Today’s Program is Brought To You by the Letter A

Today’s Program is Brought To You by the Letter A
by Paul McLellan on 06-28-2013 at 9:09 pm

What do nVidia, Freescale and GlobalFoundries have in common? They are semiconductor companies? They are ARM licensees? They are doing 28nm chips? They all have the letter ‘a’ in their names?

All true, but that’s not what I was thinking of. But the letter ‘a’ is a clue since Apache (and Ansys) begin with ‘a’. All three companies have… Read More


Derivative Designs Need Tools Too

Derivative Designs Need Tools Too
by Paul McLellan on 06-18-2013 at 11:58 am

Increasingly, SoC designs consist of assembling blocks of pre-designed IP. One special case is the derivative design where not just the IP blocks get re-used but a lot of the assembly itself. For example, in the design below some blocks are added, some blocks are updated, some hierarchy is changed. But the bulk of the design remains… Read More


Enabling 14nm FinFET Design

Enabling 14nm FinFET Design
by Daniel Payne on 05-28-2013 at 12:54 pm

There’s never a dull moment in the foundry race to offer FinFET processes that enable leading-edge SoC design. Today I attended a webinar hosted by Samsung and Synopsys on how to enable 14nm FinFET design. The two speakers were Dr. Kuang-Kuo Lin from Samsung and Dr. Henry Sheng from Synopsys.


Dr. Kuang-Kuo Lin, Samsung


Dr.Read More


Do You Need to Worry About Soft Errors?

Do You Need to Worry About Soft Errors?
by Paul McLellan on 05-22-2013 at 6:51 pm

As we get down to smaller and smaller process nodes, the problem of soft errors becomes increasingly important. These soft errors are caused by neutrons from cosmic rays, alpha particles from materials used in manufacture and other sources. For chips that go into systems with high reliability this is not something that can be ignored.… Read More


How To Design a TSMC 20nm Chip with Cadence Tools

How To Design a TSMC 20nm Chip with Cadence Tools
by Paul McLellan on 05-07-2013 at 8:10 pm

Every process node these days has a new “gotcha” that designers need to be aware of. In some ways this has always been the case but the changes used to be gradual. But now each process node has something discontinuously different. At 20nm the big change is double patterning. At 14/16nm it is FinFET.

Rahul Deokar and John… Read More


Clock Gating: Sequential Is Better

Clock Gating: Sequential Is Better
by Paul McLellan on 04-01-2013 at 3:46 pm

Sequential clock gating offers more power savings that can be obtained just with combinational clock gating. However, sequential clock gating is very complex as it involves temporal analysis over multiple clock cycles and examination of the stability, propagation, and observability of signal values.

Trying to do sequential… Read More


Unlocking the Full Potential of Soft IP

Unlocking the Full Potential of Soft IP
by Daniel Payne on 03-22-2013 at 11:32 am

EDA vendors, IP suppliers and Foundries provide an eco-system for SoC designers to use in getting their new electronic products to market quicker and at a lower cost. An example of this eco-system are three companies (TSMC, Atrenta, Sonics) that teamed up to produce a webinar earlier in March called: Unlocking the Full PotentialRead More


IP Scoring Using TSMC DFM Kits

IP Scoring Using TSMC DFM Kits
by Daniel Payne on 12-20-2012 at 11:00 am

Design For Manufacturing (DFM) is the art and science of making an IC design yield better in order to receive a higher ROI. Ian Smith, an AE from Mentor in the Calibre group presented a pertinent webinar, IP Scoring Using TSMC DFM Kits. I’ll provide an overview of what I learned at this webinar.… Read More


FinFET Modeling and Extraction at 16-nm

FinFET Modeling and Extraction at 16-nm
by Daniel Payne on 12-18-2012 at 12:05 pm

In 2012 FinFET is one of the most talked about MOS technologies of the year because traditional planar CMOS has slowed down on scaling below the 28nm node. To learn more about FinFET process modeling I attended a Synopsys webinar where Bari Biswas presented for about 42 minutes include a Q&A portion at the end.


Bari Biswas, SynopsysRead More


Learning about MEMS in Israel from: EDA companies, Foundry, University, Users

Learning about MEMS in Israel from: EDA companies, Foundry, University, Users
by Daniel Payne on 10-23-2012 at 12:24 pm

In April I attended and blogged about a webinar on MEMS and IC co-design hosted by two EDA companies: SoftMEMS and Tanner EDA. On October 30th you can attend a full-day event in Israel that is more comprehensive than the webinar that I attended.… Read More