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Coverage Driven Verification for Analog?

Coverage Driven Verification for Analog?
by Pawan Fangaria on 09-26-2014 at 1:00 am

We know there is a big divide between analog and digital design methodologies, level of automation, validation and verification processes, yet they cannot stay without each other because any complete system on a chip (SoC) demands them to be together. And therefore, there are different methodologies on the floor to combine analog… Read More


Electro-Thermal Simulation of Power Transistors

Electro-Thermal Simulation of Power Transistors
by Daniel Payne on 09-25-2014 at 4:00 pm

Power transistors are commonly used in applications like: hybrid vehicles, electric vehicles, automotive, home appliances, LED lighting, TVs, power and energy. In the old days an engineering team could build their device with power transistors, then after production run some thermal testing to see if they guessed the proper… Read More


TSMC Delivers First FinFET ARM Based SoC!

TSMC Delivers First FinFET ARM Based SoC!
by Daniel Nenni on 09-25-2014 at 9:00 am

Right on cue, TSMC announces 16nm FinFET production silicon. I believe this is the original version of FinFET versus 16FF+ which is due out in 1H 2015. I will confirm this next week at the TSMC OIP event in San Jose, absolutely. Either way this is excellent news for the fabless semiconductor ecosystem and I look forward to the first … Read More


Atmel Expands Wireless Portfolio

Atmel Expands Wireless Portfolio
by Paul McLellan on 09-25-2014 at 7:00 am

Recently someone described the Internet of Things (IoT) as being the semiconductor classification that we used to call ‘other’. It’s a nice line but actually I think IoT really is something different from what we were already doing before. Although it is a market that cuts across medical, automotive, home-electronics,… Read More


Strategic Materials Conference

Strategic Materials Conference
by Paul McLellan on 09-24-2014 at 8:00 pm

SEMI’s Strategic Materials Conference is coming up fast, on September 30th and October 1st next week at the Biltmore in Santa Clara. This year’s theme, Materials Matter—Enabling the Future of IC Fabrication and Packaging, will take a broad look at what is driving the demand for new materials, and how material suppliers … Read More


The Must Read FPGA Book – Secrets Inside

The Must Read FPGA Book – Secrets Inside
by Luke Miller on 09-24-2014 at 1:00 pm

Crockett, Elliot, Enderwitz & Stewart is not a law firm, thank goodness… what you’ll find is that these folks are the authors of the world famous book entitled, now hold on here for a title, this is a creative one “The Zynq Book”, It is free, get your download here. Every designer should have this book no matter what FPGA parts they… Read More


Explaining HAPS-DX in an elevator

Explaining HAPS-DX in an elevator
by Don Dingee on 09-24-2014 at 7:00 am

Every development team has been through this challenge: finding a tool that looks fantastic, then heading off to the manager one or two levels up who has enough signature authority for the purchase order. Signatures for amounts reading more than a couple of trailing zeros on POs are rarely free, or painless. … Read More


AMD Design IP Deal with Virage Logic… Oops… Synopsys

AMD Design IP Deal with Virage Logic… Oops… Synopsys
by Eric Esteve on 09-23-2014 at 9:59 am

Whoever has said that history never repeats itself should read this recent PR from AMD! The news can be summarized in three points:

  • Multi-year agreement gives AMD access to a range of Synopsys design IP including interface, memory compiler, logic library and analog IP for advanced FinFET process nodes
  • Synopsys acquires rights
Read More

The TSMC iPhone 6!

The TSMC iPhone 6!
by Daniel Nenni on 09-23-2014 at 7:00 am

Fortunately Paul McLellan and I missed IDF. Paul was atop Mt. Kilimanjaro and I was in Taiwan signing books. After reviewing the materials and watching the videos we really didn’t miss much in regards to mobile so no regrets. The Apple event would have been fun even though I won’t be buying an iPhone6 or an iWatch and I will tell you why.… Read More


Really Apple? Tanazania Leads US in Mobile Payments

Really Apple? Tanazania Leads US in Mobile Payments
by Paul McLellan on 09-23-2014 at 1:00 am

I was in Tanzania a few weeks ago. One of the conceits that we have in the US is that we lead the world in technology. That is true in many areas but in mobile the US is a laggard. Just look at the fuss made about NFC payments in the new iPhone given that Japan had mobile payments over a decade ago.

Another area where the US is a laggard, or maybe… Read More