There is a rumor making the rounds that Altera will leave Intel and return to TSMC. Rumors are just rumors but this one certainly has legs and I will tell you why and what I would have done if I were Altera CEO John Daane. Altera is a great company, one that I have enjoyed working with over the years, but I really think they made a serious mistake… Read More
ESD at TSMC: IP Providers Will Need to Use Mentor to Check
I met with Tom Quan of TSMC and Michael Beuler-Garcia of Mentor last week. Weirdly, Mentor’s newish buildings are the old Avant! buildings where I worked for a few weeks after selling Compass Design Automation to them. Odd sort of déja vu. Historically, TSMC has operated with EDA companies in a fairly structured way: TSMC … Read More
TSMC Responds to Intel’s 14nm Density Claim!
TSMC responded to Intel’s 14nm density advantage claim in the most recent conference call. It is something I have been following closely and have written about extensively both publicly and privately. Please remember that the fabless semiconductor ecosystem is all about crowd sourcing and it is very hard to fool a crowd of semiconductor… Read More
Intel is NOT Transparent Again!
Recent headlines suggest that Intel was not transparent about some of the products they showed at the CES keynote. Intel confirmed on Friday that they used ARM-based chips for some of the products but would not say which ones. When your company’s tag line is “Intel Inside” and you hold up a product during your keynote wouldn’t… Read More
Intel Wafer Pricing Exposed!
One of the big questions on Intel’s foundry strategy is: Can they compete on wafer pricing? Fortunately there are now detailed reports that support what most of us fabless folks already know. The simple answer is no, Intel cannot compete with TSMC or Samsung on wafer pricing at 28nm, 20nm, and 14nm.
In fact, recent reports have shown… Read More
TSMC: 3D, 450mm, CoWoS and More
The first keynote at the Burlingame 3D conference was by Doug Yu of TSMC. Not surprisingly he was talking about 3D. In particular, TSMC has WLSI technology that they call CoWoS, which stands for chip-on-wafer-on-substrate which pretty much describes how it is built. This is the technology that Xilinx uses for its recently announced… Read More
QCOM delivers first TSMC 20nm mobile chips!
QCOM is now sampling the TSMC 20nm version of its market dominating Gobi LTE modem. The announcement also included a new turbo charged version of their 28nm Snapdragon 800 SoC with a Krait 450 quad core CPU and Adrino 420 GPU. Given the comparable benchmarks between the Intel 22nm SoC and the 28nm SoCs from Apple and QCOM, the new 20nm… Read More
Xilinx Begins Shipping TSMC 20nm FPGAs!
Xilinx just announced the shipment of the first TSMC based 20 nm FPGAs, beating Altera to the punch yet again. Xilinx was also the first to ship TSMC 28nm FPGAs and will undoubtedly beat Altera to 14nm which could be the knockout punch we have all been waiting for. The Xilinx UltraScale is a new family of FPGAs that will use 20nm and 16nm… Read More
Xilinx and TSMC: Volume Production of 3D Parts
A couple of weeks ago, Xilinx and TSMC announced the production release of the Virtex-7 HT family, the industry’s first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS)… Read More
TSMC on Semiconductor IP Quality
It is important to note that the System On Chip (SoC) revolution that is currently driving mobile electronics has one very important enabling technology and that is Semiconductor Intellectual Property. Where would we be without the commercial IP market segment? Computers and phones would still be on our desks for one thing, and… Read More