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IP

Semiconductor Intellectual Property

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Always-on and the new wearable core

Always-on and the new wearable core
by Don Dingee on 06-01-2014 at 11:00 am
Categories: Ceva, IP

Recently, I mentioned smartphone SoCs consume one, maybe two orders of magnitude too much power for broader use in wearables. However, that is only when they are “on”. To save power and stretch battery life, smartphones spend a lot of time napping – display off, sitting still with MEMS sensors powered down, waiting for an incoming… Read More

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Sidense NVM IP clears TSMC9000 at 28nm

Sidense NVM IP clears TSMC9000 at 28nm
by Don Dingee on 05-29-2014 at 7:00 pm
Categories: IP, Sidense

Maybe I’ve spent too many years whiffing solder flux fumes and absorbing doses of X-band radiation in anechoic chambers, but I’m a firm believer in the axiom: “Give me enough engineers, and I can get 10 of anything to work right, once.” We have to make this … fit into this … using only this stuff … is what legends are made of.… Read More

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Dark Silicon

Dark Silicon
by Paul McLellan on 05-26-2014 at 5:29 pm
Categories: IP, Sonics

One of the problems with chips today is that of so-called “dark silicon”. We can put massive functionality on an SoC today. A billion transistors, and that is just at 28nm. But power constraints (both leakage and dynamic power) limit how much of the chip can be powered up at any one time. In some cases this is not that big… Read More

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Panel: Strategies for Next Generation Semiconductor IP Management

Panel: Strategies for Next Generation Semiconductor IP Management
by Holly Stump on 05-16-2014 at 7:00 am
Categories: Cadence, Dassault Systemes, IP

I just returned from the “Semiconductor Executive Briefing: Strategies for Next Generation Semiconductor IP Management” panel,held at the Computer History Museum, sponsored by Dassault Systèmes.

(Left to right) Moderator: Warren Savage, President and CEO, IPextreme, with panelists John Tam, Director of Business Development,… Read More

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Selecting the Right Standard Cell & Memory for 28HPM DSP core: real case with CEVA XC4210

Selecting the Right Standard Cell & Memory for 28HPM DSP core: real case with CEVA XC4210
by Eric Esteve on 05-09-2014 at 11:14 am
Categories: Ceva, IP, Synopsys

Listening to a webinar at your desk, in front of a PC screen will never replace a live presentation, but the lesson learned to time spent ratio can be incredibly higher than when traveling to a conference to listen several presentation. If you are interested by the approach taken by a complex DSP design team to overcome the various … Read More

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I’d give my right ARM to be ambidextrous

I’d give my right ARM to be ambidextrous
by Don Dingee on 05-09-2014 at 8:00 am
Categories: Arm, IP

Baseball loves a good switch hitter – from Frisch to Mantle to Rose to Murray to Jones, they are a rare and valuable commodity. AMD is calling on ambidexterity for its processors in 2015 and beyond, this week tipping plans for 20nm “Project SkyBridge” parts in either ARM or X86 with a common footprint. What remains to be seen is where… Read More

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4G BaseBand Support with TeakLite4? Add Also CEVA-Bluetooth!

4G BaseBand Support with TeakLite4? Add Also CEVA-Bluetooth!
by Eric Esteve on 05-09-2014 at 4:46 am
Categories: Ceva, IP

The CEVA-TeakLite-4 is the DSP IP issued from the TeakLite family, started about 15 years ago with the 16-bit, single MAC TeakLite. Now the TeakLite-4 is a 32-bit, quad MAC IP core, supporting 2G/3G/4G Wireless BaseBand or PowerLine Communication. But even the latest BaseBand computational requirement doesn’t saturate this… Read More

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Wearables at Linley Mobile: Diverging views

Wearables at Linley Mobile: Diverging views
by Daniel Nenni on 05-08-2014 at 11:30 pm
Categories: Arteris, IP

The Linley Mobile Conference last week initiated a lot of discussion about emerging technologies and markets, especially wearables. Jessica Lipsky’s EE Times article captured some of the sentiments in her article, “Wearables Need Tailored SoCs.” But the conference covered a lot more ground than wearables, including mobile… Read More

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Get that Smartphone Chip out of my Wearable!

Get that Smartphone Chip out of my Wearable!
by Daniel Nenni on 05-08-2014 at 11:30 am
Categories: Imagination Technologies, IP

Last week, I had the pleasure to present at the Linley Group Mobile Conference. My presentation was part of the Wearable Device Session, which examined wearables from several different angles including software, sensor, processor, and IP.

As the smartphone market is maturing and the pace of innovation generally slowing, there… Read More

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180nm still a big deal

180nm still a big deal
by Don Dingee on 05-07-2014 at 3:00 pm
Categories: Automotive, IP, Sidense

When I was reading the recent Daniel Payne article “Designing Change Into Semiconductor Techonomics” with commentary on a recent presentation from Aart de Geus of Synopsys, one chart jumped out at me: the most popular process node for new design starts today is 180nm.

Upon mentioning that to a few of my IoT counterparts, they quickly… Read More