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What’s next in test compression?

What’s next in test compression?
by Beth Martin on 10-10-2014 at 4:45 pm

 If you’ll be at ITC TestWeek in Seattle (Oct 20-23), here’s one event you don’t want to miss: a technology reception hosted by Mentor, with Janusz Rajski and Nilanjan Mukherjee as the featured speakers. It is free to ITC attendees and you can register here. [If for some crazy reason you haven’t registered for ITC yet, do that here.]

If you are involved with DFT, you’ll recognize Rajski as the inventor of the embedded deterministic test (EDT) technology that is the basis for ATPG compression. He is a chief scientist and the director of engineering, but you can think of him as Mr. Compression. Mukherjee is the engineering director for the test synthesis group at Mentor Graphics.

EDT has scaled to 100x compression, but new technology nodes and new fault models targeting defects within standard cells are driving the need for even greater compression levels. Rajski and Mukherjee will introduce a novel technology they developed specifically to work with embedded compression to further reduce pattern volume for compressed patterns. You will also learn how Mentor’s customers are using this new technology.

The presentation starts at 7:00pm and should last 40 minutes. After that, they will open the bar, pass the finger foods, and turn on the disco ball. Actually, I made up the disco ball part. See you there!

What: Seminar and Reception, The Next Big Thing in Test Compression (Register)
When: Monday, October 20.
6:45pm Doors open
7:00pm Presentation begins
7:40pm Drinking and dancing begins

Where: WSCC North Galleria, Room 2B

International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.


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