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TSMC ♥ Cadence!by Daniel Nenni on 10-11-2014 at 4:30 pmCategories: Cadence, EDA, IP, TSMC
One of the questions I routinely ask amongst the fabless semiconductor ecosystem is, “How are the EDA vendors doing?” There are always complaints because, let’s face it, we all like to complain. On occasion however I do hear about a vendor who goes above and beyond the call of duty and it really brightens my day.
Of late,… Read More
If you’ll be at ITC TestWeek in Seattle (Oct 20-23), here’s one event you don’t want to miss: a technology reception hosted by Mentor, with Janusz Rajski and Nilanjan Mukherjee as the featured speakers. It is free to ITC attendees and you can register here. [If for some crazy reason you haven’t registered for ITC yet, do that… Read More
I’ll never forget debugging my first DRAM chip at Intel, peering into a microscope and watching the aluminum interconnect actually bubble and dissolve as the voltage was increased, revealing the destructive effects of Electromigration (EM) failure. That was back in 1980 using 6 um, single level metal technology, so imagine… Read More
How the Arduino Changed Embedded System Development Forever
In 2005 with the development of the Arduino, everything changed for people building things that required a microcontroller. The Arduino brought with it a low price standard, and open, hardware platform and an easy to use open source development environment. It was … Read More
In today’s SoC world where multiple analog and digital blocks along with IPs at different levels of abstractions are placed together on a single chip, debugging at all levels becomes quite difficult and clumsy. While one is working at the top level and needs to investigate a particular connection at an intermediate hierarchical… Read More
When you think of Xilinx the word FPGA is the first that comes to mind. But Xilinx has really moved beyond the sort of simple glue-logic arrays that their first success was built on. A modern array contains processors as well as programmable fabric, hence the Xilinx tag-line “all programmable”. But another area that… Read More
This week it is SEMICON Europa in Grenoble in the heart of the French Alps.
SEMICON Europa 2014 opened yesterday at ALPEXPO in Grenoble with more than 400 exhibiting companies. Learn about the latest innovative technologies, products, applications and business opportunities both within the European community and globally.… Read More
As a professional conference attendee I see a direct correlation between the number of people attending and the quality of the keynotes. Let’s face it, it’s all about the keynotes so you had better get some big names if you want more than your friends and family to show up. In this regards the upcoming CASPA event will probably be one… Read More
I’ve now been the proud owner of a Motorola Droid, HTC Incredible, iPhone 5, Samsung S4 and iPhone 6. I just can’t decide if I’m in the iPhone or Android camp!
If you don’t feel like reading the entire article, the iPhone 6 is a superior phone experience (judgement made on my 3 weeks of ownership). If you are… Read More
In fact, this is the title of a presentation given by Pete Foley during FD-SOI Forum 2014 held in Shanghai, a couple of weeks ago. What is nice with clever people like Pete Foley is that they get the point, and get it quickly. Getting the point is to insert AND in capital in the title, as using FD-SOI technology allows to benefit from low-power… Read More
Why NA is Not Relevant to Resolution in EUV Lithography