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Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC

Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC
by Daniel Nenni on 07-16-2026 at 2:00 pm

Agentrys DAC Plan

Agentrys is pioneering Agentic Design Automation (ADA), a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms. Today, frontier AI can automate many engineering tasks by understanding specifications, generating RTL and scripts, creating assertions and testbenches, and assisting with debug.

We believe the next transformation is to automate and continuously improve the engineering workflows that determine product quality, engineering productivity, and time-to-market. This transformation will result in an agentic engineering workflow customized to each design team’s own engineering knowledge and design methodology. We call this Agentic Design Automation (ADA).

Our Agentrys Studio delivers a platform that enables engineering organizations to build, deploy, evaluate, and continuously improve an agentic engineering workflow running securely on the company’s existing EDA infrastructure and learning from its own engineering data.

Target Applications

Our initial focus is functional verification — testbench stimulus generation, checker generation, and assertion creation. Next, we are extending into physical implementation and optimization, where we are already in active customer engagements. Our roadmap covers RTL design, analog design, and system design.

Challenges Being Addressed

Every semiconductor company is wrestling with the same questions. How do we use AI to improve engineering productivity — safely, and inside our existing flows? How do we protect proprietary engineering knowledge when our designs are our most valuable asset? How do we deploy AI inside secure, often air-gapped, enterprise environments?

Our answer is that the advantage must come from something your team owns — its methodology and its data. So, the agents should be yours. They should learn from your designs, run behind your firewall, and get better with every project. That is the difference between renting capability everyone else can rent and building an asset that compounds for you alone.

Target Audience

Engineering leadership that is contemplating how to deploy AI in the design flow with maximum impact and minimum disruption will find meaningful help by visiting Agentrys at DAC. Any engineer working in functional verification or physical implementation will also find useful, actionable ideas to improve productivity and quality of results.

Booth Information and How to Request a Meeting

Visit Agentrys in booth 743 on the DAC show floor. We’re near the DAC Pavillion. We will be conducting overviews of several of our applications. We’re there to answer your questions and show you what the future will look like. If you’d like to set up a reserved meeting time, you an do that here. See you at DAC.

Also Read:

CEO Interview with Mark Ren of Agentrys


WAVE-P: Hardware Acceleration for the APV Professional Video Codec

WAVE-P: Hardware Acceleration for the APV Professional Video Codec
by Daniel Nenni on 07-16-2026 at 10:00 am

WAVE P Chips&Media

Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer imaging systems, WAVE-P brings APV encoding and decoding into a compact, low-power implementation suitable for cameras, mobile devices, production equipment, and media-processing systems-on-chip.

APV is an intra-frame codec, meaning each frame is coded independently rather than relying on references to earlier or later frames. This is important in editing because systems can seek, cut, decode, and re-encode individual frames without reconstructing a long group of pictures. The codec targets perceptually lossless quality, supports chroma formats from 4:2:2 to 4:4:4, and handles high bit depths from 10 to 16 bits. It also supports HDR10, HDR10+, extensible metadata, multiview content, and auxiliary planes such as depth and alpha. According to the supplied material, APV delivers an average 19.3 percent BD-rate improvement over a conventional professional video codec in tested 2K and 4K 4:2:2 sequences.

WAVE-P implements this codec in hardware with both encoding and decoding support. A single core is specified for 8K video at 30 frames per second at 500 MHz in a 4:4:4 12-bit profile. The design supports APV profiles including 4:0:0, 4:2:2, and 4:4:4 at 10 bits, plus 4:2:2 and 4:4:4 at 12 bits. It also supports OpenAPV constant-bit-rate and constant-frame-rate encoding, input and output dimensions up to 64K by 64K, and integrated functions such as color-space conversion and cropping.

Architecturally, WAVE-P combines a core controller, codec controllers, transform and quantization engines, variable-length coding and decoding blocks, bitstream buffering, DMA, preprocessing, and post-processing. Its multi-core scalability and tile-based processing are especially relevant for high-resolution workloads because tiles can be processed in parallel. This allows system designers to increase throughput without redesigning the entire pipeline.

The architecture also minimizes host-CPU involvement, reducing software overhead and freeing general-purpose processors for application logic, user interfaces, or AI tasks. Flexible pixel layouts for YUV, RGB, and ARGB further simplify integration with image sensors, display pipelines, graphics engines, and existing memory architectures. Future profile support is anticipated for additional bit depths, protecting SoC designs against evolving production requirements. That flexibility can extend product life and reduce redesign costs.

The performance figures are notable. At 500 MHz, simulated encoding throughput reaches approximately 1.07 gigapixels per second for 4:4:4 video in one sample format, while decoding reaches roughly 1.05 gigapixels per second. For 7680-by-4320 video, the reported results are about 32 frames per second for 4:4:4 encode and decode, meeting practical 8K30 requirements. Power estimates are approximately 14.7 mW for encoding and 14.6 mW for decoding under the stated 7 nm test conditions. The full codec configuration is estimated at 657,000 logic gates plus 12.93 KB of memory, for a total equivalent area of 887,000 gates.

Why does this matter? Professional-quality video is moving into smaller, battery-powered devices, while resolutions, frame rates, color fidelity, and metadata complexity continue to increase. Software-only processing can struggle to sustain these workloads efficiently. A dedicated codec engine provides predictable real-time performance, lower energy per frame, and reduced memory and CPU pressure.

Bottom line: WAVE-P represents more than a faster codec block. It is an enabling technology for 8K cameras, smartphones, broadcast systems, immersive media, and cloud-edge production tools that need high-quality intermediate video without the cost and inefficiency of traditional professional formats. By combining APV’s editing-friendly compression with scalable hardware acceleration, WAVE-P could help make professional-grade capture and post-production capabilities practical across a much broader range of devices.

CONTACT CHIPS&MEDIA

Also Read:

Chips&Media Strengthens Codec Leadership With Next-Gen AV2 Licensing Deal

Chips&Media’s Next-Generation Video CODEC IP Powers Ambarella’s Expanding Edge AI Portfolio

CFrame60: Rewriting the Rules of Frame Compression


PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Kalar Rajendiran on 07-16-2026 at 6:00 am

PCIe7 Switch with TDM

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized for AI infrastructure.

What has changed is not the technology itself, but the demands placed upon it. As artificial intelligence (AI) and high-performance computing (HPC) systems scale from a handful of accelerators to thousands, and even hundreds of thousands of interconnected GPUs, efficient communication has become just as important as computational performance. In today’s AI clusters, moving data quickly and predictably between compute, memory, storage, and networking resources is often the key to overall system performance.

Strategic Importance of Connectivity

This shift has transformed connectivity from an enabling technology into a strategic differentiator. Rather than replacing proven standards, the industry is extending them with architectural innovations that improve bandwidth utilization, scalability, and flexibility for AI workloads.

The growing importance of interface technologies is reflected in the industry’s increasing focus on market intelligence. For years, IPnest (now part of SemiWiki), has reported the evolution of the interface IP market through its annual Interface IP Survey report, providing one of the industry’s most comprehensive analyses of technology trends, vendor positioning, and market growth. The report underscores the rapid expansion of connectivity IP, driven by AI and high-performance computing.

According to the recently published Interface IP Survey report by SemiWiki, Rambus achieved 29% year-over-year growth in its PCIe interface IP business, highlighting its growing presence in the high-speed connectivity IP market. Building on this momentum, Rambus has introduced PCIe 7 Switch IP with integrated Time Division Multiplexing (TDM), designed to address the communication challenges of next-generation AI networking SoCs.

AI is Redefining Connectivity

As AI infrastructure grows in size and complexity, simply adding more GPUs is no longer enough. Modern AI systems combine CPUs, GPUs, storage, networking devices, SmartNICs, SuperNICs, and CXL memory expanders, all of which must communicate continuously across a shared interconnect fabric.

This makes connectivity a critical determinant of system performance. Even the most powerful accelerators cannot deliver maximum throughput if data cannot move efficiently between system resources.

PCI Express continues to serve as the backbone of this communication infrastructure, but higher bandwidth alone is only part of the solution.

PCIe 7.0: More Than Higher Bandwidth

PCIe 7.0 doubles the data rate from 64 GT/s to 128 GT/s per lane, providing the bandwidth needed for increasingly data-intensive AI workloads.

However, as bandwidth increases, so do the challenges. Efficiently sharing bandwidth among many simultaneously active devices, maintaining predictable latency, and avoiding communication bottlenecks become just as important as increasing raw throughput.

This is where advanced PCIe switch architectures play a critical role.

PCIe Switches Take Center Stage

PCIe switches have existed since the earliest generations of PCI Express, enabling scalable communication between processors and peripheral devices. Their importance has grown dramatically with AI, where direct connections between every processor and every accelerator are no longer practical.

Today, PCIe switch IP is increasingly embedded within advanced networking SoCs used in SmartNICs and the emerging class of SuperNICs. These devices sit at the convergence of compute, storage, networking, and AI acceleration, enabling efficient communication across large-scale AI clusters.

While SmartNICs primarily offload infrastructure functions such as networking, storage, security, and virtualization, SuperNICs are purpose-built for AI, supporting high-performance communication among thousands of GPUs and accelerators operating in tightly synchronized training environments.

Time Division Multiplexing Improves Bandwidth Efficiency

One of the key innovations in the Rambus PCIe 7 Switch IP is the integration of Time Division Multiplexing (TDM). Importantly, TDM is not part of the PCIe 7.0 specification; it is an architectural enhancement implemented within the switch itself.

Rather than assigning fixed bandwidth to connected devices, TDM dynamically allocates transmission opportunities based on application demand. This improves link utilization, enables more efficient resource sharing, and helps maintain predictable traffic behavior as workloads change.

The switch architecture also provides flexible PCIe lane partitioning. A x16 interface, for example, can be configured during system initialization as one x16 connection, two x8 connections, or four x4 connections, allowing system designers to adapt the same hardware platform for different combinations of GPUs, SSDs, accelerators, and networking devices.

Optimized for AI Networking SoCs

Rambus designed its PCIe 7 Switch IP specifically for the implementation challenges of modern AI networking chips. In addition to supporting PCIe 7.0 data rates and integrated TDM, the architecture is physically aware, enabling more efficient implementation across the large silicon dies commonly found in advanced SmartNIC and SuperNIC SoCs.

This system-level approach addresses not only protocol functionality but also practical challenges such as routing complexity, latency, and physical implementation.

Summary

The future of AI infrastructure will depend not only on more powerful processors, but also on the intelligent connectivity that allows them to operate as one coherent, high-performance system.

PCIe, PCIe switches, NICs, SmartNICs, and TDM underpinning modern connectivity not new technologies per se. What is new is the role they play in enabling the scale and performance demanded by AI and HPC.

As AI systems continue to expand, innovation is increasingly focused on making these proven technologies work smarter rather than simply faster. PCIe 7.0 provides the bandwidth, while architectural enhancements such as Rambus’ PCIe 7 Switch IP with integrated Time Division Multiplexing help ensure that bandwidth is used efficiently, flexibly, and predictably.

A short overview video from Rambus.

Download Rambus PCIe 7.0 Switch with TDM product brief from here.

Also Read:

Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory Modules

WEBINAR: HBM4E Advances Bandwidth Performance for AI Training

How Memory Technology Is Powering the Next Era of Compute


DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
by Daniel Nenni on 07-15-2026 at 2:00 pm

Dac Banner

Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable interconnect solutions such as multi-rate SERDES and programmable I/O’s. These products help balance performance and power while optimizing system level power integrity in applications ranging from data centers, edge AI, computing and networking, to automotive, aerospace and consumer electronics.

Technically, Analog Bits addresses the most critical challenges of today’s power-hungry high-performance computing system needs, whatever the target application: to be power efficient, deliver good thermal management and maintain signal integrity at high data rates. The company’s low power mixed-signal IP portfolio sits at the intersection of all three: it determines how efficiently power is delivered on-chip, how accurately signals are timed, and how cleanly high-speed data moves through interconnects.

The company’s IP has been shipped at billions of units scale across customer designs and is proven in all major process technologies, including leading edge 2nm technology, with all five major global foundries: TSMC, Samsung Foundry, Intel Foundry, GlobalFoundries, RAPIDUS, UMC. Analog Bits has over 1,000+ IP products on 75+ process nodes and used by over 400 customers globally.

Specific customer names cannot be disclosed due to standard NDA practices, but Analog Bits’ IP can be found in top global hyperscalers’ AI accelerator programs; in leading North American automotive OEMs’ next-generation SoC programs; in major US big-tech custom silicon programs in the data-center; in hyperscale switch ASIC vendors and high-lane-count interconnect designers; and in the next generation of AI accelerators.

The core differentiator for Analog Bits’ IP is its process portability across nodes and foundries, its first-time silicon success track record, being pre-integrated and customizable for SoC platforms, and extremely low-power designs validated in silicon.

You can visit Analog Bits at DAC 2026 at booth number 949 to see live demonstrations of the company’s TSMC N2P IP portfolio and meet with its engineering experts. Also discover how Analog Bits’ advanced PLLs, power management solutions, and comprehensive infrastructure IP can help power the next generation of semiconductor innovation. For more information visit the web site at https://www.analogbits.com/.

Also Read:

What Winemakers and Chip Designers Have in Common

Analog Bits Demos Real-Time On-Chip Power Sensing and Delivery on N2P at the TSMC 2026 Technology Symposium

Podcast EP322: A Wide-Ranging and Colorful Conversation with Mahesh Tirupattur


Perforce Enabling Innovation Without Introducing Risk at DAC 2026

Perforce Enabling Innovation Without Introducing Risk at DAC 2026
by Daniel Nenni on 07-15-2026 at 10:00 am

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Perforce delivers a DevOps Tech Stack for teams building and running high-stakes software systems and revenue-critical applications, where failure is not an option. As a trusted partner helping organizations govern software delivery for AI, Perforce solutions enforce guardrails across code quality, infrastructure, and data — enabling innovation without introducing risk. With customers in over 80 countries — including more than 75% of the Fortune 100 and 50% of the Global 500 — Perforce is trusted by the world’s most innovative teams to build, test, secure, and deliver critical software at scale.

DAC Info:

Dates: July 26-29th, 2026
Location: Long Beach, CA [Booth#1449]
Primary Audiences: VP/Director of Engineering, Head of IT, Director of Analog/Mixed Signal Design

What We’re Promoting:
  • Perforce P4
    • AI Provenance
    • P4 Analytics
  • Perforce IPLM
    • IPLM MCP through the Perforce Agentic Gateway
    • AI Assistant
    • Neo4j 5 Support
  • Perforce VersIC
    • Editor for analog designers, with integrations to Cadence and Keysight ADS.
  • Siemens Partnership and EDA integrations
  • Speaking Session: Vishal Moondhra, Sr. Director, Solutions
  • Happy Hour, Tuesday, July 28th, 4pm PST

Product-level Value and Benefit Statements

Perforce P4
  • AI-driven workflows demand a centralized system of record, proven for scale.
  • Git lets teams re-write history. P4 provides an immutable lineage of changes for your users and their agents.
  • All of the control. None of the inefficiencies.
  • Enable secure workflows across your teams and tech partners with flexible automations and file-level permissions.
Perforce IPLM
  • Trace, tune, and assess your entire IP library, from design to tapeout.
  • IPLM provides a modern and holistic view into your most critical components, with all of the metadata, dependencies, and status information you need to keep work moving.
  • Workspace management that simplifies handoff and reuse.
  • IPLM bridges the gap left by standard PLM tools alone. With a holistic view of your IP from the SOC to company level, your team can uncover efficiencies during planning and gain confidence at delivery.
  • Trusted Siemens partner
  • If you’re using one or more Siemens EDA tools, Perforce offers built-in integrations that improve the efficiency of your most critical workflows.

Link to schedule a meeting – Contact Us page

https://ter.li/bvq3d45g

Also Read:

IP Lifecycle Management in the AI Era

An Update on IP Lifecycle Management (IPLM)

Perforce and Siemens Collaborate on 3DIC Design at the Chiplet Summit


Arteris at DAC 2026 Connecting Innovation for Silicon Success

Arteris at DAC 2026 Connecting Innovation for Silicon Success
by Daniel Nenni on 07-15-2026 at 6:00 am

Arteris Company banner

The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.

Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly complex systems, how quickly sophisticated SoCs can be integrated, and how confidently security can be built into the silicon from day one.

For more than two decades, Arteris has helped the world’s leading semiconductor companies solve some of the industry’s most difficult design challenges. Today, the company’s portfolio spans three foundational technologies that have become increasingly interconnected as silicon grows more sophisticated:

  • Connect: Network-on-chip (NoC) interconnect IP for optimized on-chip data movement.
  • Integrate: System integration automation to simplify complex SoC development.
  • Secure: Hardware security assurance that helps engineers identify vulnerabilities before tape-out.

Together, these technologies enable engineering teams to develop higher-performance, more scalable, and more secure silicon while reducing design effort, integration risk, and time to market. More than 950 design starts and 4 billion devices shipped demonstrate the industry’s confidence in Arteris technology and expertise.

At DAC 2026, visitors to Booth #833 will see how this approach supports the industry’s most demanding applications, including AI infrastructure, hyperscale data centers, automotive systems, industrial automation, communications, edge AI, and advanced chiplet and multi-die architectures.

As design complexity continues to accelerate, Arteris helps engineering organizations optimize data movement, simplify system integration, and build trusted silicon without compromising performance or development schedules.

Beyond the booth, Arteris experts will participate in the DAC panel and industry roundtables discussing hardware security assurance, AI-assisted semiconductor design, and the future of multi-die and chiplet architectures. These sessions reflect Arteris’ ongoing role in helping shape many of the industry’s most important technology conversations.

On July 27, 2:00 PM-2:45 PM, join Michal Siwinski, Chief Product & Marketing Officer at Arteris, and the industry leaders from Caspia Technologies, Graf Research and Crypto Quantique for a panel discussion on the topic of “From RTL to Reality: Building Security into the Silicon Lifecycle”.

Whether you’re an SoC architect, engineering manager, silicon security specialist, semiconductor executive, or technology partner, visit our talks or Booth #833 to discuss the technologies shaping the next generation of semiconductor design and discover how Arteris is helping the world’s leading companies connect innovation for silicon success.

Book a meeting with the team here.

Also Read:

Apple’s planned $30 billion-plus chip-supply agreement with Broadcom marks a significant step in the company’s effort to localize more of its semiconductor supply chain in the United States. According to Reuters, the multi-year deal extends through 2031 and centers on U.S.-made wireless and radio-frequency components, including FBAR filters used to support connectivity functions in Apple devices such as 5G, Wi-Fi, Bluetooth and GPS.

From a technical-supply perspective, the agreement strengthens Apple’s access to specialized RF front-end components, which are critical for signal filtering, power efficiency and reliable wireless performance in compact consumer electronics. Broadcom will invest about $1.5 billion to expand its Fort Collins, Colorado facility, with the program expected to produce at least 15 billion chips.

The deal also reflects Apple’s broader strategy of diversifying semiconductor sourcing while increasing domestic manufacturing exposure. Although Apple’s most advanced application processors and memory components remain tied to global foundries and suppliers, RF chips are a practical category for U.S. capacity expansion because they rely on specialized manufacturing processes and long-term qualification cycles. Locking in supply through 2031 gives Apple greater control over component availability, reduces geopolitical and tariff-related risk, and supports closer collaboration with Broadcom on custom silicon requirements.

For Broadcom, the agreement deepens its role as a strategic Apple supplier and justifies capital investment in domestic capacity. For Apple, it is both a supply-chain resilience move and a policy-aligned investment in U.S. semiconductor production.

Also Read:

Podcast EP350: The Growing Threat of Hardware Security Breaches and What to do About it with Dr. Andreas Kuehlmann

Connecting the Dots: Why RISC-V System Design Is Entering a New Era

Scalable Network-on-Chip Enables a Modular Chiplet Platform


DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm

DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm
by Daniel Nenni on 07-14-2026 at 2:00 pm

certus dac63 technical

Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at Booth 839 during DAC 2026, July 27–29 in Long Beach. This year, Certus is announcing two new developments in GlobalFoundries 12LP and 12LP+ Processes: one I/O library built for commercial SoC and ASIC design teams, and one library purpose-built for radiation-hardened ASIC and FPGA applications in space and defense. Both are progressing to tapeout this year on Global’s 12nm processes.

GH12 I/O Library: A Full-Featured Commercial I/O Library

The Certus GH12 library combines Certus’ prior experience on Global Foundries 12LP and 12LP+ nodes, designed to cover the full range of requirements that real chip designs demand. It goes well beyond a basic GPIO cell, spanning standard and mixed-supply bidirectional I/O, failsafe operation with native I2C capability, a security-focused tamper-detection cell with integrated high-impedance sensing, and analog I/O for digital-domain applications. A complete set of power, supply, and pad ring infrastructure cells means design teams can close out a full pad ring without piecing together solutions from multiple sources.  The Library also support “SLEEP” states and various Power-down Modes.

GH12 operates at 0.8V core and 1.8V/3.3V I/O, meets 2kV HBM ESD with latch-up resistance, covers the full -40°C to 125°C industrial range, and requires no special ESD implants beyond the base GF12 process. It arrives integration-ready with the full deliverable suite: GDS, layout abstracts, CDL and extracted netlists, Verilog, IBIS, LEF, and complete documentation.

GF12 and GG12 Radiation-Hardened I/O Libraries with both standard multi-voltage GPIO and FPGA I/O feature sets.

For programs that demand more, Certus is also delivering a dedicated radiation-hardened-by-design I/O library for both Standard 1.8V to 3.3V GPIO Applications as well as FPGA applications on Global 12LP and Global 12LP+, targeting space and defense programs where I/O reliability under radiation is non-negotiable. The library ports Certus’s proven high-performance and high-voltage I/O architectures to Global’s 12nm processes, applying radiation hardening design techniques. It pairs high-speed differential signaling with wide-range high-voltage I/O’s into a single design, includes integrated on-chip supply regulation, and is built to the same ESD-robust, wide-temperature standards as Certus’s commercial 12LP/LP+ work. The result is an I/O solution that integrates cleanly and protects reliably in the harshest operating environments.

GF12 I/O, Done Right

Global’s 12LP and 12LP+ have become a node of choice for FPGAs, ASICs, and SoCs that need performance, efficiency, and a long-lived foundry ecosystem. Certus brings 16+ years of custom I/O development to Global’s 12nm nodes.

Find us at DAC 2026, Booth 839. July 27–29, Long Beach.

Contact Certus for more information

Also Read:

Modern Trends in I/O and ESD Design at TSMC OIP

EP177: The Certus Approach to Meeting the Challenges of I/O and ESD with Stephen Fairbanks

The Opportunity Costs of using foundry I/O vs. high-performance custom I/O Libraries


DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verification

DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verification
by Daniel Nenni on 07-14-2026 at 10:00 am

SemiWiki x DAC banner

Mach42 spun out of the Department of Physics at the University of Oxford in 2019 with a mission to establish software tools capable of drastically accelerating expensive physics simulations while supporting complex computational workflows. The prototype tools were successfully applied in the emulation of extreme states of matter – plasmas – and initial contracts in the fusion energy space followed.

After seed funding in 2021, the company switched focus to target a fundamental simulation bottleneck in the semiconductor market – verification of complex analog circuits. Traditional methods use non-linear equation solvers to model the behaviours of the circuits in question. These methods are highly accurate, but extremely slow, with simulation speedup largely reliant on performance improvements in the underlying hardware.

Mach42’s technology is at the forefront of a new generation of physics-driven AI models which seek to learn the underlying equations that govern complex systems. This represents a significant departure from previous generations of neural networks. Modelling the physical world is based on continuous, causal functions where the current state depends on previous states, together with impulses that occur at irregular times.

Mach42’s approach to physical systems leverages a natural, problem-adapted representation of the systems in question, leading to dramatically improved accuracy that goes far beyond existing methods. The approach relies on embedding the governing equations of the system in the network, which now has a chance of emulating the underlying physics, rather than simply capturing statistical relationships between inputs and outputs.

Mach42 accelerates the verification of analog circuits by leveraging our ability to create highly accurate surrogate models – neural networks – to augment the capabilities of traditional non-linear equation solvers. We train our surrogate models using the design testbench to create a representation of the unit-under-test.

The tools allow us to drive the target simulation environment (normally Cadence® Spectre®), and our proprietary smart sampling methods enable us to maximise the accuracy of the resulting models while minimising the training runs required. Once the model is trained, there are several exploitation routes available. It can be hosted in our environment – the Discovery Platform – where the verification engineer can examine the behaviour of the unit-under-test interactively using a GUI. In a similar vein, the model can be interrogated using scripts to conduct appropriate verification sweeps. Finally, the model can be instanced in the target simulation environment providing orders-of-magnitude simulation speedup (remember, we are executing a neural network instance, not a non-linear equation solver).

We have developed a further valuable capability that complements the simulation acceleration described above. We can generate surrogate models of a unit-under-test that produce a behavioural description of the circuit in the Verilog-A language. This enables designers to rapidly create highly accurate Verilog-A representations of their circuits automatically – a process that can take many weeks or months manually.

See more in our demo at booth #659 in the Exhibit Hall at DAC. If you’d like to book a meeting ahead of time, contact us at info@mach42.ai.

Also Read:

Beyond Transformers. Physics-Centric Machine Learning for Analog

2026 Outlook with Paul Neil of Mach42

Video EP12: How Mach42 is Changing Analog Verification with Antun Domic


Synopsys at Design Automation Conference 2026

Synopsys at Design Automation Conference 2026
by Daniel Nenni on 07-14-2026 at 6:00 am

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Synopsys is catalyzing the era of pervasive intelligence with comprehensive engineering solutions spanning silicon design, IP, and simulation and analysis. At this year’s Design Automation Conference (DAC), the company will showcase innovations transforming silicon and systems development for a wide range of applications including physical AI, automotive, data center, and consumer devices.

As the industry moves toward sub-micron process technologies and chiplet-based architectures, engineers face unprecedented complexity driven by physics-related effects, increasing verification cycles, mounting time-to-market pressures, and more. These challenges are driving a rethink of traditional engineering approaches, with trends such as agentic AI and multiphysics-aware co-design reshaping development workflows.

Live Demos: Agentic AI, Multiphysics Fusion, and Cloud-based EDA

Come by Booth #631 to see these innovations in action. Whether you’re a startup, foundry, or hyperscaler, we invite you to receive a live demonstration of the following:

Agentic AI Transforming Chip Design

This demo will show how agentic AI is transforming chip design – illustrating intelligent orchestration across multiple EDA agents with adaptive learning to generate Register Transfer Level (RTL) code from natural language and formal specification, run Lint checks to ensure clean RTL, generate unit-level testbenches, and iteratively run verification to converge on target objectives.

First Public Demonstration of Multiphysics Fusion Solutions

To be shown for the first time at this year’s DAC, the newly unveiled Multiphysics Fusion portfolio combining Synopsys’ AI-powered design platforms with Ansys signoff-grade multiphysics analysis will demonstrate workflows for 3DIC design, design closure, and custom photonics.

Simulation & Analysis Portfolio for Next-Generation Electronic Systems

This demo will show a unified multiphysics simulation and analysis portfolio for next-generation electronic systems across chip, package, and board. It highlights high data-rate link analysis, including 3D simulation of advanced IC systems to capture multiphysics effects, workflows for PCB design and reliability, and scalable data processing systems that accelerate analysis of large datasets.

Synopsys Cloud Accelerates Tape-Outs by Months

As semiconductor designs grow more complex, time-to-results (TTR) has become a major bottleneck across chip design workflows. This demo will show how the Synopsys Cloud Platform improves engineering productivity, and highlights include will chip design tools integrated in GitHub-based hardware, elastic compute and scalable licenses, and simplified access to Synopsys.ai solutions.

Expert Insights: Advanced Packaging, Hardware-Assisted Verification, Memory, Quantum, & More

You can also connect with Synopsys experts who are leading technical presentations and participating in engaging panels. Example sessions below and you can view our full speaker lineup here.

Is the EDA Industry Fundamentally Ill-Prepared for True 3D Heterogeneous Integration?

Panelists: Henry Sheng, Synopsys + USC, CMU, Qualcomm, Broadcom, Cadence

Tuesday, 7/28 10:30am – 12:30pm PDT

Advancements in Emulation and Prototyping for Semiconductor: Hardware Tools, Challenges, and FPGA Solutions

Presenters: Sabya Das, Synopsys + Narendra Konda, NVIDIA

Tuesday, 7/28 4:00pm – 4:30pm PDT

How Silicon Startups are Addressing the AI Memory Gap

Presenters: Vikram Bhatia, Synopsys + Wenbo Yin, TetraMem + R. Scott Hills, ANAFLASH

Tuesday, 7/28 5:15pm – 5:45pm PDT

Bridging Quantum, AI, and EDA: The Next Frontier of Design Automation

Panelists: Jimmy Cheng, Synopsys + Google/UMass Amherst, IBM Research, Qolab, QC Ware, Applied Materials

Wednesday, 7/29, 10:30am – 12:30pm PDT

To book a meeting with Synopsys at DAC 2026, please contact globalevents@synopsys.com.

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DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.

DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.
by Daniel Nenni on 07-13-2026 at 2:00 pm

DAC 2026 luncheon promo 400x400 (1)

Accellera Systems Initiative invites the design and verification community to join us at the 2026 Design Automation Conference for a focused technical luncheon, Embracing AI for Advanced Design and Verification,” on Tuesday, July 28, from 12:30–1:45 p.m. at the Long Beach Convention Center, Meeting Room 104C.

Artificial intelligence is rapidly becoming a transformative force across the electronic design automation ecosystem. From generative design assistance and automated test creation to machine-learning-driven debug, coverage analysis, performance optimization, and system-level exploration, AI is changing how engineering teams approach increasingly complex semiconductor development. As AI techniques become embedded in design and verification workflows, the industry must address a new generation of challenges related to interoperability, data representation, model exchange, repeatability, explainability, and trust.

This luncheon will explore how AI is reshaping not only engineering practice, but also the standards landscape that supports scalable and reliable design automation. Standards have long played a critical role in enabling methodology reuse, tool interoperability, IP integration, verification portability, and ecosystem collaboration. As AI is introduced into EDA flows, similar standardization needs are emerging around how design intent, verification intent, constraints, coverage data, debug information, training data, model outputs, and tool-generated recommendations are represented and exchanged.

AI-enabled EDA introduces opportunities to accelerate productivity, but it also raises important technical questions. How should AI-generated design or verification content be validated? What metadata is required to support traceability and reproducibility? How can organizations compare results across tools and methodologies when AI models may be probabilistic or continuously evolving? What common interfaces or data schemas are needed to allow AI-assisted workflows to operate across heterogeneous toolchains? And where can standards help prevent fragmentation as industry and academia explore new AI-driven approaches?

Moderated by Mike Gianfagna of SemiWiki, the panel will feature perspectives from leaders working at the intersection of semiconductor design, EDA, AI, and standards. Panelists include Dr. Jiang Hu, IEEE Fellow and Eric Rubin Professor at Texas A&M University; David Zhi LuoZhang, CEO of Bronco AI; and Simon Davidmann, AI+EDA researcher. Together, they will examine how AI is influencing advanced design and verification methodologies and where collaborative standardization may be most valuable.

The discussion will consider both near-term and long-term implications. In the near term, AI can help engineers improve efficiency in areas such as assertion generation, testbench development, coverage closure, failure triage, layout optimization, and documentation analysis. Longer term, AI may enable more autonomous flows in which tools reason across abstraction levels, optimize system architectures, identify verification gaps, and recommend corrective actions. For these capabilities to be trusted in production environments, the industry will need robust mechanisms for exchanging data, preserving engineering intent, recording provenance, and validating outcomes.

Audience participation will be an important part of the luncheon. Attendees will have the opportunity to share their views on where standardization is most needed across commercial EDA, semiconductor development, IP reuse, academic research, and emerging AI-enabled methodologies. Input from users, vendors, researchers, and system companies is essential to understanding the practical requirements that should guide future standards work.

This event is intended for engineers, architects, verification leaders, EDA developers, methodology experts, researchers, and managers interested in the technical and strategic impact of AI on design and verification. Whether your organization is already deploying AI-enabled tools or beginning to evaluate their role in future flows, this discussion will provide valuable insight into the standards challenges and opportunities ahead.

Seating is limited and available on a first-come, first-served basis. Signing up does not guarantee a seat, but we encourage interested attendees to register so Accellera can provide updates about the luncheon and estimate attendance.

Please sign up here ->.

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