MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power EfficiencyMediaTek’s first chipset using 2nm technology expected in…Read More
Advancing Semiconductor Design: Intel's Foveros 2.5D Packaging TechnologyIn the rapidly evolving landscape of semiconductor manufacturing,…Read More
Synopsys Announces Expanding AI Capabilities and EDA AI LeadershipIn the fast-paced semiconductor industry Synopsys has redefined…Read More
Webinar Preview – Addressing Functional ECOs for Mixed-Signal ASICsAn engineering change order, or ECO in the…Read More
The Rise, Fall, and Rebirth of In-Circuit Emulation (Part 1 of 2)Introduction: The Historical Roots of Hardware-Assisted Verification The…Read More
A couple of weeks ago, I blogged on GlobalFoundries’ silicon technologies supporting automotive radar applications. This time it is on GlobalFoundries’ silicon photonics technology which expects to find adoption in a broad spectrum of applications. The blog is based on listening to a technology presentation made by Dr. … Read More
While systems design underpins the explosion in “smart everything”, it remains somewhat isolated from another explosion—the proliferation of tools for application lifecycle management (ALM). ALM tools are prevalent on the web, in the cloud and on our phones, to streamline product design and build, to track correspondence… Read More
In another departure from my chip design verification “beat,” I took a look at Kandou and like what I learned.
Kandou from Lausanne, Switzerland, boasts “Kandou It” as its tagline and as it should be if Kandou’s USB-C multi-protocol retimer solution with USB4 support is inside next-gen laptops, notebooks, desktops, tablets and… Read More
At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps. Previous articles have reviewed the highlights of silicon process and packaging technologies. The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More
Last week, Cadence hosted its annual CadenceLIVE Americas 2021 conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
One of the keynotes was from Partha Ranganathan, VP and Engineering Fellow from Google. His talk was titled,… Read More
The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
General
3DFabricTM
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. This article will review the highlights of the silicon process developments and future release plans.
Subsequent articles will describe the packaging offerings and delve into technology … Read More
Dan and Mike are joined by Graham Curren, founder and CEO of ASIC specialist Sondrel. Graham discusses the challenges of designing ASICs at the leading edge from a technology, design team and customer perspective. He explores where the real challenges are in building these types of chips and how Sondrel meets those challenges.… Read More
The founder of Mirabilis Design, Mr. Shankar has over two decades of experience in management and marketing of system level design tools. Prior to establishing Mirabilis Design, he held the reins as Vice President, Business Development at MemCall, a fabless semiconductor company and SpinCircuit, a joint venture of industry… Read More
We all know that artificial intelligence (AI) and machine learning (ML) are fundamentally changing the world. From the smart devices that gather data to the hyperscale data centers that analyze it, the impact of AI/ML can be felt almost everywhere. It is also well-known that hardware accelerators have opened the door to real-time… Read More
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet