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TSMC SemiWiki Banner
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TSMC OIP Ecosystem Forum 2017 Preview!

TSMC OIP Ecosystem Forum 2017 Preview!
by Daniel Nenni on 08-23-2017 at 12:00 pm

The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth the trip, absolutely! And remember, it is September 13th at the very convenient Santa Clara Convention Center.


REGSTRATION

You can see the presentations with abstracts HERE. There are some interesting customer related presentations from HiSilicon (Huawei), MicroSemi, Spreadtrum, Qualcomm, MediaTek, Xilinx, and last but not least Oracle. This may be your last chance to see the Oracle chip people as I heard they will all be out looking for jobs shortly. Yes, rumor has it Oracle is getting out of the chip business. The SPARC has finally been extinguished!

I will be mingling and signing books in the Solido booth again this year during the breaks. It would be a pleasure to meet you!

Here is theAgenda:

08:00 – 9:05 BREAKFAST!
09:05 – 09:15 Welcome Remarks
09:15 – 09:45 TSMC and its Ecosystem for Innovation
09:45 – 9:55 Partner Feature Talk – Synopsys
09:55 – 10:05 Partner Feature Talk – Cadence
10:05 – 10:15 Partner Feature Talk – Mentor Graphics
10:15 – 10:35 CAFFINE!
10:35 – 12:05 Ecosystem Presentations
12:05 – 13:00 Ecosystem Presentations
10:35 – 12:05 LUNCH!
13:00 – 15:00 Ecosystem Presentations
15:00 – 15:30 Coffee Break & Ecosystem Pavilion
15:30 – 17:30 Ecosystem Presentations
17:30 – 18:30 DRINKS!

Here is the official TSMC Overview:

The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem companies and our customers to share practical, tested solutions to today’s design challenges. Success stories that illustrate TSMC’s design ecosystem best practices highlight the event.

More than 90% of last year’s attendees said that, “the forum helped me better understand TSMC’s Open Innovation Platform” and that “I found it effective to hear directly from TSMC OIP member companies.”

This year’s event will prove equally valuable as you hear directly from TSMC OIP companies about how to apply their technologies to address your design challenges!

This year, the forum is a day-long conference kicking-off with trend-setting keynotes and announcements from TSMC and leading IC design company executives.

The technical sessions are dedicated to 33 selected technical papers from TSMC’s EDA, IP, Design Center Alliance and Value Chain Aggregator member companies. And theEcosystem Pavilion feature up to 60 member companiesshowcasing their products and services.

Learn About

Attendees will discover:

  • Emerging advanced node design challenges including 7nm, 10nm, 12FFC, 16FFC, 16nm FinFET+, 22ULP, 28nm, and ultra-low power process technologies.
  • Updated design enablement platforms and solutions supporting Mobile, High-Performance Computing, Automotive, and Internet-of-Thing (IoT) applications
  • Successful, real-life applications of design technologies and IP from ecosystem members and TSMC customers
  • Ecosystem-specific TSMC reference flow implementations
  • New innovations for next generation product designs

Hear directly from ecosystem companies about their TSMC-specific design solutions

Network with your peers and more than 1,000 industry experts and end users.

The TSMC Open Innovation Platform Ecosystem Forum is an “invitation-only” event. Please register to attend. We look forward to seeing you at the event.

The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem companies and our customers to share practical, tested solutions to today’s design challenges. Success stories that illustrate TSMC’s design ecosystem best practices highlight the event.

More than 90% of last year’s attendees said that, “the forum helped me better understand TSMC’s Open Innovation Platform” and that “I found it effective to hear directly from TSMC OIP member companies.”

This year’s event will prove equally valuable as you hear directly from TSMC OIP companies about how to apply their technologies to address your design challenges!

This year, the forum is a day-long conference kicking-off with trend-setting keynotes and announcements from TSMC and leading IC design company executives.

The technical sessions are dedicated to 33 selected technical papers from TSMC’s EDA, IP, Design Center Alliance and Value Chain Aggregator member companies. And the Ecosystem Pavilion feature up to 60 member companies showcasing their products and services.

About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry segment’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s owned capacity in 2017 is expected to reach above 11 million (12-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB® facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China. TSMC is the first foundry to provide both 20nm and 16nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.


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