It is that time of year again, the EDPS Workshop at the Tides Hotel in Monterey. This year will start out with a keynote on IoT from Serge Leef, VP of New Ventures and GM of the System-level Engineering Division at Mentor Graphics. Serge started his career at Intel followed by Microchip and Silicon Graphics. He has been at Mentor for … Read More
Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and StartupsJay Vleeschhouwer, Managing Director of Software Research at…Read More
Security Coverage: Assuring Comprehensive Security in Hardware DesignAs hardware systems become increasingly complex and security…Read More
Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC3D IC was a very popular topic at…Read More
Analysis and Exploration of Parasitic EffectsWith advanced semiconductor processes continuing to shrink, the…Read More
Siemens Proposes Unified Static and Formal Verification with AIGiven my SpyGlass background I always keep an…Read More
Growing Security Concerns Due To Internet of Things (IoT)
It is believed that by 2020, there will be about 50 billion connected devices across the world, more than 7 times the present human population. The growth of digital devices is increasing exponentially because both users and technology are getting smarter every next day and the compatibility between the two is improving phenomenally… Read More
Improvements in SRAM Yield Variation Analysis
The design of an SRAM array requires focus on the key characteristics of readability, writeability, and read stability. As technology scaling has enabled the integration of large (cache) arrays on die, the sheer number of bitcells has necessitated a verification methodology that focuses on “statistical high-sigma” variation… Read More
Webinar: Design a LTE-based M2M Asset Tracker SoC with CEVA, using GNSS and OTDOA
If you could not attend live to the webinar from CEVA “Lear how to design a LTE-based M2M Asset Tracker SoC”, you have a second chance to access it remotely and to learn a lot. You will learn about CEVA’ Dragonfly platform 1 or 2, based on CEVA-XC8 or CEVA-XC5, and you will discover how mobile Machine 2 Machine (M2M) devices developed … Read More
TSMC and Flex Logix?
There was a lot to learn at the TSMC Technical Symposium last week, in the keynotes for sure but also in the halls and exhibits. Tom Dillinger did a nice job covering the keynotes in his posts Key Take aways from the TSMC Technology Symposium Part 1 and Part 2 but there was something interesting that many people may have missed in the exhibit… Read More
GM in the Middle of Mobility Muddle
General Motors has made a flurry of announcements around its Maven mobility brand for car sharing and its investment in Lyft. The latest news, first reported by re/code, is that Lyft and Maven will be rolling out a short-term rental program for Lyft drivers to use Chevy Equinoxes in Chicago later this month. The program is called … Read More
10nm SRAM Projections – Who will lead
At ISSCC this year Samsung published a paper entitled “A 10nm FinFET 128Mb SRAM with Assist Adjustment System for Power, Performance, and Area Optimization. In the paper Samsung disclosed a high density 6T SRAM cell size of 0.040µm[SUP]2[/SUP]. I thought it would be interesting to take a look at how this cell size stacks … Read More
Shifting Asia Electronics Production
Japan emerged as the largest supplier of consumer electronics in the 1980s. The Japan surge was driven by lower cost labor than in the U.S. and Europe as well as innovative products from companies such as Sony, Toshiba and Panasonic (formerly Matsushita). By the 1990s much consumer electronics production shifted to South Korea… Read More
What the FBI is Saying about Connected Cars
The U.S. Federal Bureau of Investigation (FBI), in cooperation with the U.S. Department of Transportation, put out a written public service announcement (PSA) last week detailing the agency’s concerns regarding automotive cybersecurity and its recommendations for the driving and vehicle owning public. The PSA followed… Read More
Webinar: A Tool for Process and Device Evaluation
Not only are foundries continuing to introduce processes at new advanced nodes, they are frequently updating or adding processes at existing nodes. There are many examples that illustrate this well. TSMC now has 16FF, 16FF+ and now 16FFC. They are also announcing 10nm and 7nm processes. In addition, they are going back to older… Read More
Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside