ISTFA 2022

48th International Symposium for Testing and Failure Analysis

The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, for latest technologies in nano realm, a new set of disruptive development in new structures and novel materials was introduced. Thus, defects causing semiconductor device failures have become smaller and more elusive. To chase such defects, all failure analysis techniques and methodologies also need to be improved to keep pace with semiconductor technology. Failure characterization, fault isolation, electrical failure analysis, physical analysis, microscope imaging and materials analysis are examples of the key challenged areas. A gap analysis has been done by the EDFAS FA Technology Roadmap Committee and is available on ASM connect. To close the gap, you can play a role, no matter what your area of expertise is.

Share your experiences and stories of chasing the ever-smaller and more elusive defects at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. We invite you to join us in Pasadena, California, at the 48th year of ISTFA.

REGISTER HERE