does It Impact the World Around Us?

Standards are nice; a working implementation of the standard is what drives innovation, however. When it comes to implementing high-performance channels, my go-to organization is Samtec. They are always at the forefront of high-speed channels. Their products are essentially the cohesive force for any new idea. Without the ability to move data, any idea is interesting but not practical. You can learn more about Samtec’s products and people on SemiWiki here.

As I dug into the latest information on its website, I found what I was looking for; real hardware solving real problems. The first item I found was a demo that uses the PCIe 6.0 standard. This is real cutting-edge stuff as the standard was just released earlier this year.  It normally takes quite a while to see real implementations of a new standard and this demo was done right around the time of the standard’s release. 

The demo showcases a PCIe Gen 6.0 AI hardware design based on the GenZ PCIe enclosure compatible form factor (PECFF). Working with Synopsys, a GENZ motherboard is combined with GENZ Add-In-Cards with top card connectivity. This design emulates industry standard AI acceleration hardware platforms.  The Synopsys PCIe 6.0 PHY generates up to four 64 GT/s PAM4 differential signals in the demo. You can see a short, very informative video of this demo here.

I also found a Samtec demonstration based on PCIe Gen 4.0. This demo highlighs Samtec’s PCIe®-Over-Fiber FireFly™ Adapter Card (PCOA Series), developed by its partner, Dolphin.  The PCOA series utilizes Samtec’s PCI Express®-Over-Fiber FireFly™ Optical Cable Assemblies (PCUO series). It turns out Samtec is the only company in the world offering reset functionality and cable present sidebands in this form factor.

One of the new features of the adapter card is the capability to do a surprise hot add. A surprise hot add feature allows a new resource to be added to a system that is already running. The resource can be a storage device, camera, a GPU or an FPGA. This allows a new resource to be added and be available without shutting down the server. Without the surprise hot add, the host needs to be rebooted to enumerate and find the PCIe devices attached to the server, a much more cumbersome process. You can also see a short and informative video of this demo here.

The Momentum Keeps Building

There is significant momentum building for PCIe deployments. The PCI-SIG Developers Conference series for 2022 just kicked off in Santa Clara this past June. In case you missed it, there are more events happening around the world in later this year in Asia, Israel and Europe. You can learn more about Samtec’s support for PCIe here and download an overview of its various solutions here. PCIe is definitely creating big opportunities. It is truly the silent partner of innovation in our world.

Also read:

A MasterClass in Signal Path Design with Samtec’s Scott McMorrow

Passion for Innovation – an Interview with Samtec’s Keith Guetig

Webinar: The Backstory of PCIe 6.0 for HPC, From IP to Interconnect

 


Calibre, Google and AMD Talk about Surge Compute at #59DAC

Calibre, Google and AMD Talk about Surge Compute at #59DAC
by Daniel Payne on 07-25-2022 at 10:00 am

Google Cloud vendor of the year min

In 2022 using the cloud for EDA tasks is a popular topic, and at DAC this year I could see a bigger presence from the cloud hardware vendors in the exhibit area, along with a growing stampede of EDA companies. Tuesday at DAC there was a luncheon with experts from Siemens EDA, Google and AMD talking about surge compute. I already knew Michael White of Siemens EDA who was moderator, while Peeyush Tugnawat of Google, and Philip Steinke of AMD were new faces to me. There was an award presented from Google Cloud for Industry Solutions Partner of the Year 2020,  and Michael Buehler-Garcia graciously received it for Siemens EDA.

Michael Buehler-Garcia, VP at Siemens EDA

Cloud for Surge Compute, Why Now?

The relentless pursuit of Moore’s Law brings us ever-small nodes, which then dramatically increase the computation requirements for EDA tools, like: physical verification, circuit simulation, DFM, DFT, functional verification, and more. The CPU cycles with most on-premise design teams isn’t enough to meet timelines, so that’s when cloud capacity comes to the rescue.

Technology Challenges

Google’s View

Peeyush opened by sharing that Google has some $257B in revenue, from 9 services, attracting 1B+ active users, and that their Cloud Business revenue is $20B, so yes, cloud is a priority. Silicon design has huge CPU needs across compute, storage and network. He showed a cool diagram of the chip design process, and denoted which segments were compute intensive or data intensive.

IC Design Tasks

Google Cloud offers three VMs for general purpose, and three VMs for workload-optimized, so there’s a lot of flexibility for EDA users to choose the best VM for the task at hand. Scaling happens by deploying up to 1,000 instances with a single call. Google Cloud also partners with the most popular file systems: NetApp, Dell Powerscale, DDN EXAScaler, IBM Spectrum Scale, Intel DAOS. The internal Google Cloud network is global, and secure, built without public hubs to increase security.

AMD’s View

Google Cloud has VMs that are powered by AMD EPYC processors, that enable complex EDA workloads to run faster. Phil mentioned that having Google Cloud as a partner has enabled their HW teams to tackle the biggest processor designs while meeting aggressive TTM goals. The specific instances with AMD EPYC processors were N2D, C2D and T2D. The SoC design example was the AMD Raden MI50 GPU, having an impressive 13.2B transistors, a high-performance compute engine, scalable interconnect, end-to-end ECC enablement, fabricated at TSMC on the N7 node.

AMD MI50 GPU

Siemen’s EDA View

Michael White presented how Calibre PERC was run on a large design in Google Cloud with AMD servers, comparing the performance of N2D and C2D, where 16 to 816 CPUs were used. With just 16 CPUs the run time was about 5 days on the 2nd generation N2D, while using 816 CPUs the run time shrunk to just 8 hours on the 3rd generation C2D. Using more CPUs enables a design team to get 2 iterations per day, so that’s a big time savings using surge compute.

Caliber PERC Run Times

The memory footprint for Calibre PERC was smaller than competitors tools, and pretty much flat with more cores added, making the approach quite efficient. Even full-chip P2P checks on the I/O ring could now be run overnight using surge compute on the MI50 GPU design. Data was shared on how Calibre nmDRC was run on the MI50 GPU design with up to 1,500 CPUs, enabling 6 iterations per day.

Calibre nmDRC run times

Summary

Yes, Moore’s Law is still alive, and these leading-edge process nodes are dramatically increasing CPU requirements for EDA tools, calling in to question the sole reliance of on-premise computing. Using the power of the cloud really is meeting the compute challenges, and the collaboration between AMD, Google Cloud and Siemens EDA has worked out quite well. EDA jobs that used to take multiple days, can now be iterated several times per day by using the cloud.

There is some circular reinforcement going on here, because AMD designers are using AMD hardware to design the next generation of AMD hardware, thanks to the infrastructure of Google Cloud combined with the software from EDA vendors like Siemens EDA.

Related Blogs


Intel Lands Top TSMC Customer

Intel Lands Top TSMC Customer
by Daniel Nenni on 07-25-2022 at 2:30 am

Intel Foundry and MediaTek

Most people will be surprised by this but after working in Taiwan for many years I quite expected it. Intel Announced that MediaTek will use Intel Foundry Services for FinFET based smart edge device chips. MediaTek will start with Intel 16nm technology which originated from the legendary 22nm, the first commercial FinFET process. It’s equivalent to TSMC 16nm. Once Intel 14nm capacity frees up I would expect it will become available to foundry customers as well. The current version of Intel 14nm is equivalent to TSMC 10nm. Intel 10nm is now called Intel 7 which competes with TSMC N7. It is nice that that foundry process names are finally syncing up, much less confusing for the mass media.

In the early days of the fabless transformation having multiple foundry sources was key to getting capacity and competitive wafer pricing. One time I worked on a chip that was taped-out at TSMC then moved to UMC, SMIC, and Chartered for high volume manufacturing. Qualcomm and MediaTek were both experts at multi sourcing chips up until the FinFET era. Qualcomm moved a lot of capacity to Samsung with mixed results. MediaTek, on the other hand, partnered closely with TSMC and gained serious SOC market share over Qualcomm. In fact, the last numbers I saw had MediaTek beating Qualcomm at their own game in the smartphone market.

Having worked with both Qualcomm and MediaTek during my 40 year semiconductor career I can tell you these are two very different companies. The advantage MediaTek has is they are exceptionally good at pivoting. MediaTek is also great at customer collaboration, especially in China, which explains their lead in the smartphone market.

“As one of the world’s leading fabless chip designers powering more than 2 billion devices a year, MediaTek is a terrific partner for IFS as we enter our next phase of growth,” said IFS President Randhir Thakur. “We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications.”

NS Tsai, corporate senior vice president of Platform Technology & Manufacturing Operations at MediaTek, said, “MediaTek has long adopted a multi-sourcing strategy. We have an existing 5G data card business partnership with Intel, and now extend our relationship to manufacturing smart edge devices through Intel Foundry Services. With its commitment to major capacity expansions, IFS provides value to MediaTek as we seek to create a more diversified supply chain. We look forward to building a long-term partnership to serve the fast-growing demand for our products from customers across the globe.”

I would consider this great customer win to be part of the “Not TSMC” market which Samsung has been living off for the past few years. Moving forward the Not TSMC market will continue to grow for Intel Foundry with the stumbling of Samsung and the tight capacity and higher wafer pricing at TSMC. In order for the chip business to thrive there must be multiple manufacturing sources at the leading edge. No one knows this better than Qualcomm and MediaTek so I quite expect Qualcomm to be another big customer to collaborate with Intel Foundry, absolutely. We can make a list of other potential IFS customers in the comments section, absolutely.

Intel and MediaTek Form Foundry Partnership

About IFS

IFS was established in 2021 to help meet the surging global demand for advanced semiconductor manufacturing capacity. IFS is differentiated from other foundry offerings with a combination of leading-edge process and packaging technology, a world-class IP portfolio, and committed capacity in the United States and Europe. IFS customers will reap the benefits of Intel’s recently announced factory expansions at existing sites, as well as plans for major new investments in greenfield sites in Ohio and Germany.

Also read:

3D Device Technology Development

Intel Foundry Services Puts PDKs in the Cloud

Intel 4 Deep Dive


ASML Business is so Great it Looks Bad

ASML Business is so Great it Looks Bad
by Robert Maire on 07-24-2022 at 6:00 am

ASML Systems 2022

-ASML reports strong quarter- Orders up 20% Qtr/Qtr
-Customers rush delivery which delays revenue recognition
-Chip makers need hard to get litho tools most of all
-Warning on concerns about consumer chip demand

Good numbers that are even better in reality

ASML reported revenues of Euro5.4B and EPS of Euro3.54. Most importantly orders came in at Euro8.5B versus street expectations of about Euro7B and jumped over 20% quarter over quarter. The company shipped 14 EUV tools.

Rush to get equipment masks outperformance

As we had previously heard from ASML, the company is doing rush deliveries of incomplete tools, due to supply chain constraints, which are then finished at customer sites. Customers are obviously very desperate to get their hands on tools and don’t want to step out of the order queue lest they get back on the end of a 2 year (or longer) line.

The financial issue is that ASML can’t take full revenue recognition as the tools that are rush shipped are incomplete. This obviously masks what would have otherwise been strong performance. The slight benefit is that the delayed revenue does come back in later quarters at 100% gross margin.

The percentage of rush tools and therefore partial revenue is likely to increase going forward which will depress revenues in near term. ASML predicts that the delay impact will grow from about Euro1B to about Euro2.8B and push into 2023. We don’t see this situation changing any time soon as supply chain issues appear to be longer term in nature.

ASML will be last to see chip weakness

We have heard warnings from Micron and LG about a semiconductor down cycle coming in memory. Perhaps a down cycle will be focused on memory and other consumer specific semiconductor devices. In any event, ASML will be the last semiconductor equipment company to see any impact.

Process tools , such as etch and deposition tend to be more of a turns business which can usually ship relatively quickly even though lead times are currently stretched, they are not near as long as litho tools.

Additionally, there are multiple suppliers of etch and deposition tools so there is competition which tends to keep supply times shorter or allows for alternatives if delays grow too long. ASML remains a monopoly in EUV with no alternatives. The bottleneck in critical lens supply remains in Zeiss which limits increasing supply.

Supply chain remains problematic

Company management is guiding for further issues in the supply chain that appear to be worsening which will limit revenue growth to roughly 10% in 2022.

The company expects to ship 55 EUV systems in 2022 but only 40 of which will be revenue recognized in 2022 with 15 systems slipping into 2023 for revenue recognition purposes.

Increases in costs in the supply chain also impacts cost of sales which obviously impacts gross margin but ASML will likely either share or pass increase costs onto customers.

Keeping an eye on Zeiss and Germany

Although its not a problem now, in the summertime, we are keeping an eye on Russian gas supply to Germany. If gas gets cut off in the coming winter businesses will get curtailed first and consumers last. We would hope that Zeiss is making plans for the highly sensitive lens systems in long term production in Germany that may be exposed to such a shut down.

ASML likely to ride through a chip cycle downturn due to backlog

Given the existing strong and long backlog in ASML’s order book, we think there is less than zero risk to 2022 and likely close to zero risk in 2023.
We don’t expect any cyclical downturn to last more than a year or so. The last time that Samsung put the brakes on capex it was for a relatively short few quarters.

We think it would take a very significant macro economic downturn to lengthen a semiconductor down cycle given the breadth of demand we are seeing.

China

We also see little impact on ASML from any potential embargo on China as there are many other customers outside of China who would gladly take their place in line and take their tools. As we have said multiple times, in the long run, semiconductors are a long term zero sum game. If anything, taking China out of the equation could keep supply short and limit down cycles and keep pricing for chips higher. In summary we don’t see much of a risk out of the China situation other than rearranging the shipping destination of tools.

The stocks

Obviously this is a very positive report for ASML. Business is as strong as ever if not stronger than before. Customers remain desperate to get ASML tools. Financials remain solid and technology moves on. So we see nothing but positive for the stock of ASML.

This could be the point where short sellers who have seen ASML’s stock price get cut in half should likely abandon ship and close out their short positions. One investor famously said they had a $1B short position in ASML. If we get a bit of a short squeeze we could see a bottom and a bounce of ASML’s stock price, and a turn in the otherwise down trajectory.

While there may be some sympathetic positive reaction from other semiconductor equipment stocks, we think the negative talk of consumer chip concerns are more of a risk to the process tool makers such as Applied Materials and Lam. KLAC is impacted to a lesser extent as their tools have longer lead times, though not as bad as ASML, and they have a strong market position in most, but not all, markets and that keeps their backlog stronger.

We will wait and see what others have to say but clearly there is weakness showing in the chips market but we don’t have a clear picture as yet as to how deep and wide that weakness is. Will the down cycle be limited to memory or memory and consumer facing logic or across the entire breadth of the chip industry? We just don’t know as much of the depth and breath of a down cycle depends on the less predictable macro economic and geo political issues which are still evolving.

About Semiconductor Advisors LLC
Semiconductor Advisors is an RIA (a Registered Investment Advisor), specializing in technology companies with particular emphasis on semiconductor and semiconductor equipment companies. We have been covering the space longer and been involved with more transactions than any other financial professional in the space. We provide research, consulting and advisory services on strategic and financial matters to both industry participants as well as investors. We offer expert, intelligent, balanced research and advice. Our opinions are very direct and honest and offer an unbiased view as compared to other sources.

Also read:

Micron kicks off the down cycle – Chops 2023 capex – Holding inventory off street

ASML- US Seeks to Halt DUV China Sales

SEMICON West the Calm Before Storm? CHIPS Act Hail Mary? Old China Embargo New Again?


Podcast EP95: An Overview of Axiado’s Transformative Security Technologies

Podcast EP95: An Overview of Axiado’s Transformative Security Technologies
by Daniel Nenni on 07-22-2022 at 10:00 am

Dan is joined by Gopi Sirineni, the President & CEO of Axiado, a company that is spearheading unique security technologies with AI in hardware. He is a Silicon Valley veteran with over 25 years of successes in the semiconductor, software and systems industries.

Gopi explains what’s different about the Axiado approach to security and its impact in real world situations.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.