Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs

Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs
by Johannes Stahl on 07-28-2021 at 10:00 am

ZeBu Empower diagram

In every chip, power is a progressive problem to be solved. Designers have long had to rely on a combination of experience and knowledge to tackle this dilemma, typically having to wait until after silicon availability to perform power analysis with realistic software workloads. However, this is too late in the game, as it becomes… Read More


Driving PPA Optimization Across the Cubic Space of 3D IC Silicon Stacks

Driving PPA Optimization Across the Cubic Space of 3D IC Silicon Stacks
by Tom Simon on 07-06-2021 at 9:00 am

Improved PPA Using 3D IC

The move to true 3D IC, monolithic 3D SOC and 3D heterogeneous integration may require one of the most major design tool architecture overhauls since IC design tools were first developed. While we have been taking steps toward 3DIC with 2.5D designs with interposers, HBM, etc., the fundamental tools and flows remain intact in many… Read More


Safety + Security for Automotive SoCs with ASIL B Compliant tRoot HSMs

Safety + Security for Automotive SoCs with ASIL B Compliant tRoot HSMs
by Kalar Rajendiran on 06-30-2021 at 10:00 am

New Architectures Reshaping Auto SoCs

Automotive segment is a market that has historically been supported by a few select suppliers within the semiconductor ecosystem. Over the last decade, this market has transitioned from just being about reliability, performance, fuel efficiency, etc., to placing equal importance to user experience. This user experience … Read More


Die-to-Die Connections Crucial for SOCs built with Chiplets

Die-to-Die Connections Crucial for SOCs built with Chiplets
by Tom Simon on 06-21-2021 at 6:00 am

die to die connections

If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More


Upping the Safety Game Plan for Automotive SoCs

Upping the Safety Game Plan for Automotive SoCs
by Rich Collins on 05-20-2021 at 10:00 am

Upping the Safety Game Plan for Automotive SoCs

Thanks to advanced hardware and software, smart vehicles are improving with every generation. Capabilities that once seemed far-off and futuristic—from automatic braking to self-driving at the very pinnacle—are now either standard or within reach. However, considering how vehicle architectures have continued to evolve,… Read More


Mars Perseverance Rover Features First Zoom Lens in Deep Space

Mars Perseverance Rover Features First Zoom Lens in Deep Space
by Synopsys Editorial on 05-09-2021 at 10:00 am

Mars Perseverance Rover Features First Zoom Lens in Deep Space

On July 30, 2020, NASA launched the Mars 2020 Perseverance rover, which is scheduled to land today. Perseverance has been deployed to Mars with a new mission: to search for evidence of past life and collect samples that will eventually be brought back to Earth by future missions.

Mars 2020 Perseverance rendering courtesy of NASA/JPL-Caltech
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Synopsys Debuts Major New Analog Simulation Capabilities

Synopsys Debuts Major New Analog Simulation Capabilities
by Tom Simon on 05-03-2021 at 10:00 am

Synopsys analog simulation

Just prior to this year’s Synopsys User Group (SNUG) meeting, I had a call with Hany Elhak, Group Director of Product Management and Marketing at Synopsys, to talk about their latest announcements for analog simulation. Synopsys usually has big things to talk about each year around this time – this year is no exception. Hany… Read More


PCIe 6.0 Doubles Speed with New Modulation Technique

PCIe 6.0 Doubles Speed with New Modulation Technique
by Tom Simon on 04-26-2021 at 6:00 am

PCIe 6.0 Eye

PCI-SIG has held to doubling PCIe’s data rate with each revision of the specification. The consortium of 800 companies, with its board consisting of Agilent, AMD, Dell, HP, Intel, Synopsys, NVIDIA, and Qualcomm, is continuing this trend with the PCIe 6.0 specification which calls for a transfer rate of 64 GT/s. PCI-SIG released… Read More


Global Variation and Its Impact on Time-to-Market for Designs

Global Variation and Its Impact on Time-to-Market for Designs
by umangdoshi on 04-14-2021 at 2:00 pm

Impact of Global Variation on Delay

We have come a long way from the days of limited and manageable characterization databases with fewer views and smaller library sizes. The technologies we are headed towards pushing characterization to its limits with special modeling for variation, aging and reliability all on a single process, voltage and temperature (PVT).… Read More


Certitude: Tool that can help to catch DV Environment Gaps

Certitude: Tool that can help to catch DV Environment Gaps
by eInfochips on 04-13-2021 at 2:00 pm

Certitude 9

Design verification (DV) is still one of the biggest challenges in the ASIC based product world. In last two decades, we have seen many changes in terms of HVLs and methodologies used for design verification. System Verilog is the most popular HVL these days and UVM is the most popular verification methodology.

Even after such an… Read More