RVA23 Ends Speculation’s Monopoly in RISC-V CPUsRVA23 marks a turning point in how mainstream…Read More
Perforce and Siemens Collaborate on 3DIC Design at the Chiplet SummitThe recent Chiplet Summit at the Santa Clara…Read More
Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die SystemsThe first article in this series examined how…Read More
CHERI: Hardware-Enforced Capability Architecture for Systematic Memory SafetyThe rapid escalation of cyberattacks over the past…Read More
WEBINAR: Two-Part Series on RF Power Amplifier DesignAt lower frequencies with simpler modulation, RF power…Read More
Walking the exhibit floors at DAC in December I spotted the familiar face of Anupam Bakshi, Founder and CEO of Agnisys, so I stopped by the booth to get an update on his EDA company. My first question for him was about the origin of the company name, Agnisys, and I found at that Agni means Fire in Sanskrit, one of the five elements.
The … Read More
EUV lithography systems continue to be the source of much hope for continuing the pace of increasing device density on wafers per Moore’s Law. Recently, although EUV systems were originally supposed to help the industry avoid much multipatterning, it has not turned out to be the case [1,2]. The main surprise has been the
Ansys and Keysight wanted to see if they could answer the question, If we put virtual cellphones in different locations in a city, can we predict what kind of 5G signal we’re going to get in those locations? To find out, they created and tested a detailed virtual model of a city, including a variety of 5G antennae, receivers, and transmitters… Read More
IBM transferred their semiconductor manufacturing to GLOBALFOUNDRIES several years ago but still maintains a multibillion-dollar research facility at Albany Nanotech. IBM is very active at conferences such as IEDM and appears to have a good public relations department because they get a lot of press.
At the Litho Workshop … Read More
What if your smart device could empathize with you? The evolving field known as affective computing is likely to make it happen soon. Scientists and engineers are developing systems and devices that can recognize, interpret, process, and simulate human affects or emotions. It is an interdisciplinary field spanning computer… Read More
Dan is joined by Paul Wells. CEO of sureCcore. Paul describes a variety of new and innovative applications for sureCore memory products. including ultra-low power applications for consumer connected devices and new applications for quantum computing.
The views, thoughts, and opinions expressed in these podcasts… Read More
Privacy and security have always been a concern when it comes to computing. In prior decades for most people this meant protecting passwords and locking your computer. However, today more and more users are storing sensitive data in the cloud, where it needs to be protected at rest and while in motion. In a Synopsys webinar Dana Neustadter,… Read More
We have all heard of many advanced technological inventions and products from the defense sector that subsequently got commercialized. While most of the Defense Advanced Research Projects Agency (DARPA) projects are classified secrets, many military innovations have had great influence in the commercial sector in the fields… Read More
With the Omicron variant of the COVID-19 virus in the news, there have been some big corporate names withdrawing from CES ( Peleton, Super73), however the cycling innovation companies assembled once again in Las Vegas this year for CES 2022. Data from statista show the strong growth in bicycle revenues in March 2020, when the pandemic… Read More
The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances. At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More
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CEO Interview with Jerome Paye of TAU Systems