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Low Power Positioning for Logistics – Ultimate Tracking

Low Power Positioning for Logistics – Ultimate Tracking
by Bernard Murphy on 06-23-2021 at 6:00 am

logistics min

When thinking about positioning you probably first think of navigation. The device in your car that helps get from where you are to where you want to be. Or navigating while hiking in the backcountry. But those applications are not the where the big unit growth will come. The biggest demand will be in asset tracking, expected to reach… Read More


Cadence Keynotes at CadenceLIVE Americas 2021

Cadence Keynotes at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-22-2021 at 10:00 am

LipBu 030 bizcasual

Last week, Cadence hosted its annual CadenceLIVE Americas conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

This blog is about the two keynotes delivered by CEO Lip-Bu Tan and President Dr. Anirudh Devgan. The guest … Read More


Life in a Formal Verification Lane

Life in a Formal Verification Lane
by Shinavi Shah on 06-22-2021 at 6:00 am

New image for semiwiki

This summer, I got the opportunity to work as a Formal Verification Intern with Axiomise for six weeks. I’m a keen designer and love working in design and architecture. Although, I’ve not started my professional career yet, I have done most of my projects as a designer in my undergraduate and postgraduate studies.

Having said that,… Read More


EDA Design and Amazon Web Services (AWS)

EDA Design and Amazon Web Services (AWS)
by Daniel Payne on 06-21-2021 at 10:00 am

EC2 min

I first remember blogging about EDA in the cloud starting back in 2011, so what’s changed in the last 10 years you may ask? In 2011, it was basically a handful of EDA point tools running batch mode in the cloud, and you were on your own to integrate those into a coherent flow, so expect help from the CAD and IT departments for sure.… Read More


Die-to-Die Connections Crucial for SOCs built with Chiplets

Die-to-Die Connections Crucial for SOCs built with Chiplets
by Tom Simon on 06-21-2021 at 6:00 am

die to die connections

If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More


Ten Lessons Learned from Andy Grove

Ten Lessons Learned from Andy Grove
by Betsy Corcoran on 06-20-2021 at 6:00 am

Andy Grove SemiWiki

I met Andy Grove on a sunny day in New York City in 1987. He was dashing to press interviews for his just-off-the-presses management book, “One on One with Andy Grove.” I was a freshly badged member of the press working for IEEE Spectrum, a year or so out of college, still toting my college backpack. Little did I know that that would be Read More


Podcast Episode 25: Silicon IP for Early-Stage Semiconductor Companies

Podcast Episode 25: Silicon IP for Early-Stage Semiconductor Companies
by Daniel Nenni on 06-18-2021 at 10:00 am

Moderator:
Daniel Nenni, Semiwiki
Panelists:
Jothy Rosenberg, CEO Dover Microsystems
John Terry, CEO Espre Technologies
Fares Mubarak, CEO Spark Microsystems

General Theme: A discussion around the requirements and challenges of investigation and ultimate selection of IP for early-stage chip companies, discussing both… Read More


There’s No Such Thing as Ground (But Perhaps There’s a Bob) Minimze Your Ports

There’s No Such Thing as Ground (But Perhaps There’s a Bob) Minimze Your Ports
by Matt Commens on 06-18-2021 at 6:00 am

Fig. 1 Electromagnetic wave launching from a 60 GHz substrate integrated waveguide SiW array antenna animate

I would contend there is no job quite like working as a support engineer for a simulation tool like Ansys HFSS. Such a role forces an engineer to understand technology in breadth and depth like no other because HFSS is applied to such a broad range of applications and products throughout the world. My own introduction to HFSS began … Read More


Alchip is Painting a Bright Future for the ASIC Market

Alchip is Painting a Bright Future for the ASIC Market
by Mike Gianfagna on 06-17-2021 at 10:00 am

Alchip is Painting a Bright Future for the ASIC Market

I’ve spent most of my career in the ASIC business. In 2003, Gartner predicted the ASIC market would grow to $16.9B. During that time, there were a number of startups building ASICs, but the applications were a bit specialized and aimed at new markets. Consequently, there was a lot of risk to build a chip startup and many ASICs either… Read More


Ferroelectric Hafnia-based Materials for Neuromorphic ICs

Ferroelectric Hafnia-based Materials for Neuromorphic ICs
by Raisul Islam on 06-17-2021 at 6:00 am

Figure1 1

The ferroelectric effect in materials has been exploited to fabricate (fab) reliable Ferroelectric Random Access Memories (FRAM) Non-Volatile Memory (NVM) ICs for over 20 years. Recent years have seen have seen a breakthrough in discovering ferroelectric properties in Hafnium Oxide (HfO2 or “hafnia”), a fab-friendly… Read More