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Overview Physical design constraints become a lot more complicated in the advanced nodes, leading to the exponential growth of design rules while adding complexity. Decreasing the active device sizes and higher geometry densities results in increased design rule check (DRC) run time, a big metal fill impact on chip functionality, and greater antenna sensitivity of …
August 26, 2021 Overview Power integrity (PI) engineers have been running Cadence®Sigrity™ tools to perform DC, AC, and power-ripple analysis for decades. Sigrity X technology is recognized by the industry as simply the best to ensure that sufficient, efficient, and stable power is delivered to the components in your design. Most Sigrity customers have in their tool chest a PI bundle …
Time: August 31, 2021 11:30 AM EDT / 4:30 PM BST / 9 PM IST Venue: Online About this Webinar As semiconductors move into the wafer-scale chip and chiplet era, there is increased focus on the power thermal and reliability area. One of the key aspects of reliability is ESD. While this phenomenon is understood …
Date: Tuesday, September 20, 2022 Time: 10:00 - 11:00 (CEST) Electromigration (EM) impacts design reliability, causing failures over time. That is why it’s important to analyze both the power mesh and signal wires to check that the average, rms, or peak currents will not lead to a permanent failure. Learn how the Cadence Voltus IC Power …
Date: 2023 .02. 17 (Thursday) Time: 14:00pm - 15:00pm (Taipei Time) Wondering how to accelerate your design closure? The Cadence Certus Closure Solution is the industry's first fully automated and massively distributed environment for full-chip optimization and signoff. It delivers up to 10X concurrent chip-level optimization and signoff. Furthermore, it supports the high-capacity requirements of …
Date: Thursday, April 27, 2023 Time: 10:00am PT/1:00pm ET Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal …
Title: WEBINAR l System-Level Thermal Signoff from Chips Through to Racks Date: Wednesday, October 18, 2023 Time: 10:00 AM Eastern Daylight Time Duration: 45 minutes Summary Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive …
Synopsys Corporate Headquarters
675 Almanor Ave, Sunnyvale, CA, United States
Must Attend Event Join us for the Signoff Special Interest Group (formerly PrimeTime SIG) in-person event on November 2, 2023 in Sunnyvale, CA. This technical event will supercharge your design closure process and empower you to tackle the most intricate design challenges. This year’s event will have two dedicated tracks. Track one - Signoff, will …
Crowne Plaza Beijing New Yunnan
Yunnan Building, No. 12 Qisheng Middle Street, Northeast Third Ring Road, Beijing, Chaoyang District, China
Digital Design and Signoff Seminar Conference introduction Cadence, a leading supplier in the field of electronic design automation, sincerely invites you to participate in the "2023 Cadence China Technology Tour Seminar". The conference will bring together Cadence developers and senior technical experts to share digital design and signoff solutions with you, and communicate directly with technical …
Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment can uncover SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, design teams can achieve efficient signoff of …
Webinar Series: What's New About Virtuoso Layout Suite How can you get the most out of your Virtuoso layout tools? How much do you know about the new layout features in Virtuoso Studio? Join our four-part webinar series and learn how Cadence has reinvented the industry-leading Virtuoso Layout Suite, supporting heterogeneous integration, accelerating tool performance, …
Date: Thursday, April 25, 2024 Time: 14:00pm (Taipei Time) Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment can uncover SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, …
