New, Powerful Ansys Electromagnetic Capabilities for EMI/EMC Simulations

New, Powerful Ansys Electromagnetic Capabilities for EMI/EMC Simulations
by Admin on 10-26-2020 at 12:00 am

October 26, 2020

2:00 PM (GMT) / 3:00 PM (CET)

Venue:
Online

Does EMI keep you awake at night?  Leading companies are reducing EMI/EMC test cycles by leveraging simulation technologies.  This webinar will show how a slew of new Ansys Electromagnetic capabilities can be leveraged to remove your fear of EMI testing and replace it

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Photonic Integrated Circuits for Next-Generation Connectivity and Sensing

Photonic Integrated Circuits for Next-Generation Connectivity and Sensing
by Admin on 10-16-2020 at 12:00 am

October 16, 2020

3 PM IST

Venue:
Online

Miniaturisation and system scaling is pushing the conventional electronic system toward energy efficiency. While system scaling is bringing enriched functionality, there are fundamental limitations to an electronic system. Heterogeneous integrating electronic and photonic designs

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Introduction to Ansys Minerva, Powered by Aras

Introduction to Ansys Minerva, Powered by Aras
by Admin on 10-15-2020 at 12:00 am

October 15, 2020

11 AM EDT / 4 PM BST / 8:30 PM IST

Venue:
Online

Increased simulation usage presents unique challenges. The wide variety of tools leveraged coupled with the considerable volume of data being distributed introduces process challenges such as collaboration, visibility and traceability. Additionally, it creates

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[Live Webinar] Security Solutions for an Evolving Data Center

[Live Webinar] Security Solutions for an Evolving Data Center
by Admin on 10-15-2020 at 12:00 am

Event Details

  • Date:  – 

Data Centers are rapidly evolving in response to significant tidal forces: the exponential growth in data traffic, the rise of new workloads with AI/ML being one of the foremost, and the distribution of computing to the edge of the network for low latency, real-time applications.… Read More


Predicting Laminar-Turbulent Transition with Low-Cost Methods

Predicting Laminar-Turbulent Transition with Low-Cost Methods
by Admin on 10-14-2020 at 12:00 am

October 14, 2020

11:00 AM (EDT)

Venue:

Online

The reliable prediction of laminar-turbulent transition is one of the key physics challenges in the simulation and design of aeronautical components and systems. Transition can have a substantial effect on overall performance and safety margins of airplanes. Historically, transition

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Debugging in Conformal Low Power: GUI and Non-GUI Approach

Debugging in Conformal Low Power: GUI and Non-GUI Approach
by Admin on 10-14-2020 at 12:00 am

Overview

Static low-power verification enables engineers to verify and debug multimillion-gate designs optimized for low power, without complex and time-consuming simulations. However, understanding these IEEE 1801 violations and diagnosing the root cause can become challenging without a user-friendly debug infrastructure.

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2020 Wilson Research Group Verification Survey Results

2020 Wilson Research Group Verification Survey Results
by Admin on 10-13-2020 at 8:00 am

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Register For This Web Seminar

Online – Oct 13, 2020
8:00 AM – 9:00 AM US/Pacific

Overview

The 2019 global semiconductor market was valued at $385.4 billion after experiencing a 15% decline due to a 32% drop in the memory IC market, which is expected to recover in 2021. The IC/ASIC portion of the semiconductor

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Optimizing Spray Dryer Performance Using Simulations

Optimizing Spray Dryer Performance Using Simulations
by Admin on 10-13-2020 at 12:00 am

October 13, 2020

11:00 AM (EDT)

Venue:
Online

Spray drying is used in many industries as the preferred method to produce dry free-flowing powders from liquid mixtures/slurries. In the pharmaceutical and biotech industries, several solid dosage forms are based on microparticles. Dry powders are inhaled as aerosols into the

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Reduce Design Time with PCB Productivity Toolbox

Reduce Design Time with PCB Productivity Toolbox
by Admin on 10-13-2020 at 12:00 am

Overview 

Biggest loss in designer productivity occurs in the editing and tweaking of designs leading to lowest performance gain per unit of time. Under a very tight schedule, it comes down to zero. It can be significantly improved with Cadence’s Allegro PCB Productivity Toolbox.

Cadence’s Allegro PCB Productivity Toolbox

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Ansys Mechanical 2020: A faster, easier solution for more advanced structural and thermal FEA simulation applications

Ansys Mechanical 2020: A faster, easier solution for more advanced structural and thermal FEA simulation applications
by Admin on 10-09-2020 at 12:00 am

October 9, 2020

11.00 am (BST)

Venue:
Online

Ansys Mechanical is our flagship product for advanced structural and thermal FE simulation. Trusted by thousands of engineers around the world, it delivers functionality to move companies beyond CAD-embedded FE solutions through to addressing their toughest simulation applications.

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