I’m at the 2015 imec technology forum (ITF) in Brussels the next few days. One of the presentations today was by Peter Wennink, the CEO of ASML. The thing that most interested me in his presentation is what the status of EUV is today. ASML is the only company developing EUV steppers so what they think is important. On the other … Read More




Sonics’ New NoC
Today Sonics announced the latest version of their network-on-chip (NoC) technology, SonicsGN-3.0. As with any new release there are lots of improvements that are of interest mainly to existing users, but the big area with increased capability is the expanded interleaved memory technology (IMT). This was first introduced … Read More
3 Projections About Nokia’s Smartphone Reboot
I have written a book on Nokia’s smartphone problem. The name of the book is Nokia’s Smartphone Problem: The End of an Icon? and it chronicles the Finnish company’s journey from a mobile handset maestro to a smartphone also-ran.
Nokia’s smartphone story began with the launch of the Communicator 900—arguably… Read More
Predicting Lifetime of Analog ICs
With the increase of transistors per unit area, high density interconnects and manufacturing variability at lower nodes, the electronic devices have become more vulnerable to failures. The devices that operate under extreme conditions such as automotive devices that operate at high temperatures need to be robust enough to… Read More
SEMulator3D on Silicon Cloud International
Almost exactly a year ago I wrote about Silicon Cloud International (SCI). Their mission is to help smaller countries that have targeted semiconductor design as a way to move up the technology ladder from low-cost manufacturing. Last year everything was in the future but SCI now have their first two centers up and running. The first,… Read More
GlobalFoundries IBM Deal to Close July 1st!
Probably one of the most awaited semiconductor events is coming next week if the Poughkeepsie Journal is correct, which from what I’m told by my Albany friends, they are. The official announcement was made last October using the slide deck which can be found HERE. It was originally thought that the approval process would take a year… Read More
Unlock the Key to Ultra-Low Power Design
We have been hearing about low power for a long time. Fortunately, low power chip operation has come about through a large number of innovations. Key among these is clock gating, frequency and voltage scaling, managing leakage with lower threshold voltage, HKMG, and many other techniques. But we are entering the age of ultra low… Read More
An Universe of Formats for IP Validation
Although I knew about Crossfire’s capabilities for signing off quality of an IP before its integration into an SoC, there was much more to learn about this tool when I visited Fractal Technologies booth during this DAC. The complexity handled by this tool to qualify any type of IP for its integration into an SoC can be imagined by the… Read More
IBM Design Tools in the Cloud: Big News or Old News?
One announcement that I missed coming up to the Design Automation Conference last week was that SiCAD is hosting a portfolio of IBM’s design automation tools in the cloud. Supposedly these are priced half the cost of similar capability from Cadence, Synopsys and Mentor. So should the big three be worried? Is this an earth-shattering… Read More
Solido Has Perfected the Emerging EDA Company Business Model!
Last year at #51DAC we gave away more than a thousand printed versions of our book “Fabless: The Transformation of the Semiconductor industry.” This year we gave away pens with a light and stylus. My friends at Solido Design gave away 600 pens in their booth and we gave away another 400 at our DAC reception on Wednesday night. Solido… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot