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A PI Engineer’s Guide to Up-Leveled Signoff Methodology

August 26, 2021

August 26, 2021


Power integrity (PI) engineers have been running Cadence®Sigrity™ tools to perform DC, AC, and power-ripple analysis for decades.  Sigrity X technology is recognized by the industry as simply the best to ensure that sufficient, efficient, and stable power is delivered to the components in your design.  Most Sigrity customers have in their tool chest a PI bundle package known as Sigrity Advanced PI.

This webinar will show you how the best just got better.  To up-level your signoff methodology, Cadence has expanded on the thermal-aware features in Sigrity Advanced PI and now offers a package for PI engineers that adds transient thermal analysis along with the ability to add an enclosure onto your design to see the 3D thermal impact.  An optional computational fluid dynamics (CFD) engine can be added to see the impact from air flow. The Celsius Thermal Solver’s advanced PTI along with Sigrity System PI will enable you to be a more efficient power (and thermal) integrity engineer.


  • Overview of Cadence power and thermal integrity technology
  • Benefits of combined power/thermal workflow
  • New Sigrity System PI workflow capabilities
  • Cadence power/thermal signoff methodology insight
  • Summary
  • Q&A

Date and Time

Thursday, August 26, 2021
10:00 AM PDT/ 1:00 PM EDT

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