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WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology

WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
by Daniel Nenni on 06-12-2023 at 10:00 am

Figure 1 (2)

In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.

The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More


Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


Ansys Acquires Another!

Ansys Acquires Another!
by Daniel Nenni on 05-16-2023 at 4:00 pm

Diakopto logo

The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.

Which is certainly… Read More


SEMI ESD Alliance CEO Outlook Sponsored by Keysight Promises Industry Perspectives, Insights

SEMI ESD Alliance CEO Outlook Sponsored by Keysight Promises Industry Perspectives, Insights
by Bob Smith on 05-11-2023 at 10:00 am

ESDA CEO Outlook

Spring wouldn’t be the same without an opportunity to hear from some of the most visible executives of electronic system design (ESD) market segment. The in-person CEO Outlook sponsored by Keysight and hosted by the ESD Alliance, a SEMI Technology Community, will be held Thursday, May 18, in Santa Clara, Calif.

Attendees can expect… Read More


Multiphysics Analysis from Chip to System

Multiphysics Analysis from Chip to System
by akanksha soni on 04-10-2023 at 10:00 am

Image 1 2

Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More


Checklist to Ensure Silicon Interposers Don’t Kill Your Design

Checklist to Ensure Silicon Interposers Don’t Kill Your Design
by Dr. Lang Lin on 03-20-2023 at 10:00 am

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Traditional methods of chip design and packaging are running out of steam to fulfill growing demands for lower power, faster data rates, and higher integration density. Designers across many industries – like 5G, AI/ML, autonomous vehicles, and high-performance computing – are striving to adopt 3D semiconductor… Read More


HFSS Leads the Way with Exponential Innovation

HFSS Leads the Way with Exponential Innovation
by Matt Commens on 02-28-2023 at 10:00 am

HFSS Figure1

As engineers continue to design more complex systems with increasing frequency, the need for speed and capacity to solve these structures also increases. Over the years, HFSS has come a very long way and can now solve exponentially large structures with millions of unknowns. Ansys HFSS never stopped advancing,  continuing … Read More


DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!

DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!
by Raha Vafaei on 02-28-2023 at 6:00 am

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The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions forward into leading positions. On Feb 2nd, I attended a panel by Ansys at DesignCon that brought together industry experts from Intel, GlobalFoundries,… Read More


Exponential Innovation: HFSS

Exponential Innovation: HFSS
by Matt Commens on 02-21-2023 at 10:00 am

evolution of hfss simulation capacity

The old adage: “If it ain’t broke, don’t fix it,” is as offensive to innovators as it is to grammarians. Just because something works well, doesn’t mean it cannot work better. As times change and technology advances, you either move forward or get left behind.

If you haven’t upgraded to the latest Ansys HFSS electromagnetic simulation… Read More


IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences

IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences
by Daniel Nenni on 11-29-2022 at 10:00 am

IDEAS 2022 Just Topics Icon

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics.

See the full online conference agenda and list of speakers at www.ansys.com/IDEAS. The free registration will… Read More