How to Cut Costs of Conversational AI by up to 90%

How to Cut Costs of Conversational AI by up to 90%
by Dave Bursky on 06-20-2022 at 10:00 am

20 Tbps 2D NoC

The burgeoning use of conversational artificial intelligence (CAI) in consumer and business applications places a heavy computational burden on both front-end and back-end systems that provide the natural language processing (NLP). NLP systems rely on deep learning (a subset of machine learning) to automate speech recognition,… Read More


Intel vs AMD vs Google vs Amazon vs NUVIA

Intel vs AMD vs Google vs Amazon vs NUVIA
by Daniel Nenni on 11-29-2019 at 6:00 am

Arguably the cloud was the quickest road to riches for chip designers large and small. As an emerging company, if you wanted to raise money just put “Datacenter” in your pitch deck and you were assured millions. You would be competing with semiconductor’s version of David and Goliath (AMD and Intel) but that was a good thing, right?… Read More


Oracle is out of the Chip Business!

Oracle is out of the Chip Business!
by Daniel Nenni on 08-26-2017 at 7:00 am

This is a story I have been tracking for some time now. Oracle is one of the companies I was enamored with early in my career, Sun microsystems as well. They are both legacies here in Silicon Valley, absolutely. I can now confirm that Oracle is getting out of the chip business. Oracle got into the chip business with the $7.4B acquisition… Read More


TSMC OIP Ecosystem Forum 2017 Preview!

TSMC OIP Ecosystem Forum 2017 Preview!
by Daniel Nenni on 08-23-2017 at 12:00 pm

The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More


DAC 2017: How Oracle does Reliability Simulation when designing SPARC

DAC 2017: How Oracle does Reliability Simulation when designing SPARC
by Daniel Payne on 06-27-2017 at 12:00 pm

Last week at #54DAC there was a talk by Michael Yu from the CAD group of Oracle who discussed how they designed their latest generation of SPARC chips, with an emphasis on the reliability simulations. The three features of the latest SPARC family of chips are:

  • Security in silicon
  • SQL in silicon
  • World’s fastest microprocessor
Read More

Circuit Simulation Panel Discussion at #53DAC

Circuit Simulation Panel Discussion at #53DAC
by Daniel Payne on 06-29-2016 at 12:00 pm

Four panelists from big-name semiconductor design companies spoke about their circuit simulation experiences at #53DAC in Austin this year, so I attended to learn more about SPICE and Fast SPICE circuit simulation. I heard from the following four companies:… Read More


Coventor Panel at IEDM Digs into Variation Issues

Coventor Panel at IEDM Digs into Variation Issues
by Tom Simon on 01-05-2015 at 7:00 pm

Recently I attended a panel discussion on variability in semiconductor fabrication hosted by Coventor in conjunction with the IEEE IEDM conference in San Francisco. The IEEE bills the conference as “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device… Read More


Variation: How Can We Survive?

Variation: How Can We Survive?
by Paul McLellan on 12-24-2014 at 12:57 pm

At IEDM last week Coventor hosted a panel session as they do each year. The theme this year was surviving variation. The panel was hosted by someone whose name is familiar round here, Dan Nenni. The panel that Coventor had put together had people from all sorts of different slots in the design/supply chain for semiconductor. Unfortunately… Read More


The SUN will NOT set on Oracle!

The SUN will NOT set on Oracle!
by Daniel Nenni on 09-19-2014 at 7:00 am

Larry Ellison resigning as CEO of Oracle caught me by surprise. I definitely did not see that one coming. Talk about the end of an era, as a 30+ year Silicon Valley veteran there have been quite a few industry icons that stand out amongst the others: Dave Packard, Bill Hewlett, Gordon Moore, Andy Grove, Bill Gates, Steve Jobs, and Larry… Read More


TSMC OIP 2013 Trip Report!

TSMC OIP 2013 Trip Report!
by Daniel Nenni on 10-04-2013 at 4:00 pm

The 5[SUP]th[/SUP] annual TSMC OIP Forum was last week and thankfully there were no surprises with the exception of how many people asked me who I think will be the next TSMC CEO. Certainly I have no idea but I would be happy to use my incredible powers of deductive reasoning to determine who it will be.

The TSMC Open Innovation Platform®Read More