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At DesignCon 2020, ANSYS sponsored a series of very high-quality presentations. Some focused on advanced methods and new technology exploration and some provided head-on, practical and actionable capabilities to improve advanced designs. The presentation I will discuss here falls into the latter category. The topic was… Read More
This article will describe the motivations for pursuing a new flow in the SoC design methodology. This flow involves the extraction, evaluation, and analysis of a full electromagnetic coupling model for a complex SoC and its package environment. The results of this analysis highlight the impact of electromagnetic coupling… Read More
Advanced IC technologies, 5nm and 7nm FinFET design and stacked packaging, are enabling massive levels of integration of super-fast circuits. These in turn enable much of the exciting new technology we hear so much about: mobile gaming and ultra-high definition mobile video through enhanced mobile broadband in 5G, which requires… Read More
Advanced packaging technology is enabling “More Than Moore” scaling of heterogeneous technology die. At the recent EDPS Symposium in Milpitas, Craig Hillman, Director of Product Development, DfR Solutions, at ANSYS gave a compelling presentation, “Reliability Challenges in Advanced Packaging”. The key takeaway messages… Read More
The introduction of 5G communications support offers tremendous potential across a broad spectrum of applications (no pun intended). 5G is indeed quite encompassing, across a wide range of frequencies – the figure below illustrates the common terminology used, from low-band, mid-band (“sub 6G”), and high-band (“mmWave”)… Read More
I’m a fan of getting customer reality checks on advanced design technologies. This is not so much because vendors put the best possible spin on their product capabilities; of course they do (within reason), as does every other company aiming to stay in business. But application by customers on real designs often shows lower performance,… Read More
At the risk of highlighting my abundant lack of expertise in the domain, I had always viewed EMC (electromagnetic compatibility) compliance and testing as one of those back-end exercises that can only be done on the real device and depends on a combination of expertise and brute-force in chip/package/module/system design (decaps,… Read More
Designing with advanced-nodes FinFETs such as 7nm node involves a more complex process than prior nodes. As secondary physical effects are no longer negligible, the traditional margin-based approach applied at various design abstraction levels is considered ineffective. Coupled with the increase of device counts, failing… Read More
EDA is big on growth through acquisition, being acquired many times throughout my career I know this by experience. In fact, we have a wiki that tracks EDA Mergers and Acquisitions and it is the most viewed wiki on SemiWiki.com with 101,918 views thus far.
In March of 2017 ANSYS acquired CLK Design Automation which did timing variation… Read More
In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More
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