IC and System Design for Mobile and Wearable Devices!

The Linley Mobile and Wearable Conference is coming up so let’s take a look at what is in store for us. Bernard Murphy, Tom Simon, and I will be covering the event live for SemiWiki and we will also be doing a book giveaway/signing for our new “Prototypical” book (compliments of S2C Inc.) during the networking event on Tuesday evening. If you are not able to attend you can get a free PDF version of the book HERE.

In case you have not attended a Linley event you should. It is FREE to qualified attendees, there is FREE food and drinks throughout the event, and you will meet a very HIGH caliber of semiconductor professionals (me for example).

The event starts out with a keynote from Linley Gwennap himself followed by:

• Peter Carson, Senior Director, Marketing, Qualcomm
• Emmanuel Gresset, Director of Business Development, CEVA
• Ali Khayrallah, Engineering Director, Ericsson
• Barry Seidner, VP Americas, INSIDE Secure
• Asaf Ashkenazi, Cryptography Research, Rambus
• Ron Lowman, Strategic Marketing Manager Synopsys
• Fawad Khan, Senior Manager, MediaTek

Day two starts with a keynote from Jim Morrison, VP Competitive Technical Intelligence, Chipworks, TechInsights followed by:

• David Heine, Senior Design Engineering Architect, Cadence
• Joe Rowlands, Chief Architect, NetSpeed Systems
• JP Loison, Corporate Application Engineer, Arteris
• Pankaj Kedia, Sr. Director, Qualcomm
• Cliff Lin, Senior Director, MediaTek
• Scott Runner, VP, IoT & Automotive, Aricent
• Hezi Saar, Staff Product Marketing Manager, Synopsys
• Peter Hartwell, Senior Director of Advanced Technology, InvenSense

You can see the full Linley agenda HERE.Stop on by and get a book.It would be a pleasure to meet you.

Innovation in mobile chip and system design is accelerating. Heterogeneous processors and advances in LTE are driving changes in smartphone design. Wearable devices create new, even smaller form factors and add new functions for communications, entertainment, fitness, and health. To deliver these new capabilities, mobile processors must integrate a plethora of IP cores, including big and little CPUs, DSPs, GPUs, video, security, and NoCs to connect them all. Mobile systems also require complex RF design, advanced power management, and a plethora of sensors.

The Linley Mobile & Wearables Conference will be held on July 26 – 27, 2016 at theHyatt Regency Hotel, Santa Clara, CA.This two-day, single-track conference features technical presentations addressing design issues for smartphones, tablets, smartwatches and other wearable devices. The Linley Group will also present an overview of the market, technologies, equipment-design, and silicon trends for designers of mobile devices.

This event is the only one of its kind focused on next-generation mobile platform design.
This conference is intended for *designers of mobile chips, mobile devices, and mobile software as well as service providers, press, and the financial community. Attendance is free to qualified registrants.

The conference includes:
– Sponsor exhibits and demos
– Evening networking reception on the first day
– Raffles by The Linley Group
– Hosted speaker tables at lunch (meet the presenters)
– Free parking
– Continental breakfasts and gourmet lunches
– Free Wi-Fi
To keep informed about this and other upcoming events, subscribe toLinley on Mobile, our free newsletter.

Location: Hyatt Regency Hotel, Santa Clara, CA
Main Meeting Room:Santa Clara Ballroom, 2nd level
Lunch:Lafayette & San Tomas, 2nd level
Reception:Lafayetter & San Tomas, 2nd Level, July 26 only

Registration for *qualified attendees is FREE if on-line registration forms are received by 5 PM PT on July 21, 2016. Registration for non-qualified attendees is $795 if received by 5 PM PT on July 21, 2016.

On-site registration opens at 8 AM, July 26 & 27.
The cost for *qualified attendees is $195 and $995 for non-qualified qualified.