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eSilicon Bucking the Trend at OFC with 7nm SerDes

eSilicon Bucking the Trend at OFC with 7nm SerDes
by Daniel Nenni on 03-11-2019 at 8:00 am

A recent press release from eSilicon caught my eye. The company has been touting their 7nm SerDes quite a bit lately – reach, power, flexibility, things like that. While those capabilities are important, any high-performance chip needs to work in the context of the system, which usually contains technology from multiple sources.… Read More


Ultra low-power Analog Design using a Multi-Project Wafer approach

Ultra low-power Analog Design using a Multi-Project Wafer approach
by Daniel Payne on 03-10-2019 at 1:00 pm

On SemiWiki we often talk about bleeding-edge technology like 7nm, 5nm or even 3nm, but for analog IC designs there’s a low-cost alternative to getting your ideas validated and prototyped without taking out a multi-million dollar loan, and that’s through the use of Multi-Project Wafers (MPW). Starting with a mature… Read More


Lyft IPO Paints Perilous Profitless Picture

Lyft IPO Paints Perilous Profitless Picture
by Roger C. Lanctot on 03-10-2019 at 8:00 am

Lyft’s S1 filing for its IPO is a sobering read, as such documents often are, requiring, as they do, the full disclosure of current financial circumstances and, everyone’s favorite: risk factors. Lyft identifies 18 risk factors (below) which could interfere with the long-term success of the operation. I think there are more.… Read More


Data Centers and AI Chips Benefit from Embedded In-Chip Monitoring

Data Centers and AI Chips Benefit from Embedded In-Chip Monitoring
by Daniel Payne on 03-08-2019 at 12:00 pm

Webinars are a quick way to come up to speed with emerging trends in our semiconductor world, so I just finished watching an interesting one from Moortec about the benefits of embedded in-chip monitoring for Data Center and AIchip design. My first exposure to a data center was back in the 1960s during an elementary school class where… Read More


Arm Deliver Their Next Step in Infrastructure

Arm Deliver Their Next Step in Infrastructure
by Bernard Murphy on 03-08-2019 at 7:00 am

Arm announced their Neoverse plans not long ago at TechCon 2018. Neoverse is a brand, launched by Arm, to provide the foundations for cloud to edge infrastructure in support of their vision of a trillion edge devices. To a cynic this might sound like marketing hype. Sure, they’re widely used in communications infrastructure and… Read More


Newer cryptocurrencies highlight need for agile mining strategies

Newer cryptocurrencies highlight need for agile mining strategies
by Tom Simon on 03-07-2019 at 12:00 pm

Cryptocurrencies represent a radical departure from traditional forms of money. Currencies like Bitcoin, Etherium and Monero offer many unique advantages over traditional currencies, and are changing how money is created and used. Bitcoin, the pioneer of cryptocurrencies, relies on pure computational power for so-called… Read More


Intelligent Electronic Design Exploration with Large System Modeling and Analysis

Intelligent Electronic Design Exploration with Large System Modeling and Analysis
by Camille Kokozaki on 03-07-2019 at 7:00 am

At the recent DesignCon 2019 in Santa Clara, I attended a couple of sessions where Cadence and their research partners provided some insight on machine learning/AI and on large system design analysis; with the first one focused on real-world cloud & machine learning/AI deployment for hardware design and the second one focused… Read More


PCIe 5.0 Jumps to the Fore in 2019

PCIe 5.0 Jumps to the Fore in 2019
by Tom Simon on 03-06-2019 at 12:00 pm

2019 will be a big year for PCIe. With the approval of version 0.9 of the Base Layer for PCIe 5.0, implementers have a solid foundation to begin working on designs. PCIe 4.0 was introduced in 2017, before that the previous PCIe 3.0 was introduced in 2010 – ages ago in this industry. In fact, 5.0 is so close on the heels of 4.0, many products… Read More


Mentor Showcases Digital Twin Demo

Mentor Showcases Digital Twin Demo
by Bernard Murphy on 03-06-2019 at 6:00 am

Mentor put on a very interesting tutorial at DVCon this year. Commonly DVCon tutorials center around a single tool; less commonly (in my recent experience) they will detail a solution flow but still within the confines of chip or chip + software design. It is rare indeed to see presentations on a full system design including realistic… Read More


A Preview of Spring Symposium on AIoT

A Preview of Spring Symposium on AIoT
by Alex Tan on 03-05-2019 at 12:00 pm

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The trend of AI augmentation into many facets of silicon based hardware applications is on the rise. During the CASPA press conference in Santa Clara last week, Silvaco CEO David Dutton and SiFive VP, GM Christopher Moezzi were present to share their insights.

Silvaco CEO David Dutton mentioned that we are in new era in which manyRead More