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A three-dimensional integrated circuit (3D IC ) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms, as a result the full definition is still somewhat… Read More
The 48[SUP]th[/SUP] Design Automation Conference (DAC) is now upon us. DAC is billed as “the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions” for which I would have to agree with 100%.
The first DAC I attended was in 1984, Albuquerque New Mexico, which was one of the first to allow … Read More
Not only do I enjoy San Francisco, I really enjoy the International Solid-State Conference that was held in San Francisco again last week. This was ISSCC #57 I believe. ISSCC attracts a different crowd than other semiconductor conferences, probably because there are no exhibits and no sales and marketing nonsense, just serious… Read More
Process Design Kit (PDK) development is one of the most entertaining things to watch in the semiconductor design world. It is kind of like the Golden Snitch in the game of Quidditch. No matter how rough EDA vendors play the game, no matter what the score is, it’s the vendor that “gets” the Golden PDK Snitch that wins the semiconductor… Read More
The 2010 ISSCC theme was all about “Sensing the Future” and was one of the most inspiring semiconductor conferences I have experienced. The halls were filled with the top names in semiconductor design and manufacture from around the world. The sessions highlighted not only technology breakthroughs (first 4G silicon), but new… Read More
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Application-Specific Lithography: Sense Amplifier and Sub-Wordline Driver Metal Patterning in DRAM