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3d ic Redhawk SC electrothermal webinar 800x100 20210205
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Need Electromagnetic Simulations for ICs?

Need Electromagnetic Simulations for ICs?
by Daniel Nenni on 02-11-2021 at 6:00 am

RaptorH in Virtuoso

Electromagnetic (EM) simulations have been performed on die metal structures since the 1990s. Originally, the analysis was restricted to a single device (e.g., a spiral inductor). The number of on-die devices simulated simultaneously grew with the increasing capabilities of the computers performing the computations. This… Read More


Webinar: Electrothermal Signoff for 2.5D and 3D IC Systems

Webinar: Electrothermal Signoff for 2.5D and 3D IC Systems
by Mike Gianfagna on 02-08-2021 at 6:00 am

Webinar Electrothermal Signoff for 2.5D and 3D IC Systems

The move from single-chip design to system-in-package design has created many challenges. The rise of 2.5D and 3D technology has set the stage for this. Beyond the modeling requirements and the need for ecosystem collaboration to get those models, there is a significant challenge in understanding the data. The only way to truly… Read More


Best Practices are Much Better with Ansys Cloud and HFSS

Best Practices are Much Better with Ansys Cloud and HFSS
by Daniel Nenni on 02-04-2021 at 6:00 am

Ansys PAM4 PKG

Compute environments have advanced significantly over the past several years. Microprocessors have gotten faster by including more cores, available RAM has increased significantly, and the cloud has made massive distributed computing more easily and cheaply available.

HFSS has evolved to take advantage of these new capabilities,… Read More


System-level Electromagnetic Coupling Analysis is now possible, and necessary

System-level Electromagnetic Coupling Analysis is now possible, and necessary
by Tom Dillinger on 01-26-2021 at 10:00 am

FlexMesh min

With the increasing density of electronics in product enclosures, combined with a broad range of operating frequencies, designers must be cognizant of the issues associated with the radiation and coupling of electromagnetic energy.  The interference between different elements of the design may result in coupling noise-induced… Read More


HFSS – A History of Electromagnetic Simulation Innovation

HFSS – A History of Electromagnetic Simulation Innovation
by Daniel Nenni on 01-14-2021 at 10:00 am

ansys HFSS electric field distribution in coax to waveguide adapter

In the 155 years since James Clerk Maxwell introduced the world to Maxwell’s Equations in the “Dynamic Theory of the Electromagnetic Field” there have been some amazing breakthroughs and avenues of insight. As a young electrical engineering student, we are introduced to the set of equations describing electromagnetic waves,… Read More


HFSS Performance for “Almost Free”

HFSS Performance for “Almost Free”
by Jim DeLap on 12-11-2020 at 10:00 am

HFSS PCB

Everyday, engineers are running simulations to deliver the next generation of products to make our lives better. Everyday, they wait for those simulations to finish, wishing that they could get answers instantaneously. While waiting for those simulations or checking on the status of their runs at night, they might indulge in… Read More


The History and Significance of Power Optimization, According to Jim Hogan

The History and Significance of Power Optimization, According to Jim Hogan
by Mike Gianfagna on 11-13-2020 at 10:00 am

Jim Hogan

Power seems to be on everyone’s mind these days. Hyperscale data centers worry about operating costs unless power is optimized. The AI accelerators in the Edge can’t be effective without optimized power. Advanced 2.5 and 3D packages simply can’t remove the heat unless power is optimized.  And then there’s all those gadgets we … Read More


The Gold Standard for Electromagnetic Analysis

The Gold Standard for Electromagnetic Analysis
by Daniel Nenni on 11-04-2020 at 6:00 am

Example of a multi level board analyzed by HFSS

Ansys HFSS has been the world’s trusted gold standard for  electromagnetic analysis for many years. As chip designs get bigger and more complex many users report that they’re extremely happy with the gold standard accuracy of HFSS but wish it would run faster. Fortunately Ansys has introduced many capabilities to HFSS over the… Read More


Executive Interview: Vic Kulkarni of ANSYS

Executive Interview: Vic Kulkarni of ANSYS
by Daniel Nenni on 09-23-2020 at 6:00 am

Ansys Ideas 1

On the eve of the Innovative Designs Enabled by Ansys Semiconductor (IDEAS) Forum I spoke with Vic on a range of topics including his opening keynote: Accelerating Moore and Beyond Moore with Multiphysics. You can register here

Vic Kulkarni is Vice President and Chief Strategist, Semiconductor Business Unit, Ansys, San Jose.… Read More


World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost

World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost
by Daniel Nenni on 09-03-2020 at 10:00 am

ANSYS IDEAS Airplane

Innovative Designs Enabled by Ansys Semiconductor

I’m excited to announce that general registration is now open for the new Ansys IDEAS Digital Forum!  IDEAS, hosted by Ansys Semiconductor, is a virtual gathering of top industry executives, thought leaders, and designers from some of the biggest IP, chip design, semiconductor… Read More