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32Mb Embedded STT-MRAM in ULL 22nm CMOS Achieves 10ns Read Speed, 1M Cycle Write Endurance, 10 Years Retention at 150C and High Immunity to Magnetic Field Interference presented at ISSCC2020
1. Motivation for STT-MRAM in Ultra-Low-Leakage 22nm Process
TSMC’s embedded Spin-Torque Transfer Magnetic Random Access Memory (STT-MRAM)… Read More
Technological leadership has long been key to TSMC’s success and they are following up their leadership development of 5nm with the world’s smallest SRAM cell at 0.021um 2 with circuit design details of their write assist techniques necessary to achieve the full potential of this revolutionary technology. In addition to their… Read More
Back in April, 2019, TSMC announced that they were introducing their 5 nm technology in risk production and now at IEDM 2019 they brought forth a detailed description of the process which has passed 1000 hour HTOL and will be in high volume production in 1H 2020. This 5nm technology is a full node scaling from 7nm using smart scaling… Read More
After returning from a week in Southern China I found the TSMC Q4 2019 conference call even more interesting. In China they are preparing for the New Year’s Celebration so everything is very festive but what struck me hardest was the massive investment in infrastructure and security. Semiconductors are of course a big part… Read More
Happy New Year to everyone.. lets hope 2020 is a great year.. The indicators are all pointing in the right direction but it will not take much to derail it if external factors change. Here is my weekly summary of all the important news from the semiconductor industry around the world.
2020 is starting very differently from 2019 with… Read More
Semiconductors continue to surge and lead technology sectors all over the world. TSMC has always been my economic bellwether and 2019 was another great year as the TSM share price almost doubled. But it looks like the best is yet to come with TSMC significantly increasing CAPEX to cover 7nm and 5nm demand.
TSMC CEO C.C. Wei increased… Read More
Advanced IC technologies, 5nm and 7nm FinFET design and stacked packaging, are enabling massive levels of integration of super-fast circuits. These in turn enable much of the exciting new technology we hear so much about: mobile gaming and ultra-high definition mobile video through enhanced mobile broadband in 5G, which requires… Read More
The media is trying to disparage the semiconductor industry again. It’s hard to not take this type of desperate journalism personal. Semiconductor people are the smartest and hardest working people in the world and we deserve better, absolutely.
TSMC founder sees trade dispute as ‘reality show with no script’… Read More
IEDM is in my opinion the premiere conference for information on state-of-the-art semiconductor processes. In “My Top Three Reasons to Attend IEDM 2019” article I singled out the TSMC 5nm paper as a key reason to attend.
IEDM is one of the best organized conferences I attend and as soon as you pick up your badge you are handed a memory… Read More
Bob Swan is really starting to grow on me. Admittedly, I am generally not a fan of CFOs taking CEO roles at semiconductor companies but thus far Bob is doing a great job. This comes from my outside-looking-in observations and from the people I know inside Intel, absolutely.
Bob did a fireside chat with Credit Suisse at their 23rd annual… Read More
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