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The History and Significance of Power Optimization, According to Jim Hogan

The History and Significance of Power Optimization, According to Jim Hogan
by Mike Gianfagna on 11-13-2020 at 10:00 am

Jim Hogan

Power seems to be on everyone’s mind these days. Hyperscale data centers worry about operating costs unless power is optimized. The AI accelerators in the Edge can’t be effective without optimized power. Advanced 2.5 and 3D packages simply can’t remove the heat unless power is optimized.  And then there’s all those gadgets we … Read More


The Gold Standard for Electromagnetic Analysis

The Gold Standard for Electromagnetic Analysis
by Daniel Nenni on 11-04-2020 at 6:00 am

Example of a multi level board analyzed by HFSS

Ansys HFSS has been the world’s trusted gold standard for  electromagnetic analysis for many years. As chip designs get bigger and more complex many users report that they’re extremely happy with the gold standard accuracy of HFSS but wish it would run faster. Fortunately Ansys has introduced many capabilities to HFSS over the… Read More


Executive Interview: Vic Kulkarni of ANSYS

Executive Interview: Vic Kulkarni of ANSYS
by Daniel Nenni on 09-23-2020 at 6:00 am

Ansys Ideas 1

On the eve of the Innovative Designs Enabled by Ansys Semiconductor (IDEAS) Forum I spoke with Vic on a range of topics including his opening keynote: Accelerating Moore and Beyond Moore with Multiphysics. You can register here

Vic Kulkarni is Vice President and Chief Strategist, Semiconductor Business Unit, Ansys, San Jose.… Read More


World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost

World’s Leading Chip Designers at IDEAS Digital Forum Show How to Streamline Design Flows and Reduce Design Cost
by Daniel Nenni on 09-03-2020 at 10:00 am

ANSYS IDEAS Airplane

Innovative Designs Enabled by Ansys Semiconductor

I’m excited to announce that general registration is now open for the new Ansys IDEAS Digital Forum!  IDEAS, hosted by Ansys Semiconductor, is a virtual gathering of top industry executives, thought leaders, and designers from some of the biggest IP, chip design, semiconductor… Read More


Ansys Multiphysics Platform Tackles Power Management ICs

Ansys Multiphysics Platform Tackles Power Management ICs
by Mike Gianfagna on 07-14-2020 at 10:00 am

Screen Shot 2020 07 08 at 7.14.17 PM

Ansys addresses complex Multiphysics simulation and analysis tasks, from device to chip to package and system. When I was at eSilicon we did a lot of work on 2.5D packaging and I can tell you tools from Ansys were a critical enabler to get the chip, package and system to all work correctly.

Ansys recently published an Application Brief… Read More


Qualcomm on Power Estimation, Optimizing for Gaming on Mobile GPUs

Qualcomm on Power Estimation, Optimizing for Gaming on Mobile GPUs
by Bernard Murphy on 06-30-2020 at 6:00 am

Phone game

I don’t look at the RTL power estimation topic too often these days, so I was interested to see that ANSYS still has a very strong position in this area. Qualcomm is using PowerArtist on one of the most demanding modern applications – mobile GPU power gaming. Mobile gaming heavily loads the GPU, so any optimization in that area will … Read More


The Largest Engineering Simulation Virtual Event in the World!

The Largest Engineering Simulation Virtual Event in the World!
by Daniel Nenni on 05-22-2020 at 10:00 am

ANSYS Simulation World

ANSYS is the world leader in engineering simulation across multiple markets. One of those markets just happens to be semiconductor which is why ANSYS is on SemiWiki.com. Due to the pandemic ANSYS has transformed their popular live regional events to one broad virtual event “Simulation World”.

“Simulation World is world’s largestRead More


Prevent and Eliminate IR Drop and Power Integrity Issues Using RedHawk Analysis Fusion

Prevent and Eliminate IR Drop and Power Integrity Issues Using RedHawk Analysis Fusion
by Mike Gianfagna on 03-24-2020 at 10:00 am

Screen Shot 2020 03 14 at 5.36.37 PM

I had the opportunity to preview an upcoming SemiWiki webinar on IR drop and power integrity. These topics, all by themselves, have real stopping power. Almost everyone I speak with has a story to tell about these issues in a recent chip design project. When you combine hot topics like this with a presentation that details the collaboration… Read More


Reliability Challenges in Advanced Packages and Boards

Reliability Challenges in Advanced Packages and Boards
by Herb Reiter on 03-02-2020 at 10:00 am

CTE Stress ANSYS SemiWiki

Today’s Market Requirements
Complex electronic devices and (sub)systems work for us in important applications, such as aircrafts, trains, trucks, passenger vehicles as well as building infrastructure, manufacturing equipment, medical systems and more. Very high reliability (the ability of a product to meet all requirements… Read More


Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect

Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect
by Mike Gianfagna on 02-26-2020 at 10:00 am

2D vs. 3D heat maps

At DesignCon 2020, ANSYS held a series of sponsored presentations. I was able to attend a couple of them.  These were excellent events with the material delivered by talented and high-energy speakers. The DesignCon technical program has many dimensions beyond the conference tracks. One of the presentations dealt with 3D ICs.… Read More