An earlier blog started with the topic of delivering 3D IC innovations faster. The blog covered the following foundational enablers for successful heterogeneous 3D IC implementation.
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
The last year has seen a ton written about the semiconductor industry: chip shortages, the CHIPS Act, our dependence on Taiwan and TSMC, China, etc.
But despite all this talk about chips and semiconductors, few understand how the industry is structured. I’ve found the best way to understand something complicated is to diagram… Read More
A decade ago, many of us heard commentaries on how entrepreneurs were turned down by venture capitalists for not including a cloud strategy in their business plan, no matter what the core business was. Humorous punchlines such as, “It’s cloudy without any clouds” and “Add some cloud to your strategy and your future will be bright… Read More
Silicon photonics is getting a lot of interest because it can be used in many applications to improve bandwidth, reduce power and provide novel new functionality. It is especially interesting because it offers an ability to combine electronics and optical elements into the same die. Though it is fabricated with familiar silicon… Read More
UPF was created to go beyond what HDL can do for managing on-chip power. HDLs are agnostic when it comes to dealing with supply & ground connections, power domains, level shifters, retention and other power management related elements of SoCs. UPF fills the breach allowing designers to specify in detail what parts of the design… Read More
All semiconductor design work today rests on the three-legged stool of Foundries, EDA Tools and Designers. Close collaboration between the three make possible the successful completion of ever more complex designs, especially those at advanced nodes. Perhaps one of the most critical intersections of all three is during physical… Read More
PCI Express (PCIe) has become an important communication element in a wide range of systems. It is used to connect networking, storage, FPGA and GPGPU boards to servers and desktop systems. It has progressed a long way from its initial parallel bus format. Its evolution to a serial point to point configuration has been accompanied… Read More
The most vexing problem for physical implementation engineers is debugging errors due to power-ground “shorts”, as reported by the layout-versus-schematic (LVS) physical verification flow. The number of polygons associated with each individual grid is large – an erroneous connection between grids results in a huge number… Read More
Design for test (DFT) requires a lot of up-front planning that can be difficult to alter if testing needs or performance differ from initial expectations. Hierarchical methodologies help in many ways including making it easier to reduce on chip resources such as the number of test signals. Also, hierarchical test allows for speed-ups… Read More
