The media is trying to disparage the semiconductor industry again. It’s hard to not take this type of desperate journalism personal. Semiconductor people are the smartest and hardest working people in the world and we deserve better, absolutely.
TSMC founder sees trade dispute as ‘reality show with no script’… Read More
In the normal evolution of specialized hardware IP functions, initial implementations start in academic research or R&D in big semiconductor companies, motivating new ventures specializing in functions of that type, who then either build critical mass to make it as a chip or IP supplier (such as Mobileye – intially)… Read More
There is a report in the Seoul Economic Daily that Samsung has completed development of their 7nm process using EUV and that production will begin in June. What is claimed in the report is:
- The process is installed in the Hwaseong S3 Fab
- Samsung has more than 10 EUV systems installed
- Production starts in June with Qualcomm, Xilinx,
… Read More
The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More
Since a few years China has been very aggressive in acquiring semiconductor companies around the world. Last year, Chinese government along with PE (Private Equity) and other investors in China announced an ambitious plan under which more than $150 billion were to be invested over next 5 to 10 years in developing semiconductor… Read More
In a balancing global economy, it’s a common phenomenon that at certain times a few sectors or segments within the sectors grow much faster compared to others. And a few companies within the growing sectors lead those sectors. Both the growing sectors and the leading companies in those sectors become the centers of attraction. … Read More
At TSMC’s OIP Symposium last month, Zhe (Jared) Lui of HiSilicon presented their experiences with Synopsys’ ICC2 physical design suite.
Jared started by giving an overview of Huawei and HiSilicon. HiSilicon is the semiconductor arm of Huawei. I assume everyone knows who Huawei is. To a first approximation they … Read More
To describe the latest methodology for the addition of Design for Manufacturability fill shapes to design layout data, it’s appropriate to borrow a song title from Bob Dylan – The Times They Are A Changin’. The new technical requirements are best summarized as: “The goal is now to add as much fill as possible, which (ideally) looks… Read More
Right on cue, TSMC announces 16nm FinFET production silicon. I believe this is the original version of FinFET versus 16FF+ which is due out in 1H 2015. I will confirm this next week at the TSMC OIP event in San Jose, absolutely. Either way this is excellent news for the fabless semiconductor ecosystem and I look forward to the first … Read More
As smartphone and tablet makers desperately search for points of differentiation they will try to push the limits of performance on several fronts to extremes. The password pill and the display-cover display are two of the stranger extreme features on the way.
Extreme inter-connectivity is one of the more useful features that… Read More