First thing at DACtoday I met with Greg Lebsack of Tanner EDA to ask about what’s new in the past year for his EDA company. Here are my meeting notes, so there’s not much prose for my DAC blogs this year.
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Why Advanced Chip Packaging Is Becoming a Design Problem Addressing Inter-Die Complexity for…Read More
Managing Power, Performance and Reliability in the Chiplet EraNext-gen AI accelerators, high-performance processors, and complex computing…Read More
Siemens and TSMC push AI deeper into chip designSiemens and TSMC are expanding their collaboration on…Read More
Agentic AI Can Reach GDS. What Must It Prove Before Engineers Trust It for Tapeout?Agentic AI is beginning to move semiconductor engineering…Read More
TSMC OIP Ecosystem Forum 2026: Opening RemarksThe 2026 TSMC Open Innovation Platform (OIP) Ecosystem…Read MoreGetting the best from a Radio Spectrum: MIMO
Exchanging data through wireless network is that we are doing every day, every hour if not every minute. Not only we use our smartphone to discuss or exchange Emails, but also to download, or upload, massive amounts of data. Thus, the radio spectrum has become to be busy, and is an expansive piece for carriers. Optimizing this radio… Read More
Advice for Out-of-towners
You are visiting San Francisco and you have dutifully read your guide book. Let me give you some contrarian advice.
See the Golden Gate Bridge. The best way is not to drive there or get a taxi, but to rent a bicycle (lots of places on that side of the city, try Googling “blazing saddles”) and cycle across the bridge. You can then go down … Read More
Gary Smith at DAC
Gary Smith once again wore his signature white coat and extolled the virtues of system level design and automation. The room at the Intercontinental was packed, and the folks in the hallway outside were noisy as usual, eager for the party to start after Gary finished.… Read More
Everything You Wanted to Know About the Internet But Were Afraid to Ask
Every year, Mary Meeker produces a huge presentation (140 slides) on important trends in the internet. This year’s came out at the end of last week. It is well worth the time it takes to go through it. Here is the first slide, effectively the table of contents:
- Key Internet Trends
- Status Update: Tech Stocks / Education / Healthcare
Apple is Roaring Back!
Mind you, this post is being written by the same guy who wrote8 Reasons Why I Hate My iPhone 5. I’ve been living with the Samsung S4 for about a year, and am ready to return to the Apple fold. It’s partially that too many, or perhaps the wrong apps running on my phone cause big problems. This manifests itself anywhere from … Read More
Always-on and the new wearable core
Recently, I mentioned smartphone SoCs consume one, maybe two orders of magnitude too much power for broader use in wearables. However, that is only when they are “on”. To save power and stretch battery life, smartphones spend a lot of time napping – display off, sitting still with MEMS sensors powered down, waiting for an incoming… Read More
Fabless Book Giveaway at #51DAC Reception!
eSilicon will be providing books for the first 300 people to attend the Tuesday night networking reception sponsored by SemiWiki. To avoid confusion they will be giving out BOOK COUPONS when you arrive to be redeemed when the event starts so grab a coupon, enjoy the food and drinks! I can assure you this will be the ultimate networking… Read More
We Need One MILLION Design Starts!
Design starts are the lifeblood of the semiconductor industry. It’s not just the design start itself, it’s the innovation that goes with it. As the semiconductor industry consolidates and the cost of modern semiconductor design increases you have to ask yourself: Where are the next generation of design starts going to come from?… Read More
Active Power Management in UPF Using SPICE, VHDL-AMS or Verilog-AMS
My former co-worker, Kenneth Bakalar at Mentor Graphics is an expert in AMS modeling languages and UPFmethodology, so he recently teamed up with Eric Jeandeau to author an interesting white paper: Interpreting UPF for a Mixed-Signal Design Under Test. This white paper is based on a presentation made at DVCon earlier this year.… Read More


The Invisible Bottleneck Is Costing You Time You Can’t Get Back