ICSJ 2026

“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and is held annually in Kyoto every November. This conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a platform to communicate and interact with global leaders in packaging technology. Later in 2010, this conference was renamed to “ICSJ,” and ICSJ2026 is the 15th ICSJ meeting, or 24th conference since establishing VPWJ.

Challenge of Advanced Packaging for AI / Data Center and its Utilization Technology: The driving force behind semiconductor rapid growth is shifting to artificial intelligence (AI) and data centers are becoming essential for handling highly complex calculations and massive data processing. To realize AI / Data center, advanced packaging technology is essential to achieve ultra high-speed transmission, low latency, low power, high bandwidth, high power density and efficient cooling. On the other hand, AI and Deep learning (DL) can be utilized to realize rapid high-density and complex package structure design, electrical and thermal stress verification, material design, and process optimization. This cycle will further accelerate AI and packaging technology, making our lives more convenient. In 2026, our focus is on key electronics packaging technologies for AI / Data center and its utilization and emphasizes the following main topics: Photonics, Advanced Packaging & Emerging Technologies, Process & Material, Power & Automotive Electronics, Signal/Power Integrity, and Bioelectronics & Healthcare. Additional topics of primary interest to the participants are listed below.

Other topics include (but not limited to):

+ 2.xD & 3D package for chiplets and Si/Glass/Panel interposer

+ Fine pitch assembly & hybrid bonding

+ Materials & processing for interconnects and performance

+ Co-packaged Optics (CPO) & materials for optical packaging

+ Packaging for high-speed electronic interconnect

+ Packaging for neuromorphic or quantum computing

+ Packaging for sensor & MEMS devices

+ Signal integrity & power integrity

+ RF, mmWave, THz package & modules

+ Low power, low temperature & ultra-low noise system packaging

+ Machine learning, deep learning, modeling, AI-based multiphysics simulation

This conference will be a perfect opportunity to communicate, interact, exchange technical ideas, and discuss your latest novel research findings in packaging technologies with experts from industry and academia. In addition to the regular sessions, there is an “Early Career Researchers’ (ECR)” session for young researchers with less than two years’ experience in their professions and all students including Ph.D. to hold fruitful discussions with the experts. The ECR sessions will be held as a poster session. Authors are invited to submit an abstract through our website https://www.ieee-csj.org. The abstract deadline is extended to June 12, 2026. Notification of acceptance will be sent by July 3, 2026, and the successful authors would then be requested to submit a 4-page manuscript by September 4, 2026, for the Technical Digest, which will be available via IEEE Xplore Digital Library, while the authors for the ECR session are required to submit a 2-page manuscript.

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