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Pioneering Edge AI: TekStart’s Newport Processor Ushers in a New Era of Efficient Intelligence

Pioneering Edge AI: TekStart’s Newport Processor Ushers in a New Era of Efficient Intelligence
by Daniel Nenni on 10-27-2025 at 10:00 am

TekStart Newport Chip SemiWiki

One of the more in interesting companies I met at the AI Infra Summit was a company known to me for some time. The most interesting part was the chip they are in the process of taping out; It is a high-performance, ultra-low-power AI processor purpose-built for edge computing. It is claimed to deliver “the processing muscle … Read More


A Tour of Advanced Data Conversion with Alphacore

A Tour of Advanced Data Conversion with Alphacore
by Mike Gianfagna on 10-27-2025 at 6:00 am

A Tour of Advanced Data Conversion with Alphacore

There is always a lot of buzz about advanced AI workloads at trade shows. How to train them and how to run them. Advanced chip and multi-die designs are how AI is brought to life, so it was a perfect fit for discussion at a show. But there is another side of this discussion. Much of the work going on in AI workloads has to do with processing… Read More


CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program

CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program
by Daniel Nenni on 10-26-2025 at 10:00 am

CAST IP SemiWiki RISC V Summit 2025

In a move poised to accelerate the integration of open-source processor architectures into resource-constrained devices, semiconductor IP provider CAST, Inc. unveiled its Catalyst™ Program on October 22, 2025, at the RISC-V Summit in Santa Clara, California. This initiative addresses a persistent pain point for embedded… Read More


CEO Interview with Alex Demkov of La Luce Cristallina

CEO Interview with Alex Demkov of La Luce Cristallina
by Daniel Nenni on 10-26-2025 at 8:00 am

Alex and Agham 8 Inch

Alex Demkov is co-founder and CEO of La Luce Cristallina. He is a distinguished figure in the field of materials physics, serving as a Professor at the University of Texas at Austin. With a prolific career marked by notable achievements, Alex boasts an impressive portfolio of 10 U.S. patents and many patent applications, showcasing… Read More


Podcast EP313: How proteanTecs Optimizes Production Test

Podcast EP313: How proteanTecs Optimizes Production Test
by Daniel Nenni on 10-24-2025 at 10:00 am

Daniel is joined by Alex Burlak is Vice President of Test & Analytics at proteanTecs. With combined expertise in production testing and data analytics of ICs and system products, Alex joined proteanTecs in October, 2018. Before joining the company, Alex held a Senior Director of Interconnect and Silicon Photonics Product… Read More


IPLM Today and Tomorrow from Perforce

IPLM Today and Tomorrow from Perforce
by Daniel Nenni on 10-24-2025 at 6:00 am

ads mdx semiwiki future forward 400x400

Today, Perforce IPLM stands at the intersection of data management, automation, and collaboration, shaping the way companies design the next generation of chips and systems. Looking ahead, its evolution will reflect the growing convergence of hardware, software, and AI-driven engineering.

WEBINAR – Future Forward:Read More


Chiplets: Powering the Next Generation of AI Systems

Chiplets: Powering the Next Generation of AI Systems
by Kalar Rajendiran on 10-23-2025 at 10:00 am

Arm Synopsys at Chiplet Summit

AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More


Better Automatic Generation of Documentation from RTL Code

Better Automatic Generation of Documentation from RTL Code
by Tom Anderson on 10-23-2025 at 6:00 am

Specador Doc

One technical topic I always find intriguing is the availability of links between documentation and chip design. It used to be simple: there weren’t any. Architects wrote a specification (spec) in text, in Word if they had PCs, or using “troff” or a similar format if they were limited to Unix platforms. Then the hardware designers… Read More


FD-SOI: A Cyber-Resilient Substrate for Secure Automotive Electronics

FD-SOI: A Cyber-Resilient Substrate for Secure Automotive Electronics
by Daniel Nenni on 10-22-2025 at 10:00 am

Soitec white paper image

The paper highlights how Fully Depleted Silicon-On-Insulator (FD-SOI) technology provides a robust defense against Laser Fault Injection (LFI), a precise, laboratory-grade attack method that can compromise cryptographic and safety-critical hardware. As vehicles become increasingly digital and connected, with dozens… Read More


Podcast EP312: Approaches to Advance the Use of Non-Volatile Embedded Memory with Dave Eggleston

Podcast EP312: Approaches to Advance the Use of Non-Volatile Embedded Memory with Dave Eggleston
by Daniel Nenni on 10-22-2025 at 8:00 am

Daniel is joined by Dave Eggleston is senior business development manager at Microchip with a focus on licensing SST SuperFlash technology. Dave’s extensive background in Flash, MRAM, RRAM, and storage is built on 30+ years of industry experience. This includes serving as VP of Embedded Memory at GLOBALFOUNDRIES, CEO… Read More