TSMC Israel Technology Workshop

TSMC Israel Technology Workshop
by Admin on 03-15-2023 at 11:29 am

Get the latest on:

  • TSMC’s smartphone, HPC, IoT, and automotive platform solutions
  • TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond
  • TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
  • TSMC 3DFabric® advanced packaging
Read More

TSMC 2023 Europe Technology Symposium

TSMC 2023 Europe Technology Symposium
by Admin on 03-15-2023 at 11:27 am

Get the latest on:

  • TSMC’s smartphone, HPC, IoT, and automotive platform solutions
  • TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond
  • TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
  • TSMC 3DFabric® advanced packaging
Read More

Resolution vs. Die Size Tradeoff Due to EUV Pupil Rotation

Resolution vs. Die Size Tradeoff Due to EUV Pupil Rotation
by Fred Chen on 03-02-2023 at 10:00 am

Resolution vs. Die Size Tradeoff Due to EUV Pupil Rotation

The many idiosyncrasies of EUV lithography affect the resolution that can actually be realized. One which still does not get as much attention as it should is the cross-slit pupil rotation [1-3]. This is a fundamental consequence of using rotational symmetry in ring-field optical systems to control aberrations in reflective… Read More


IEDM 2023 – 2D Materials – Intel and TSMC

IEDM 2023 – 2D Materials – Intel and TSMC
by Scotten Jones on 02-20-2023 at 6:00 am

Slide1

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More