When Software Outruns Silicon: Hardware-Assisted Test Generation to the RescueFor the past decade, the semiconductor industry has…Read More
From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AIBased on Dylan Patel’s SEMI Industry Strategy Symposium…Read More
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WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA WorkloadsIn this webinar, Google Cloud and NetApp explore…Read More
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Dan is joined by Jennifer Ard, Intel Capital Managing Director and Head of Investment Operations. In her role, Jen is responsible for managing Intel Capital’s investment-related operations. Additionally, she is primarily focused on investing in silicon-related companies and has been involved in multiple deals including… Read More
Pim Donkers is the co-founder and Chief Executive Officer of Switzerland-based ARMA Instruments, a technology company which produces ultra-secure communication devices.
Pim is a technology serial entrepreneur operating internationally with several successful companies in his portfolio such as his recent IT outsourcing… Read More
The integration of artificial intelligence (AI) into Electronic Design Automation (EDA) is revolutionizing chip design, addressing the critical shortage of skilled engineers and accelerating the development process. As Jeff Dyck, Senior Director of Engineering at Siemens EDA, explains in a recent DACtv presentation, … Read More
In a DACtv session on July 22, 2024, Rich Goldman from Ansys discussed the partnership with NVIDIA, focusing on accelerating engineering simulations and visualizing 3D IC designs in Omniverse. The collaboration, outlined in six pillars defined by NVIDIA CEO Jensen Huang, leverages NVIDIA’s GPUs and Grace CPUs to enhance… Read More
At the 62nd Design Automation Conference (DAC) on July 22, 2024, Philip Bena from Codasip delivered a compelling session on processor customization, emphasizing a responsible approach that prioritizes verification. Codasip, a European company with a global presence, offers a unique combination of RISC-V processor IP and… Read More
I first visited Easy-Logic at DAC in 2023, so it was time to meet them again at #61DAC in San Francisco to find out what’s new this year. Steven Chen, VP Sales for North America and Asia met with me in their booth for an update briefing. Steven has been with Easy-Logic for six years now and earned an MBA from Baruch College in New York. This… Read More
At #61DAC it was quite clear that semiconductors have “grown up”. The technology has taken its place in the world as a mission-critical enabler for a growing list of industries and applications. Reliability and stability become very important as this change progresses. An error of failure is somewhere between inconvenient… Read More
The U.S. CHIPS and Science Act provides incentives for semiconductor manufacturing in the United States. As of July 30, 2024, The CHIPS Program Office has announced over $30 billion in grants and over $25 billion in loans, according to the Semiconductor Industry Association (SIA). The awards have been given to fourteen companies;… Read More
At #61DAC I stopped by the Defacto Technologies exhibit and talked with Chouki Aktouf, President and CEO, to find out what’s new in 2024. ARM and Defacto have a joint SoC design flow by using the Arm IP Explorer tool along with Defacto’s SoC compiler, which helps to quickly create your top-level RTL, IP-XACT and UPF files. This tool… Read More
An explosion in multiplier types/combinations lacking well-established C reference models for equivalence checking is prompting a closer look at theorem proving methods for verification. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco… Read More
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Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031