Step into the future of semiconductor design management with IPLM: Future Forward, a product-led webinar showcasing the latest developments in Perforce IPLM. This focused session is designed to show how modern teams can tackle growing design complexity while still accelerating innovation.
Hosted by IPLM… Read More
In this webinar with eShard, we dive into one of the most pressing questions in the community: Are physical attacks practical against post-quantum schemes in the real world? If yes, how to harden the code or the hardware? We’ll explore:
As 5G and future 6G networks increase RF front-end complexity, acoustic wave filters and RF front-end modules are facing growing demands for higher frequency operation, wider bandwidth, lower losses, better thermal stability and deeper integration. Based on KnowMade’s latest analyses of RF Acoustic Wave Filters and RF … Read More
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In this Synopsys webinar, Intel will present how its disaggregated designs across client and server platforms have driven the evolution of robust 3D multi-die design construction and signoff methodologies. Intel will share practical experience using Synopsys’
In this webinar, Intel will present how EMIB-T (Embedded Multi-die Interconnect Bridge with TSVs) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share a production-oriented EMIB-T reference methodology built … Read More
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Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code.
In this webinar, we will demonstrate… Read More
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Embedded systems programs rarely fail because any one team lacks capability. They fail because critical engineering artifacts drift out of alignment over time and distance.
This includes requirements, architecture, implementation, verification, hardware bring-up, firmware,… Read More
As power integrity challenges increase with advanced nodes and multi-die architectures, EMIR analysis must evolve beyond traditional signoff. In this Synopsys webinar, we will show how RedHawk-SC is expanding its capabilities not only to enhance EMIR analysis, but also to enable IR-aware Static Timing Analysis (IR-STA) … Read More
Dive into the future of Bluetooth audio with Ceva and Dolphin Semiconductor’s breakthrough 12nm Smart Edge AIoT SoC solution.
This webinar shows how advanced wireless connectivity, integrated AI processing, and premium audio technologies and power management come together to deliver superior performance, lower
As semiconductor complexity increases and board designs become denser, manufacturing teams face tighter tolerances, reduced test access, and rising pressure to maintain yield and throughput. Validating RF performance and high-speed digital signal integrity at production scale adds a new layer of complexity that traditional… Read More
