Why Secure Ethernet Connections?

Why Secure Ethernet Connections?
by Daniel Payne on 05-29-2023 at 6:00 am

Ethernet Security min

While web browsing I constantly glance for the padlock symbol to indicate that the site is encrypting any of my form data by using the https prefix, which means that an SSL (Secure Sockets Layer) certificate is being used by the web hosting company. I have peace of mind knowing that my credit card information cannot be easily stolen… Read More


Chiplet Interconnect Challenges and Standards

Chiplet Interconnect Challenges and Standards
by Daniel Payne on 05-25-2023 at 10:00 am

Multi die IP min

For decades now I’ve watched the incredible growth of SoCs in terms of die size, transistor count, frequency and complexity. Instead of placing all of the system complexity into a single, monolithic chip, there are now compelling reasons to use a multi-chip approach, like when the maximum die size limit is reached, or it’s… Read More


Webinar: Accelerate Software Innovation Through Target-Optimized Code Generation and Virtual Prototypes

Webinar: Accelerate Software Innovation Through Target-Optimized Code Generation and Virtual Prototypes
by Admin on 05-23-2023 at 2:24 pm

Increasingly complex automotive systems are driving the need for new and powerful E/E architectures, and new technology is emerging that offers a significant computational increase compared to previous generation SoCs. To deliver next-generation, differentiated software solutions, model-based design (MBD) workflows… Read More


Driving the Future of HPC Through 224G Ethernet IP

Driving the Future of HPC Through 224G Ethernet IP
by Kalar Rajendiran on 05-23-2023 at 10:00 am

Advanced DSP Implementations

The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More


Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


Webinar: Don’t Take the Risk, Formally Verify Your RISC-V Cores

Webinar: Don’t Take the Risk, Formally Verify Your RISC-V Cores
by Admin on 05-16-2023 at 1:56 pm

Synopsys Webinar | Thursday, May 25, 2023 | 9:00 a.m. PT

According to a recent Semico Research report, the RISC-V Core IP market is expected to grow at a 34.9% CAGR through year 2027. With increasing popularity, it is of utmost importance that the RISC-V Core IPs are secure and bug free. ​

In this joint Synopsys webinar with SyoSil,

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Webinar: Requirements for Multi-Die System Success

Webinar: Requirements for Multi-Die System Success
by Admin on 05-12-2023 at 7:06 pm

The industry is moving to multi-die systems to benefit from the greater compute performance, increased functionality, and new levels of flexibility. Challenges for multi-die systems are exacerbated and require greater focus on a number of requirements such as early partitioning and thermal planning, die/package co-design,… Read More


Curvilinear Mask Patterning for Maximizing Lithography Capability

Curvilinear Mask Patterning for Maximizing Lithography Capability
by Fred Chen on 05-09-2023 at 10:00 am

Curvilinear 1

Masks have always been an essential part of the lithography process in the semiconductor industry. With the smallest printed features already being subwavelength for both DUV and EUV cases at the bleeding edge, mask patterns play a more crucial role than ever. Moreover, in the case of EUV lithography, throughput is a concern, … Read More


Chiplet Q&A with Henry Sheng of Synopsys

Chiplet Q&A with Henry Sheng of Synopsys
by Daniel Nenni on 05-05-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.

Are we
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