IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)

Physical inspection of electronics have grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications are making them increasingly vulnerable to various forms of threats and inspection. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions, training and services. The number of programs introduced by US government have increased over the years to analyze and develop relevant solutions. Although much focus is given to digital domain, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures.

PAINE conference provides a unique venue to all researchers and practitioners from academia, industry, and government to have productive dialog on such topics. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. PAINE covers the broad topic of hardware security and trust, example topics of interest include but not limited to:

Topics to be Covered: