Atos Crafts NoC, Pad Ring, More Using Defacto

Atos Crafts NoC, Pad Ring, More Using Defacto
by Bernard Murphy on 05-21-2020 at 6:00 am

Mont Blanc

I’ve talked before about how Defacto provides a platform for scripted RTL assembly. Kind of a rethink of the IP-XACT concept but without need to get into XML (it works directly with SV), and with a more relaxed approach in which you decide what you want to automate and how you want to script it.

They’re hosting a webinar on May 28th 10-11am… Read More


DFT Innovations Come from Customer Partnerships

DFT Innovations Come from Customer Partnerships
by Tom Simon on 05-05-2020 at 10:00 am

Mentro Tessent Innovation

There is an adage that says that quality is not something that can be slapped on at the end of the design or manufacturing process. Ensuring quality requires careful thought throughout development and production. Arguably this adage is more applicable to the topic of Design for Test (DFT) than almost any other area of IC development… Read More


Bringing Hierarchy to DFT

Bringing Hierarchy to DFT
by Tom Simon on 01-30-2020 at 6:00 am

Tessent Hierarchical Flow

Hierarchy is nearly universally used in the SoC design process to help manage complexity. Dealing with flat logical or physical designs proved unworkable decades ago. However, there were a few places in the flow where flat tools continued to be used. Mentor lead the pack in the years around 1999 in helping the industry move from … Read More


Seminar: Mentor Forum for Tessent DFT 2019 India

Seminar: Mentor Forum for Tessent DFT 2019 India
by Daniel Payne on 09-17-2019 at 9:00 am

Mentor - A Siemens Business

Overview

Test for the Autonomous Age

The seminar will focus on three key test challenges IC vendors face as they try to make the promises of the autonomous age a reality.

  • Implementing DFT on the very large designs and new compute architectures that are required for efficient AI and machine learning
  • Achieving high test quality and
Read More

Can a hierarchical Test flow be used on a flat design?

Can a hierarchical Test flow be used on a flat design?
by Tom Simon on 08-15-2019 at 10:00 am

It is pretty common for physical layout to work from a flattened hierarchy for blocks or even full chips, even though the front-end design starts with a hierarchical representation. This was not always the case. Way back when, the physical layout matched the logical hierarchy during the design process. Of course, this led to all… Read More


How to be Smart About DFT for AI Chips

How to be Smart About DFT for AI Chips
by Tom Simon on 01-31-2019 at 12:00 pm

We have entered the age of AI specific processors, where specialized silicon is being produced to tackle the compute needs of AI. Whether they use GPUs, embedded programmable logic or specialized CPUs, many AI chips are based on parallel processing. This makes sense because of the parallel nature of AI computing. As a result, in… Read More


The Pain of Test Pattern Bring-up for First Silicon Debug

The Pain of Test Pattern Bring-up for First Silicon Debug
by Daniel Payne on 08-22-2018 at 7:00 am

In the semiconductor world we have divided our engineering talent up into many adjacent disciplines and each comes with their own job titles: Design engineers, Verification engineers, DFT engineers, Test engineers. When first silicon becomes available then everyone on the team, and especially management all have a few big … Read More


Mentor Tessent MissionMode Provides Runtime DFT for Self-Correcting Automotive ICs

Mentor Tessent MissionMode Provides Runtime DFT for Self-Correcting Automotive ICs
by Mitch Heins on 02-22-2018 at 12:00 pm

The automotive industry continues push the limits on how “smart” we can make our vehicles and from that, it follows as to how smart we can make the electronics in the vehicles. When I think of smart cars (and smart automotive ICs) I typically think of things like advanced driver-assistance systems (ADAS) that use AI and neural networks… Read More


Mentor Tessent Products Ready for Second Edition of ISO 26262 Coming in March 2018

Mentor Tessent Products Ready for Second Edition of ISO 26262 Coming in March 2018
by Mitch Heins on 01-17-2018 at 7:00 am

Have you notice how smart your automobile is getting? Watching the first round of NFL playoffs I lost count on the number of TV commercials showing cars weaving through tight construction zones (and Star Wars figures), big trucks parking in incredibly tight spaces, cars avoiding rear-end collisions and pedestrians, and even … Read More


Finding Transistor-level Defects Inside of Standard Cells

Finding Transistor-level Defects Inside of Standard Cells
by Daniel Payne on 01-31-2017 at 12:00 pm

In the earliest days of IC design the engineering work was always done at the transistor-level, and then over time the abstraction level moved upward to gate-level, cell-level, RTL level, IP reuse, and high-level modeling abstractions. The higher levels of abstraction have allowed systems to be integrated into an SoC that can… Read More