Time for Chip Diplomacy

Time for Chip Diplomacy
by Terry Daly on 05-29-2020 at 10:00 am

image 4

An industry caught in the crosshairs of geopolitics needs global emeritus leadership

The semiconductor industry is at the epicenter of great power politics. An ascendant China is on a quest for a unified global system with China as the leading power. The United States seeks to maintain its position as leader of the liberal democratic… Read More


China’s Position in the Global Semiconductor Value Chain

China’s Position in the Global Semiconductor Value Chain
by Bart van Hezewijk on 05-25-2020 at 6:00 am

China Semiconductor SemiWiki

In this third article about China’s role in the global semiconductor industry I analyse the current state of affairs of the Chinese semiconductor industry in different segments. In the previous articles, I looked at the possible effects of a US-China decoupling in the semiconductor industry and the impact of the Big Read More


TSMC, Huawei, the US Government, and China

TSMC, Huawei, the US Government, and China
by Daniel Nenni on 12-30-2019 at 6:00 am

Morris Chang TSMC

The media is trying to disparage the semiconductor industry again. It’s hard to not take this type of desperate journalism personal. Semiconductor people are the smartest and hardest working people in the world and we deserve better, absolutely.

TSMC founder sees trade dispute as ‘reality show with no script’Read More


Disturbances in the AI Force

Disturbances in the AI Force
by Bernard Murphy on 01-03-2019 at 7:00 am

In the normal evolution of specialized hardware IP functions, initial implementations start in academic research or R&D in big semiconductor companies, motivating new ventures specializing in functions of that type, who then either build critical mass to make it as a chip or IP supplier (such as Mobileye – intially)… Read More


Samsung is Starting 7nm Production with EUV in June

Samsung is Starting 7nm Production with EUV in June
by Scotten Jones on 04-16-2018 at 12:00 pm

There is a report in the Seoul Economic Daily that Samsung has completed development of their 7nm process using EUV and that production will begin in June. What is claimed in the report is:

  • The process is installed in the Hwaseong S3 Fab
  • Samsung has more than 10 EUV systems installed
  • Production starts in June with Qualcomm, Xilinx,
Read More

TSMC OIP Ecosystem Forum 2017 Preview!

TSMC OIP Ecosystem Forum 2017 Preview!
by Daniel Nenni on 08-23-2017 at 12:00 pm

The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More


How China can Lead in the Semiconductor Industry

How China can Lead in the Semiconductor Industry
by Pawan Fangaria on 03-06-2016 at 8:00 pm

Since a few years China has been very aggressive in acquiring semiconductor companies around the world. Last year, Chinese government along with PE (Private Equity) and other investors in China announced an ambitious plan under which more than $150 billion were to be invested over next 5 to 10 years in developing semiconductor… Read More


IDMs are Much Ahead of Fabless Semicon Companies

IDMs are Much Ahead of Fabless Semicon Companies
by Pawan Fangaria on 12-06-2015 at 7:00 am

In a balancing global economy, it’s a common phenomenon that at certain times a few sectors or segments within the sectors grow much faster compared to others. And a few companies within the growing sectors lead those sectors. Both the growing sectors and the leading companies in those sectors become the centers of attraction. … Read More


HiSilicon’s Experience with Synopsys ICC2

HiSilicon’s Experience with Synopsys ICC2
by Daniel Nenni on 11-11-2015 at 4:00 pm

At TSMC’s OIP Symposium last month, Zhe (Jared) Lui of HiSilicon presented their experiences with Synopsys’ ICC2 physical design suite.

Jared started by giving an overview of Huawei and HiSilicon. HiSilicon is the semiconductor arm of Huawei. I assume everyone knows who Huawei is. To a first approximation they … Read More


Meeting DFM Challenges with Hierarchical Fill Data Insertion

Meeting DFM Challenges with Hierarchical Fill Data Insertion
by Tom Dillinger on 10-11-2015 at 12:00 pm

To describe the latest methodology for the addition of Design for Manufacturability fill shapes to design layout data, it’s appropriate to borrow a song title from Bob Dylan – The Times They Are A Changin’. The new technical requirements are best summarized as: “The goal is now to add as much fill as possible, which (ideally) looksRead More