Mentor @ the TSMC Open Innovation Platform Forum

Mentor @ the TSMC Open Innovation Platform Forum
by glforte on 01-16-2013 at 6:16 pm

At TSMC’s Open Innovation Platform (OIP) Ecosystem Forum, Mentor made technical presentations on four different topics, two of them co-presented with TSMC and LSI Corporation. Those presentations are described below with links to downloadable pdf presentation files.

Finding and Fixing Double Patterning Errors in
Read More


Winner, Winner, Chicken Dinner!

Winner, Winner, Chicken Dinner!
by SStalnaker on 12-21-2012 at 8:00 pm

I have no idea if chicken was actually on the menu, but on December 12, Calibre RealTime picked up its thirdindustry award, this time the 2012 Elektra Award for Design Tools and Development Software from the European Electronics Industry. Calibre RealTime came out on top in a group full of prestigious finalists, including ByteSnap,Read More


IP Scoring Using TSMC DFM Kits

IP Scoring Using TSMC DFM Kits
by Daniel Payne on 12-20-2012 at 11:00 am

Design For Manufacturing (DFM) is the art and science of making an IC design yield better in order to receive a higher ROI. Ian Smith, an AE from Mentor in the Calibre group presented a pertinent webinar, IP Scoring Using TSMC DFM Kits. I’ll provide an overview of what I learned at this webinar.… Read More


Double Patterning Tutorial

Double Patterning Tutorial
by Paul McLellan on 12-17-2012 at 4:07 am

Double patterning at 20nm is one of those big unavoidable changes that it is almost impossible to know too much about. Mentor’s David Abercrombie, DFM Program Manager for Calibre, has written a series of articles detailing the multifaceted impacts of double patterning on advanced node design and verification. There is… Read More


Yield Analysis and Diagnosis Webinar

Yield Analysis and Diagnosis Webinar
by Beth Martin on 12-06-2012 at 10:02 pm

Sign up for a free webinar on December 11 on Accelerating Yield and Failure Analysis with Diagnosis.

The one hour presentation will be delivered via webcast by Geir Eide, Mentor’s foremost expert in yield learning. He will cover scan diagnosis, a software-based technique, that effectively identifies defects in digital logic… Read More


Test and Diagnosis at ISTFA

Test and Diagnosis at ISTFA
by Beth Martin on 11-15-2012 at 7:10 pm

Finding and debugging failures on integrated circuits has become increasingly difficult. Two sessions at ISTFA (International Symposium for Testing and Failure Analysis) on Thursday address the current best practices and research directions of diagnosis.

The first was a tutorial this morning by Mentor Graphics luminary… Read More


Creating Plug-and-Play IP Networks in Large SoCs with IEEE P1687 (IJTAG)

Creating Plug-and-Play IP Networks in Large SoCs with IEEE P1687 (IJTAG)
by glforte on 11-14-2012 at 2:15 pm

Until now, the integration and testing of IP blocks used in large SOCs has been a manual, time consuming design effort. A new standard called IEEE P1687 (or “IJTAG”) for IP plug-and-play integration is emerging to simplify these tasks. EDA tools are also emerging to support the new standard. Last week mentor announcedTessent IJTAG,… Read More


IJTAG, Testing Large SoCs

IJTAG, Testing Large SoCs
by Paul McLellan on 11-08-2012 at 5:57 pm

Test is the Rodney Dangerfield of EDA, it doesn’t get any respect. All designs need to be tested but somehow synthesis, routing, analog layout and the rest are the sexy areas. In my spoof all purpose EDA keynote address I even dissed it:You are short on time so slip in a quick mention of manufacturing test. Who knows anything … Read More


A Most Significant Man

A Most Significant Man
by Beth Martin on 11-06-2012 at 8:10 pm

Most of us live perfectly good lives without distinction, fame, or note. Others rack up the honors, filling their walls and resumes with recognition of their brilliance. Like Dr. Janusz Rajski.

Rajski is the director of engineering for the test products at Mentor Graphics, an IEEE Fellow, and the inventor of embedded deterministic… Read More


Chip On Wafer On Substrate (CoWoS)

Chip On Wafer On Substrate (CoWoS)
by Daniel Payne on 11-03-2012 at 5:19 pm

tsmc cowos test vehicle1

Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More