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Synopsys Accelerates Innovation on TSMC Advanced Processes

Synopsys Accelerates Innovation on TSMC Advanced Processes
by Mike Gianfagna on 05-15-2024 at 10:00 am

Synopsys Accelerates Innovation on TSMC Advanced Processes

We all know that making advanced semiconductors is a team sport. TSMC can innovate the best processes, but without the right design flows, communication schemes and verified IP it becomes difficult to access those processes. Synopsys recently announced some details on this topic. It covers a lot of ground. The graphic at the top… Read More


Podcast EP223: The Impact Advanced Packaging Will Have on the Worldwide Semiconductor Industry with Bob Patti

Podcast EP223: The Impact Advanced Packaging Will Have on the Worldwide Semiconductor Industry with Bob Patti
by Daniel Nenni on 05-15-2024 at 8:00 am

Dan is joined by Bob Patti, the owner and President of NHanced Semiconductors. Previously, Bob founded ASIC Designs Inc., an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs he participated in more than 100 tapeouts. Tezzaron Semiconductor grew from that company, with… Read More


Tools for Chips and Dips an Overview of the Semiconductor Tools Market

Tools for Chips and Dips an Overview of the Semiconductor Tools Market
by Claus Aasholm on 05-15-2024 at 7:00 am

Chips and Dips 2024

From humble beginnings in military applications, the semiconductor industry has been fundamental to all societal growth, and everything that grows exponentially depends on semiconductors.

It is not a gentle industry. Products over two years old are unsellable, and there is either too much supply or none. Semiconductor scarcity… Read More


How Samtec Helps Achieve 224G PAM4 in the Real World

How Samtec Helps Achieve 224G PAM4 in the Real World
by Mike Gianfagna on 05-15-2024 at 6:00 am

How Samtec Helps Achieve 224G PAM4 in the Real World

224 Gbps PAM4 gets attention for applications such as data center, AI/ML, accelerated computing, instrumentation and test and measurement. The question is how real is it and what are the challenges that need to be overcome to implement reliable channels at that data rate? If you wonder about these kinds of topics for your next design,… Read More


SoC Power Islands Verification with Hardware-assisted Verification

SoC Power Islands Verification with Hardware-assisted Verification
by Lauro Rizzatti on 05-14-2024 at 10:00 am

SoC Power Islands Figure 1

The ever-growing demand for longer battery life in mobile devices and energy savings in general have pushed power optimization to the top of designers’ concerns. While various techniques like multi-VT transistors and clock gating offer power savings at gate-level design, the real impact occurs at system level, where hardware… Read More


Anirudh Fireside Chats with Jensen and Cristiano

Anirudh Fireside Chats with Jensen and Cristiano
by Bernard Murphy on 05-14-2024 at 6:00 am

Fireside chat min

At CadenceLIVE 2024 Anirudh Devgan (President and CEO of Cadence) hosted two fireside chats, one with Jensen Huang (President and CEO of NVIDIA) and one with Cristiano Amon (President and CEO of Qualcomm). As you would expect both discussions were engaging and enlightening. What follows are my takeaways from those chats.

Anirudh

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ARC-V portfolio plus mature software IP targets three tiers

ARC-V portfolio plus mature software IP targets three tiers
by Don Dingee on 05-13-2024 at 10:00 am

ARC-V portfolio from Synopsys

Synopsys is bridging its long-running ARC® processor IP strategy into a RISC-V architecture – Bernard Murphy introduced the news here on SemiWiki last November. We’re getting new insight from Synopsys on its ARC-V portfolio and how they see RISC-V IP plus their mature software development toolchain IP fitting customer needs… Read More


Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification
by Mike Gianfagna on 05-13-2024 at 6:00 am

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification

2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More


Podcast EP222: The Importance of Managing and Preserving Ultrapure Water in Semiconductor Fabs with Jim Cannon

Podcast EP222: The Importance of Managing and Preserving Ultrapure Water in Semiconductor Fabs with Jim Cannon
by Daniel Nenni on 05-10-2024 at 10:00 am

Dan is joined by Jim Cannon, Head of OEM and Markets at Mettler-Toledo Thornton. Jim has over 35 years of experience managing, designing, and developing ultrapure water treatment and technology. Jim is currently involved in the standards and regulatory organizations including the Facilities and Liquid Chemicals Committee,… Read More


Webinar: Fine-grained Memory Protection to Prevent RISC-V Cyber Attacks

Webinar: Fine-grained Memory Protection to Prevent RISC-V Cyber Attacks
by Daniel Nenni on 05-10-2024 at 8:00 am

EW Award 24 Logo winner safety Security coloured RGB 300dpi 960x117

Most organizations are aware of cybercrime attempts such as phishing, installing malware from dodgy websites or ransomware attacks and undertake countermeasures. However, relatively little attention has been given to memory safety vulnerabilities such as buffer overflows or over-reads. For decades, the industry has created… Read More