Enabling the Ecosystem for True Heterogeneous 3D IC DesignsThe demand for higher performance, greater configurability, and…Read More
Why I Think Intel 3.0 Will SucceedProbably one of the most anticipated semiconductor investor…Read More
Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and StartupsJay Vleeschhouwer, Managing Director of Software Research at…Read More
Security Coverage: Assuring Comprehensive Security in Hardware DesignAs hardware systems become increasingly complex and security…Read More
Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC3D IC was a very popular topic at…Read More
Are you a TSMC customer or partner? If so, you’ll want to take a look at these presentations from the 2013 TSMC Open Innovation Platform conference:
I blame it on Henry Ford, William Levitt, and the NY State Board of Regents, among others. We went through a phase with this irresistible urge to stamp out blocks of sameness, creating mass produced clones of everything from cars to houses to students.
Thank goodness, that’s pretty much over. The thinking of simplifying system design… Read More
Traditionally logic devices built on top of thin-film-transistors (TFTs) have used one type of device, either an NMOS a-Si: TFT (hydrogenated amorphous silicon) or a PMOS organic device. Recently a-Si:H and pentacene PMOS TFTs have been integrated into complementary logic structures similar to CMOS. This, in turn, creates… Read More
At TSMC’s latest earnings call held mid January 2014, an analyst asked TSMC for a revenue forecast for their emerging 2.5/3D product line. C.C. Wei, President and Co-CEO answered: “800 Million Dollars in 2016 ”. TSMC has demonstrated great vision many times before. For me, an enthusiastic supporter of this technology, this statement… Read More
By I-o-P, I mean Internet-of-People- I couldn’t think of anything better than this to describe a technology which becomes your custodian for everything you do; you may consider it as your good companion through life or an invariably controlling spy. This is obvious with the embedded sensor techno-products such as Kolibree, a … Read More
I’ve been using SPICE circuit simulators since 1978, both internally and commercially developed, and a lot has changed since the early days where netlists were simulated in batch mode on time-share mainframes. We used to wait overnight for our simulations to complete, and in the morning had to pickup our output results … Read More
There are a few dozen causes of semiconductor failure. Most can be lumped into one of three categories: material defects, process or workmanship issues, or environmental or operational overstress. Even when all those causes are carefully mitigated, one factor is limiting reliability more as geometries shrink – and it… Read More
There is a rumor making the rounds that Altera will leave Intel and return to TSMC. Rumors are just rumors but this one certainly has legs and I will tell you why and what I would have done if I were Altera CEO John Daane. Altera is a great company, one that I have enjoyed working with over the years, but I really think they made a serious mistake… Read More
When we talk about parasitic, we talk about post layout design further expanded in terms of electrical components such as resistances and capacitances. In the semiconductor design environment where multiple parts of a design from different sources are assembled together into highly complex, high density SoC, imagine how complex… Read More
For non-volatile storage in IoT devices, there is technology designed to be reprogrammed many times, and technology designed to be programmed once. The many times mode is for application code, while the once mode is for keying and calibration parameters. We are about to enter the IoT rekeying zone, in between these two extremes.… Read More
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Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside