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Oct 27 – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)

Oct 27 – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)
by Daniel Payne on 10-20-2011 at 9:56 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow

DRC Wiki

Graphical DRC vs Text-based DRC

Getting Real time Calibre DRC Results with Custom IC Editing

Transistor-level Electrical Rule Checking

Who Needs a 3D Field Solver for IC Design?

Prevention is BetterRead More


AMS Design at AnSem

AMS Design at AnSem
by Daniel Payne on 10-19-2011 at 3:40 pm

AnSem has been in the AMS design business since 1998 and uses a variety of commercial EDA tools along with internally developed tools and scripts to automate the process of analog design and technology porting. Their IC designers have completed some 40 AMS projects in diverse areas like:

  • RF CMOS
    • LNA, VCO, Mixers
    • Synthesizers
    • Low-IF/Zero-IF
Read More

Apache on the Road

Apache on the Road
by Paul McLellan on 10-19-2011 at 2:01 pm

There are lots of places that Apache is going to popping up in the next few weeks.

Firstly, Andrew Yang will deliver the keynote on October 24th at the Electrical Performance of Electronic Packaging and Systems (EPEPS) in San Jose. He will be talking about “Chip-Package-System convergence: bridging multiple disciplings… Read More


SICAS capacity data loses TSMC and UMC

SICAS capacity data loses TSMC and UMC
by Bill Jewell on 10-19-2011 at 10:26 am

SICAS (Semiconductor Industry Capacity Statistics) has released its 2Q 2011 data with significant changes in membership. The data is available through the SIA at: SICASdata The SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or UnitedRead More


Apple is Giving Samsung Semiconductor A Splitting Headache

Apple is Giving Samsung Semiconductor A Splitting Headache
by Ed McKernan on 10-18-2011 at 5:00 pm

Vertical integration, as I have noted in previous blogs, is the way to domination and maximum profitability. That is unless someone else has beaten you to the punch with an even bettermodel. Apple is now executing a product and manufacturing supplier strategy that will force Samsung to lose lots of money and then ultimately split… Read More


Mentor at the TSMC Open Innovation Platform Ecosystem Forum

Mentor at the TSMC Open Innovation Platform Ecosystem Forum
by Daniel Payne on 10-17-2011 at 3:14 pm

EDA companies and foundries must closely collaborate in order to deliver IC tool flows that work without surprises at the 40nm and 28nm nodes.

Tomorrow in San Jose
you can attend this 4th annual event hosted by TSMC along with Mentor Graphics and other EDA and IP companies.

Here are some of the topics that will interest IC designers… Read More


TSMC Gets Fooled Again!

TSMC Gets Fooled Again!
by Daniel Nenni on 10-16-2011 at 2:51 pm

If you follow the SemiWiki Twitter feed you may have noticed that The Motley Fool (Seth Jayson) did three more articles on TSMC financials. The first Foolish article was blogged on SemiWiki as “TSMC Financial Status and OIP Update”.

The next three Fool Hardy articles look at cash flow (the cash moving in and out of a business), accounts… Read More


Austin and San Jose SCC

Austin and San Jose SCC
by Paul McLellan on 10-14-2011 at 3:35 pm

Don’t forget the SpringSoft Community Conferences next week in Austin on Tuesday and in San Jose on Thursday. There is no charge and you even get a free lunch (see “no such thing as…”).

The morning in Austin is focused on functional closure and how to leverage SpringSoft’s verification technology… Read More


Soft IP Qualification

Soft IP Qualification
by Paul McLellan on 10-14-2011 at 3:10 pm

At the TSMC Open Innovation Platform Ecosystem Forum (try saying that three times in a row) next week (on Tuesday 18th), Atrenta will present a paper on the TSMC soft IP qualification flow. It will be presented by Anuj Kumar, senior manager of the customer consulting group.

More and more, chips are not put together what we think of … Read More


Conclusion of the USB 3.0 IP forecast from IPNEST… complimentary for SemiWiki readers

Conclusion of the USB 3.0 IP forecast from IPNEST… complimentary for SemiWiki readers
by Eric Esteve on 10-14-2011 at 10:40 am

Using the “Diffusion of Innovation” theory, we have built a forecast for the market of USB 3.0 IP in 2011-2015. In this new version of the report, we have inserted the actual revenues generated by USB 3.0 IP from different vendors, for 2009 and 2010, and reworked the 2011-2015 forecast. Initially, we had expected this IP market to … Read More