Another Live Event at Samsung!

Next week Samsung is hosting another live event with eSilicon and Rambus, space is limited so register now. I’m not acquainted with two of the speakers, Mohit Gupta and Dr. Kang Sung Lee, but I do know Bill Isaacson and can tell you he is an excellent no nonsense speaker. Bill started the first half of his 20 year semiconductor career at LSI Logic and the second half at eSilicon, so Bill knows the ASIC business, absolutely.

Join eSilicon, Rambus and Samsung Foundry for an overview of the advanced technologies being deployed to address these challenges. We’ll discuss HBM technology and the associated PHY, high-speed SerDes technology, 2.5D integration, high-performance ASIC design, interposer/package design and the manufacturing and packaging technologies available to address this class of FinFET-based designs.
There is no charge for this live event.

Registration closes at noon Pacific time on Friday, March 3, 2017. For security reasons, only those who have pre-registered may attend.

Agenda
3:30 – 4:00Check in at the South Lobby reception area
4:00 – 4:15Welcome, overview of HBM/2.5D market and applications
4:15 – 4:45 Enabling IP
4:45 – 5:15 ASIC, interposer and package design
5:15 – 5:45 Fabrication and packaging
5:45 – 6:00 Panel discussion
6:00 – 7:00 Networking reception; drinks and light hors d’oeuvres

Event Details
Wednesday, March 8, 2017
4:00-7:00 PM
Samsung Semiconductor
3655 N First Street
South Lobby
Palace Auditorium
San Jose, CA 95134

Register>>>

SPEAKERS

eSilicon
Bill Isaacson manages all aspects of strategic account relationships for eSilicon. Previously, he managed advanced development for eSilicon’s custom design initiatives. Prior to this position, he ran the customer solutions engineering function at eSilicon for eight years. Bill was previously at LSI Logic, where he was a design center manager. Bill received his BS/EE degree from the University of Illinois at Urbana-Champaign.