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The challenges of 7nm are well documented. Lithography artifacts create exploding design rule complexity, mask costs and cycle time. Noise and crosstalk get harder to deal with, as does timing closure. The types of applications that demand 7nm performance will often introduce HBM memory stacks and 2.5D packaging, and that creates… Read More
Artificial intelligence, or AI is really heating up these days. The technology has been around for decades, but of late it is becoming quite a focus for applications such as data center analytics, autonomous vehicles and augmented reality. Why the rebirth? The trend appears to be driven by two forces – availability of data to train… Read More
In 1969 the Internet was born at UCLA when a computer there sent a message to a computer at Stanford. By 1975, there were 57 computers on the ‘internet’. Interestingly in the early seventies I actually used the original Xerox Sigma 7 connected to the internet in Boelter Hall at UCLA. A similar vintage computer is now in this room commemorating… Read More
The first transistor was made of two electrodes, held in place by plastic, making contact with a piece of doped germanium. Ever since then, devices and their packaging have been performing a complicated and oftentimes intricate dance. Single transistor devices became integrated circuits, and along the way separate IC’s were… Read More
As you all know I’m a big fan of the ASIC business dating back to the start of the fabless semiconductor transformation where anybody could send a design spec to an ASIC company and get a chip back. The ASIC business model also started the smart phone revolution when Samsung built the first Apple SoCs for the iPhones and iPads.
Today … Read More
eSilicon presented their advanced ASIC design capabilities at a seminar last Wednesday evening. This event was closed to the press, bloggers and analysts, but I managed to get some details from a friend who attended. The event title was: “Advanced ASICs for the Cloud-Computing Era: Succeeding with 56G SerDes, HBM2, 2.5D and FinFET… Read More
I recently spoke with Jack Harding, CEO of eSilicon Corporation and Duy-Loan Le, one of eSilicon’s Board members about eSilicon’s progress in Vietnam, a large design location for the company. eSilicon also gives back in the region through its association with Sunflower Mission, a U.S. based non-profit organization that is committed… Read More
With memories taking up in some cases over 50% of the area of many ASIC designs, their selection and implementation can affect everything from power and timing to the choice of packaging. As a result, the process of deciding among all the options for ASIC memories becomes time and energy intensive. Memory selection even affects … Read More
Knowledge is power, and I’ve seen the trend over time of people getting more and deeper access to knowledge as each year goes by. I remember, as a student in high school back the in 70’s, the first time I wanted to buy stock in a company. You could only get a quote by calling a broker or visiting the broker’s office. Today you can get real … Read More
If you are building an advanced SoC, you know that you’re going to need a lot of embedded memory. Unless this is your first rodeo, you also know that which memories you choose can have a huge impact on Power, Performance and Area (PPA) and, for some applications, Energy (power integrated over time), Temperature and Reliability. Which… Read More
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