The move from single-chip design to system-in-package design has created many challenges. The rise of 2.5D and 3D technology has set the stage for this. Beyond the modeling requirements and the need for ecosystem collaboration to get those models, there is a significant challenge in understanding the data. The only way to truly… Read More
Best Practices are Much Better with Ansys Cloud and HFSS
Compute environments have advanced significantly over the past several years. Microprocessors have gotten faster by including more cores, available RAM has increased significantly, and the cloud has made massive distributed computing more easily and cheaply available.
HFSS has evolved to take advantage of these new capabilities,… Read More
System-level Electromagnetic Coupling Analysis is now possible, and necessary
With the increasing density of electronics in product enclosures, combined with a broad range of operating frequencies, designers must be cognizant of the issues associated with the radiation and coupling of electromagnetic energy. The interference between different elements of the design may result in coupling noise-induced… Read More
HFSS – A History of Electromagnetic Simulation Innovation
In the 155 years since James Clerk Maxwell introduced the world to Maxwell’s Equations in the “Dynamic Theory of the Electromagnetic Field” there have been some amazing breakthroughs and avenues of insight. As a young electrical engineering student, we are introduced to the set of equations describing electromagnetic waves,… Read More
HFSS Performance for “Almost Free”
Everyday, engineers are running simulations to deliver the next generation of products to make our lives better. Everyday, they wait for those simulations to finish, wishing that they could get answers instantaneously. While waiting for those simulations or checking on the status of their runs at night, they might indulge in… Read More
The History and Significance of Power Optimization, According to Jim Hogan
Power seems to be on everyone’s mind these days. Hyperscale data centers worry about operating costs unless power is optimized. The AI accelerators in the Edge can’t be effective without optimized power. Advanced 2.5 and 3D packages simply can’t remove the heat unless power is optimized. And then there’s all those gadgets we … Read More
The Gold Standard for Electromagnetic Analysis
Ansys HFSS has been the world’s trusted gold standard for electromagnetic analysis for many years. As chip designs get bigger and more complex many users report that they’re extremely happy with the gold standard accuracy of HFSS but wish it would run faster. Fortunately Ansys has introduced many capabilities to HFSS over the… Read More
Executive Interview: Vic Kulkarni of ANSYS
On the eve of the Innovative Designs Enabled by Ansys Semiconductor (IDEAS) Forum I spoke with Vic on a range of topics including his opening keynote: Accelerating Moore and Beyond Moore with Multiphysics. You can register here.
Vic Kulkarni is Vice President and Chief Strategist, Semiconductor Business Unit, Ansys, San Jose.… Read More
World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost
Innovative Designs Enabled by Ansys Semiconductor
I’m excited to announce that general registration is now open for the new Ansys IDEAS Digital Forum! IDEAS, hosted by Ansys Semiconductor, is a virtual gathering of top industry executives, thought leaders, and designers from some of the biggest IP, chip design, semiconductor… Read More
Ansys Multiphysics Platform Tackles Power Management ICs
Ansys addresses complex Multiphysics simulation and analysis tasks, from device to chip to package and system. When I was at eSilicon we did a lot of work on 2.5D packaging and I can tell you tools from Ansys were a critical enabler to get the chip, package and system to all work correctly.
Ansys recently published an Application Brief… Read More