David Reeder became president and CEO of Entegris in 2025, with more than 20 years of semiconductor expertise across IDMs, fabless, foundry, systems, and component companies. Most recently, Dave served as Chief Financial Officer at Chewy where he successfully oversaw all financial functions. Prior to that, Dave was Chief Financial… Read More
Synopsys Demonstrates Leadership in AI-Powered Engineering at 2026 DAC Chips to Systems ConferencePurple was in fashion at the 2026 Design…Read More
CEO Interview with Joseph Krause of Radical AIJoseph F. Krause is an American materials scientist,…Read More
DAC 2026: The Trouble with John Cooley’s Troublemaker PanelFor quite a few years, John Cooley has…Read More
The Difference Between TSMC CoWoS-S and CoWoS-RCoWoS-S and CoWoS-R are two versions of TSMC’s…Read MorePodcast EP359: The Benefits of the SiFive Smart Flow™ Technology with David Kravitz
Daniel is joined by David Kravitz, Senior Principal Engineer at SiFive, the pioneer of the RISC- V computing revolution. A veteran silicon architect with decades of experience designing high-performance processors ranging from VAX and Alpha to MIPS and ARM, David led the team behind some of the most critical breakthroughs in… Read More
Intel and TSMC Take Different Paths to High-NA EUV
Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More
Intel Foundry and the DAC2026 Ecosystem
The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.
Intel Foundry also made its presence felt, reminding everyone… Read More
New Audio SoCs Combine Bluetooth HDT with Dual-RF Technology
Ceva and Actions Technology have expanded their longstanding partnership with the introduction of the ATS296X series, a new family of Bluetooth audio chips designed to bring High Data Throughput technology into commercial wireless products. Powered by the Ceva-Waves Bluetooth HDT platform, the series is positioned as one… Read More
White Paper: The Semiconductor Foundation of Modern AI Data Centers
Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More
Mach42 Delivers a Different Take on AI in the Design Flow at DAC 2026
I believe DAC 2026 will be remembered as the turning point for AI assisted design. There has been discussion about AI infusion in EDA for a while now. Most of it was about how AI can be added to traditional tools to make existing methodologies better. This year, that changed. There were several new companies that highlighted a fundamentally… Read More
The AI Genie Is Out of the Bottle and Won’t Go Back
This week, Meta became the fourth major AI lab in two weeks to disclose that one of its own models breached another company’s systems during a security test. The company says a misconfiguration by an outside evaluator handed its Muse Spark 1.1 model internet access it wasn’t supposed to have — an accident in the test … Read More
McClean Report June 2026: Q2 Semiconductor Market Forecast Update
The semiconductor industry is entering an extraordinary growth phase, driven primarily by artificial intelligence infrastructure and the severe supply constraints surrounding advanced logic and memory devices. According to the McClean Report’s June 2026 update, the global semiconductor market is forecast to grow 98.3%… Read More
Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform
As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More



Intel and TSMC Take Different Paths to High-NA EUV