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It is quite amazing that silicon-based devices have been the foundation of our industry for over 60 years, as it was clear that the initial germanium-based devices would be difficult to integrate at a larger scale. (GaAs devices have also developed a unique microelectronics market segment.) More recently, it is also rather … Read More
SemiAnalysis and SkyJuice have teamed up in order to analyze the A14 die shot from ICmasters. Our previous analysis of the A14, delved into why Apple and TSMC have deviated from previous generations when comparing theoretical logic transistor density to a real world utilized transistor density.
The vast majority of the attention given to the introduction of each new advanced process node focuses on lithographic updates. The common metrics quoted are the transistors per mm**2 or the (high-density) SRAM bit cell area. Alternatively, detailed decomposition analysis may be applied using transmission electron microscopy… Read More
The introduction of heterogeneous 3DIC packaging technology offers the opportunity for significant increases in circuit density and performance, with corresponding reductions in package footprint. Yet, the implementation of a complex 3DIC product requires a considerable investment in methodology development for all… Read More
What is the “right track” for US-China trade relations?
The semiconductor industry has been squarely in the crosshairs of US-China trade tensions for four years. As the US faces a presidential leadership transition, will a Biden administration change the dynamic? The chip industry is counting on it, and China hopes so too.
Our friends over at ICmasters have delved into the package of the Apple A14 Bionic. The die size has been unmasked, and it stands in at 88mm2. Despite cramming in 11.8 billion transistors, the die size is incredibly small thanks to utilization of TSMC’s 5nm process node.
The march of progress is not all rosy. Apple’s chips have historically… Read More
As I have discussed before, I believe that IEDM is the premier technical conference for understanding leading edge process technologies. Beginning this coming weekend, this year’s edition of IEDM will be held virtually, and I highly recommend attending.
The conference held a press briefing last Monday. The tutorial and short… Read More